Murata Manufacturing Co., Ltd. patent applications on January 9th, 2025
Patent Applications by Murata Manufacturing Co., Ltd. on January 9th, 2025
Murata Manufacturing Co., Ltd.: 37 patent applications
Murata Manufacturing Co., Ltd. has applied for patents in the areas of H01G4/30 (9), H01G4/12 (8), H01G4/008 (7), H01G4/232 (6), H03H9/02 (5) H01G4/30 (3), H01G4/2325 (2), A61M16/0066 (1), H03H3/02 (1), H01M50/242 (1)
With keywords such as: electrode, portion, layer, direction, surface, layers, including, internal, end, and body in patent application abstracts.
Patent Applications by Murata Manufacturing Co., Ltd.
20250010002. CPAP DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Hiroki MAEDA of Kyoto (JP) for murata manufacturing co., ltd., Atsushi HATTORI of Kyoto (JP) for murata manufacturing co., ltd., Yoshio YAMANAKA of Kyoto (JP) for murata manufacturing co., ltd., Yoshiro KONISHI of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): A61M16/00
CPC Code(s): A61M16/0066
Abstract: a blower of a cpap device is housed inside a main body case of a cpap device. the blower is roughly divided into a fan unit housing a fan therein, and a delivery tube, through which air sent from the fan passes. in the main body case, a first support member, a second support member, and a third support member are interposed between the main body case and the fan unit to support the fan unit. when viewed from a rotation axis of the fan, the first support member and the second support member are disposed to pinch the blower on the side of a connection point between the fan unit and the delivery tube relative to the rotation axis, and the third support member is located on the opposite side to the connection point between the fan unit and the delivery tube relative to the rotation axis.
20250010577. MULTILAYER SUBSTRATE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Nobuo IKEMOTO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Keiichi ICHIKAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Kentarou KAWABE of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): B32B7/03, B32B15/08, B32B15/20
CPC Code(s): B32B7/03
Abstract: in a multilayer substrate, a second multilayer body is positioned in a positive direction of a z-axis of a first multilayer body. the second multilayer body is fixed to the first multilayer body via a first insulator layer bonded to a second insulator layer. regions obtained by dividing the first multilayer body into three equal portions in the z-axis direction are defined as a positive region, an intermediate region, and a negative region. a portion of one or more positive region first conductor layers is located in the positive region. an entirety of one or more intermediate region first conductor layers is located in the intermediate region. a thickness in the z-axis direction of at least one of the one or more positive region first conductor layers is larger than the thickness in the z-axis direction of the one or more intermediate region first conductor layers.
Inventor(s): Jusuke SHIMURA of Kyoto (JP) for murata manufacturing co., ltd., Kinichi ITO of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): G01R31/392, G01R31/3842
CPC Code(s): G01R31/392
Abstract: a power supply device is provided and includes a secondary battery, an electric circuit, and a measurer. the electric circuit performs charging or discharging of the secondary battery. the measurer measures a voltage and a current of the secondary battery. the power supply device further includes a calculator and a deriver. the calculator performs calculation of multiple degradation parameters of the secondary battery based on measurement values obtained by the measurer. the deriver derives a secondary use destination of the secondary battery based on the multiple degradation parameters obtained by the calculation performed by the calculator and respective degradation rates of the multiple degradation parameters set for each of secondary use destination candidates.
Inventor(s): Tomoshige FURUHI of Kyoto (JP) for murata manufacturing co., ltd., Takashi WATANABE of Kyoto (JP) for murata manufacturing co., ltd., Takashi HAGA of Kyoto (JP) for murata manufacturing co., ltd., Takehiko IIZUKA of Kyoto (JP) for murata manufacturing co., ltd., Nobuyuki NOZAWA of Kyoto (JP) for murata manufacturing co., ltd., Jun MAKINO of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): G06F30/10, G06F17/16
CPC Code(s): G06F30/10
Abstract: an arithmetic circuit according to the present disclosure performs a signal value acquisition step of acquiring x-axis bending values, y-axis bending values, and twisting values at respective one or more first times before an impact time identified in a time identification step and at respective one or more second times after the impact time; and a first calculation step of calculating one or more parameters indicating a state of an object to be measured at the impact time by multiplying a plurality of the x-axis bending values, a plurality of the y-axis bending values, and a plurality of the twisting values acquired in the signal value acquisition step by a matrix.
