Intel corporation (20240258296). MICROELECTRONIC ASSEMBLIES
MICROELECTRONIC ASSEMBLIES
Organization Name
Inventor(s)
Adel A. Elsherbini of Chandler AZ US
Georgios Dogiamis of Chandler AZ US
Shawna M. Liff of Scottsdale AZ US
Johanna M. Swan of Scottsdale AZ US
MICROELECTRONIC ASSEMBLIES
This abstract first appeared for US patent application 20240258296 titled 'MICROELECTRONIC ASSEMBLIES
Original Abstract Submitted
microelectronic assemblies, related devices and methods, are disclosed herein. in some embodiments, a microelectronic assembly may include a package substrate having a surface; a first die, having opposing first and second surfaces, in a first dielectric layer, wherein the first dielectric layer is between a second dielectric layer and the surface of the package substrate, and the first surface of the first die is coupled to the surface of the package substrate; a second die, having opposing first and second surfaces, in the second dielectric layer, and wherein the second dielectric layer is between the first dielectric layer and a third dielectric layer; a third die, having opposing first and second surfaces, in the third dielectric layer, wherein the first surface of the third die is coupled to the surface of the package substrate by a conductive pillar; and a conductive, radio frequency shield structure surrounding the conductive pillar.