20250014789. CHIP-TYPE ELECTRONIC COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Masakiyo NAGATOMO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Keisuke ISOGAI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Naoaki ABE of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Hikaru UEGAKI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Yoshinobu SAKI of Nagaokakyo-shi, Kyoto-fu (JP) for murata manufacturing co., ltd.
IPC Code(s): H01C7/02, H01C1/14
CPC Code(s): H01C7/027
Abstract: a chip-type electronic component that includes: a ceramic body having a volume v of 0.12 mmor less, wherein the ceramic body comprises: a perovskite compound containing ti and ba, and at least si, and wherein an si content in the ceramic body satisfies: 0 mol %<[si]≤0.62 mol %, where [si] is the si content (mol %) per 100 mol % of a total content of elements in the ceramic body excluding oxygen.
Inventor(s): Hiroshi MARUSAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01F41/02, B22F1/08, B22F1/12, B22F1/16, B22F10/28, B33Y10/00, B33Y70/10, H01F1/147
CPC Code(s): H01F41/0246
Abstract: a method for manufacturing a magnetic core includes a step of melting a raw material powder, comprising a soft magnetic metal powder and an agglomeration inhibitor, using laser irradiation or electron beam sweeping, and then solidifying the melt, thereby forming a three-dimensional magnetic composite.
20250014818. MULTILAYER CERAMIC CAPACITOR_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Hironori TSUTSUMI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Mitsuru IKEDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Akihiro YOSHIDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takayuki SHIMAKAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/008, H01G4/12, H01G4/232, H01G4/248, H01G4/30
CPC Code(s): H01G4/008
Abstract: a multilayer ceramic capacitor includes an element body portion including internal electrode layers, and first and second external electrodes. in the internal electrode layers, a width of an opposing portion is larger than a width of a lead-out portion, each of the first and second external electrodes includes a cu layer on the element body portion including first and second layer portions. the first layer portion has a higher cu content than the second layer portion, the second layer portion has a higher glass content than the first layer portion. the cu in the first layer portion is continuous to connect lead-out portions adjacent to each other. in a cross section of the second layer portion extending through a central portion in the width direction and parallel to the thickness and length directions, the glass occupies about 25% or more of an area of the second layer portion.
20250014819. MULTILAYER CERAMIC CAPACITOR_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Takaaki BABA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/008, H01G4/12, H01G4/232, H01G4/30
CPC Code(s): H01G4/0085
Abstract: a multilayer ceramic capacitor includes a laminate including dielectric layers and internal electrode layers, first and second main surfaces, first and second side surfaces, and first and second end surfaces, and external electrodes covering the first and second end surfaces, respectively, and connected to the internal electrode layers. the internal electrode layers are divided into m groups each including n internal electrode layers. a total number of internal electrode layers included in the first to m-th groups is 1,000 or more. a thickness of the dielectric layer is about 0.8 �m or more. in at least one set of an m-th group and an (m+1)-th group, a deviation amount �1 is less than a deviation amount �1. in the m-th group and the (m+1)-th group, a deviation amount �2 is less than a deviation amount �2.
20250014820. MULTILAYER CERAMIC CAPACITOR_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Hironori TSUTSUMI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Mitsuru IKEDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Akihiro YOSHIDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takayuki SHIMAKAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/012, H01G4/008, H01G4/232, H01G4/30
CPC Code(s): H01G4/012
Abstract: a multilayer ceramic capacitor includes an element body portion including dielectric layers and internal electrode layers, and external electrodes. in a cross section of the element body portion extending through a central portion in a length direction, a deviation amount in a width direction between internal electrode layers adjacent to each other in a thickness direction is smaller than about 3 �m, each of the internal electrode layers includes an opposing portion opposed to the internal electrode layer, and a lead-out portion, a width of the opposing portion is greater than a width of the lead-out portion, a region of the element body portion where the lead-out portions overlap in the thickness direction includes a thick portion thicker than the central portion in the length direction, and end portions of the lead-out portions in the thickness direction deviate by about 3 �m or more in the width direction.
20250014821. MULTILAYER CERAMIC CAPACITOR_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Hironori TSUTSUMI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Mitsuru IKEDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Akihiro YOSHIDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takayuki SHIMAKAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/12, H01G4/005, H01G4/232, H01G4/30
CPC Code(s): H01G4/1218
Abstract: dielectric layers include outer dielectric layers and inner dielectric layers. the outer dielectric layers are located between a first principal surface and an internal electrode layer located closest to the first principal surface in a thickness direction and between a second principal surface and an internal electrode layer located closest to the second principal surface in the thickness direction. the inner dielectric layers are located between internal electrode layers adjacent to each other in the thickness direction. in an element body portion, side margin portions, which are located in a width direction between a first side surface and a plurality of internal electrode layers and between a second side surface and a plurality of internal electrode layers, have a higher mn content than the inner dielectric layers.
20250014823. FILM CAPACITOR_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Shoji OKA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/224, H01G4/236, H02M7/00
CPC Code(s): H01G4/224
Abstract: a film capacitor including: a capacitor element including a laminate of a dielectric film and an internal electrode, a first end surface electrode on a first end surface of the laminate, and a second end surface electrode on a second end surface of the laminate; a laminate film including a covering part covering the capacitor element, and a flange extending from an outer edge of the covering part; a first terminal electrode connected to the first end surface electrode inside the laminate film and exposed outside of the laminate film, and a second terminal electrode connected to the second end surface electrode inside the laminate film and exposed outside of the laminate film; and a fixing member including a main body disposed along the capacitor element inside the laminate film, and a fixing part extending from the main body and exposed to the outside of the laminate film.
20250014827. MULTILAYER CERAMIC CAPACITOR_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Junichi KAWASAKI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/232, H01G4/12, H01G4/30
CPC Code(s): H01G4/2325
Abstract: a multilayer ceramic capacitor includes a multilayer body, and first and second external electrodes. the multilayer body further includes an extended dielectric portion extending from at least one of a first side margin portion and a second side margin portion to cover only a portion of an inner layer portion at at least one of a first end surface and a second end surface.
20250014828. MULTILAYER CERAMIC CAPACITOR_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Hironori TSUTSUMI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Mitsuru IKEDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Akihiro YOSHIDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takayuki SHIMAKAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/232, H01G4/008, H01G4/12, H01G4/224, H01G4/30
CPC Code(s): H01G4/2325
Abstract: an external electrode includes a base electrode layer, a ni plating layer, and a sn plating layer. the base electrode layer is provided on an element body portion. the ni plating layer is provided above the base electrode layer. the sn plating layer is provided on the ni plating layer. the base electrode layer includes ni as a primary component and a dielectric material.
20250014829. MULTILAYER CERAMIC CAPACITOR_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Hironori TSUTSUMI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Mitsuru IKEDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Akihiro YOSHIDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takayuki SHIMAKAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/30, H01G4/008, H01G4/12
CPC Code(s): H01G4/30
Abstract: a multilayer ceramic capacitor includes an element body portion including dielectric layers and internal electrode layers laminated in a thickness direction, and external electrodes respectively on first and second end surfaces and electrically connected to the internal electrode layers. each of the internal electrode layers includes an opposing portion opposed to another internal electrode layer, and a lead-out portion connected to the opposing portion and extending to the first or second end surface, a width of the opposing portion is larger than a width of the lead-out portion in the width direction, and a relationship of c>c is satisfied when a continuity of an end portion of the opposing portion in the width direction is defined as c and a continuity of an end portion of the lead-out portion in the width direction is defined as c
20250014830. MULTILAYER CERAMIC CAPACITOR_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Hironori TSUTSUMI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Mitsuru IKEDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Akihiro YOSHIDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takayuki SHIMAKAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/30, H01G4/008, H01G4/12
CPC Code(s): H01G4/30
Abstract: a multilayer ceramic capacitor includes an element body portion including dielectric layers and internal electrode layers including ni, and external electrodes. in each internal electrode layer, a width of an opposing portion is larger than a width of a lead-out portion. the element body portion includes side margin portions extending from both end portions of the opposing portion to first and second side surfaces, through a central portion in a length direction, and parallel or substantially parallel to a thickness direction and a width direction. a dielectric layer between adjacent internal electrode layers in the thickness direction includes grains including pores. each of the side margin portions includes a dielectric including grains that do not include pores.
20250014831. MULTILAYER CERAMIC CAPACITOR_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Hironori TSUTSUMI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Mitsuru IKEDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Akihiro YOSHIDA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takayuki SHIMAKAWA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/30, H01G4/008, H01G4/12
CPC Code(s): H01G4/30
Abstract: a multilayer ceramic capacitor includes an element body portion including dielectric layers and internal electrode layers including ni laminated in a thickness direction. in the internal electrode layers, a width of an opposing portion is larger than a width of a lead-out portion. the element body portion includes first, second, and third regions in order from an inside to an outside in the width direction in each of a region from an end portion on one side of the lead-out portion in the width direction to the first side surface and a region from an end portion on another side of the lead-out portion to the second side surface. when grain sizes of dielectrics included in the first, second, and third regions are respectively defined as gr, gr, and gr, a relationship of gr<gr<gr is satisfied.
20250014833. ELECTRONIC COMPONENT_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Shota ANDO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Toshiyuki NAKAISO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01G4/33, H01G4/005
CPC Code(s): H01G4/33
Abstract: an electronic component including: a semiconductor substrate; a dielectric layer adjacent a surface of the semiconductor substrate; a first internal electrode electrically connected to the semiconductor substrate; a second internal electrode adjacent a surface of the dielectric layer; an insulator layer adjacent the surface of the semiconductor substrate and covering the first internal electrode and the second internal electrode; a first extended electrode electrically connected to the first internal electrode; a second extended electrode electrically connected to the second internal electrode, wherein when viewed in a direction perpendicular to a plane of the semiconductor substrate, the second extended electrode is inside the second internal electrode; a first external electrode electrically connected to the first extended electrode; and a second external electrode electrically connected to the second extended electrode.
Inventor(s): Shota ANDO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01L23/532, H01L23/522
CPC Code(s): H01L23/53295
Abstract: an electronic component including: a semiconductor substrate; an insulator layer on a first surface of the semiconductor substrate; a plurality of conductor layers on and/or in the insulator layer; a dielectric layer on the first surface of the semiconductor substrate; a lower surface electrode on a second surface of the semiconductor substrate, wherein: at least a first conductor layer of the plurality of conductor layers is a wiring pattern, at least a second conductor layer of the plurality of conductor layers is a plate electrode paired with the semiconductor substrate or the lower surface electrode across the dielectric layer, and the semiconductor substrate has a first region that includes the dielectric layer and the plate electrode and a second region other than the first region; and a conductor portion with higher conductivity than the semiconductor substrate in the first region at a higher ratio than in the second region.
Inventor(s): Atsushi ONO of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01L23/66, H01L23/00, H01L25/065, H01L25/10
CPC Code(s): H01L23/66
Abstract: in an ic chip, a control unit is connected to at least one of a first switch unit and a second switch unit. in plan view from a thickness direction of a substrate, a plurality of first terminals are located between the first switch unit and the second switch unit in a first direction, and are arranged in a line in a second direction intersecting with the first direction. in plan view from the thickness direction of the substrate, a plurality of second terminals are located between the plurality of first terminals, and the first switch unit or the second switch unit, and are arranged in a line in the second direction. the plurality of first terminals include at least one control terminal among a plurality of control terminals connected to the control unit. the plurality of second terminals include a ground terminal.
20250015029. MULTI-DIE-TO-WAFER HYBRID BONDING_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Sinan GOKTEPELI of Austin TX (US) for murata manufacturing co., ltd., Kouassi Sebastien KOUASSI of San Diego CA (US) for murata manufacturing co., ltd., Shishir RAY of San Diego CA (US) for murata manufacturing co., ltd., Anil KUMAR of San Diego CA (US) for murata manufacturing co., ltd.
IPC Code(s): H01L23/00, H01L25/065, H01L27/092, H01L29/16, H01L29/20
CPC Code(s): H01L24/08
Abstract: integrated circuit structures and methods for a high precision die-to-wafer bonding technology for fabricating 3-d stacked ic dies. embodiments include precise alignment structures and methods, and also provide fast fabrication techniques using simultaneous multi-die picking and placing of individual dies from a die-source wafer onto a recipient wafer. stacked-die yields are improved over wafer-to-wafer bonding technologies by enabling testing and selection of known-good die-source dies before bonding onto the recipient wafer, and by providing optional physical alignment structures on the recipient wafer and/or die-source wafer. embodiments enable, for example, fabrication of high-power, high-performance devices on ics formed on gaas or gan die-source wafers and bonding individual die-source ic dies to ics that include cmos control and driver circuitry formed on an soi recipient wafer. the resulting 3-d stacked ic dies may offer advantages that include scalability, reliability, and form-factor reduction.
20250015257. ELECTROCHEMICAL DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Keitaro KITADA of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M4/131, H01M4/02, H01M4/62, H01M10/052
CPC Code(s): H01M4/131
Abstract: an electrochemical device is provided and includes a positive electrode, a negative electrode, a separator, and an electrolyte, and at least one of the positive electrode or the negative electrode includes first active material particles and fibrous carbon, the first active material particles are retained in a bridge structure formed by the fibrous carbon, the separator includes insulating inorganic particles and an inorganic binder that bonds the insulating inorganic particles together, the electrolyte includes a nonaqueous solvent and a supporting salt, the positive electrode, the negative electrode, and the separator are impregnated with the electrolyte, and the separator and at least one of the positive electrode or the negative electrode are bonded together by the inorganic binder.
Inventor(s): Hideaki KUWAJIMA of Kyoto (JP) for murata manufacturing co., ltd., Keita IKEZAWA of Kyoto (JP) for murata manufacturing co., ltd., Yuki WATANABE of Kyoto (JP) for murata manufacturing co., ltd., Ryota SHIMIZU of Kyoto (JP) for murata manufacturing co., ltd., Taro HITOSUGI of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M4/62, H01M4/02, H01M4/36, H01M4/38, H01M4/48, H01M4/58, H01M10/0562
CPC Code(s): H01M4/628
Abstract: a negative electrode includes an active material layer and an inorganic solid electrolyte layer. the inorganic solid electrolyte layer is on the active material layer. the active material layer includes, in order from a side far from the inorganic solid electrolyte layer, a lithium metal layer, an intermediate layer, and a surface layer. as constituent elements, the intermediate layer includes lithium and oxygen, the surface layer includes lithium, oxygen, and carbon, and the inorganic solid electrolyte layer includes a characteristic element different from lithium, oxygen, and carbon. in an element analysis result based on xps, a ratio of an abundance of lithium to an abundance of carbon is greater than 2 at any depth within a range from a first intersection to a second intersection. the first intersection is where a characteristic element spectrum intersects a carbon spectrum. the second intersection is where a lithium spectrum intersects an oxygen spectrum.
20250015358. BATTERY_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Rie TAKEMIYA of Kyoto (JP) for murata manufacturing co., ltd., Masayuki IWAMA of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M10/0569, H01M10/0525, H01M10/0568, H01M10/0587
CPC Code(s): H01M10/0569
Abstract: provided is a battery having excellent cycle characteristics in a low temperature environment. a battery includes components housed in an exterior can, the components including: an electrode wound body having a structure in which a band-shaped positive electrode including a positive-electrode foil and a positive-electrode active material layer and a band-shaped negative electrode including a negative-electrode foil and a negative-electrode active material layer are stacked with a separator interposed therebetween and wound around a central axis; a positive-electrode current collecting plate; a negative-electrode current collecting plate; and an electrolytic solution, in which the electrode foil has an electrode active material covered portion covered with the active material layer and an active material non-covered portion not covered with the active material layer, a surface on which the active material non-covered portion bent toward the central axis overlaps and the current collecting plate are bonded to each other, and the electrolytic solution contains 7.7 mass % or more and 11.5 mass % or less of fluoroethylene carbonate, 0.032 mass % or more and 0.048 mass % or less of lithium tetrafluoroborate, and lithium hexafluorophosphate.
20250015377. BATTERY PACK_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Yoshiyuki BANNAI of Kyoto (JP) for murata manufacturing co., ltd., Junichi IKEDA of Kyoto (JP) for murata manufacturing co., ltd., Hiroshi KAWAMURA of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M10/52, H01M10/653, H01M50/213, H01M50/291
CPC Code(s): H01M10/52
Abstract: a battery pack is provided and includes a plurality of cylindrical cells arranged in a manner that electrode terminals face the same direction, and an embedded member arranged between a plurality of the cylindrical cells. the embedded member includes a container, and a heat absorbing agent and gas accommodated in the container. the container is provided with a projecting portion arranged between two adjacent ones of the cylindrical cells and extending in a longitudinal direction of the cylindrical cell as viewed from a longitudinal direction of the cylindrical cell. the projecting portion includes a heat absorbing agent accommodation portion in which a heat absorbing agent is accommodated and a gas accommodation portion in which gas is accommodated. the gas accommodation portion is arranged at a tip portion of the projecting portion and is in contact with each of two adjacent ones of the cylindrical cells.
20250015413. BATTERY PACK_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Yoshiyuki BANNAI of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M50/242, H01M10/48, H01M50/213, H01M50/244, H01M50/284
CPC Code(s): H01M50/242
Abstract: provided is a battery pack capable of improving impact resistance without complicating the structure. a battery pack according to an embodiment of the present technology includes a battery module including a battery and a battery holder that holds the battery, and a battery case that houses the battery module. the battery module has a first outer surface and a second outer surface facing the first outer surface. the battery case has a first inner surface disposed facing the first outer surface and warped toward the first outer surface, and a second inner surface disposed facing the second outer surface and warped toward the second outer surface. the battery module is supported on the first inner surface and the second inner surface by warpage of the first inner surface and warpage of the second inner surface.
20250015468. SECONDARY BATTERY_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Takenori YOSHIKAWA of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H01M50/595, H01M50/105, H01M50/186, H01M50/531, H01M50/586
CPC Code(s): H01M50/595
Abstract: a secondary battery is provided and includes an electrode assembly in which a plurality of positive electrodes and negative electrodes are laminated with a separator interposed between them, a plurality of current collecting tabs extending from each current collector of a plurality of the positive electrodes and negative electrodes, a conductive terminal joined to a plurality of the current collecting tabs, and a laminate film including the electrode assembly. a plurality of the positive electrodes and negative electrodes have a current collector and an active material layer formed on a surface of the current collector. the secondary battery further includes an insulating tape covering a joint portion between a plurality of the current collecting tabs and the terminal. the laminate film has a sealing portion, and the tape has a first edge portion at one end on a tip side of the terminal and a second edge portion at another end, and each of the first edge portion and the second edge portion has a plurality of irregularities.
Inventor(s): Yoshiki YAMADA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Ryo KOMURA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H01Q9/04, H01Q1/24, H01Q1/48, H01Q5/10, H01Q5/28, H01Q5/385, H01Q9/28
CPC Code(s): H01Q9/0414
Abstract: an antenna module includes a dielectric substrate, a ground electrode in the dielectric substrate, planar radiating elements, and a peripheral electrode. one radiating element faces the ground electrode. another radiating element is between the one radiating element and the ground electrode. the peripheral electrode is in a layer of the dielectric substrate between the ground electrode and the other radiating element and electrically connects to the ground electrode. the other radiating element emits a radio wave in a frequency band lower than a frequency band of a radio wave emitted by the one radiating element. the peripheral electrode includes multiple planar electrodes stacked in a first direction in which the one radiating element faces the ground electrode. one planar electrode is in a layer between another planar electrode and the ground electrode. the size of the other planar electrode is less than the size of the one planar electrode.
Inventor(s): Shohei IMAI of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H03F1/02, G01R25/00, G01R27/16, H03F3/24, H03G3/30
CPC Code(s): H03F1/0288
Abstract: an impedance detection circuit includes: a first detector that detects a first voltage amplitude at an end of an inverter circuit having the end to which a radio frequency signal is input and having a different end from which a signal is output; a second detector that detects a second voltage amplitude of the different end of the inverter circuit; and a phase difference detector that detects a phase difference between a phase of a voltage across the end of the inverter circuit and a phase of a voltage across the different end of the inverter circuit. an absolute value of a product of diagonal elements of a dependent parameter for the inverter circuit is smaller than an absolute value of a product of off-diagonal elements.
Inventor(s): Albert CARDONA of Santa Barbara CA (US) for murata manufacturing co., ltd., Andrew KAY of Provo UT (US) for murata manufacturing co., ltd., Chris O'BRIEN of San Diego CA (US) for murata manufacturing co., ltd.
IPC Code(s): H03H3/02, H03H9/02, H03H9/205, H03H9/56
CPC Code(s): H03H3/02
Abstract: an acoustic resonator device is provided that includes a wafer having a wafer surface and a wafer conductor pattern on the wafer surface; a piezoelectric layer having front and back surfaces, a portion of the piezoelectric layer being over a cavity between the wafer and the piezoelectric layer, and the wafer conductor pattern; a device conductor pattern including a first metal layer including an interdigital transducer on the front surface of the piezoelectric layer and facing the wafer, and a second metal layer attached to a portion of the device conductor pattern to provide an electrical connection between the idt and the wafer conductor pattern. the second metal layer is bonded to the wafer conductor pattern and the piezoelectric layer comprises openings extending therethrough.
Inventor(s): Katsuhito KURODA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Masashi OMURA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Hirotsugu MORI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03H9/02, H03H9/05, H03H9/10, H03H9/13, H03H9/17, H03H9/56
CPC Code(s): H03H9/02133
Abstract: an acoustic wave device includes a piezoelectric layer including first and second major surfaces, first and second excitation electrodes respectively on the first and second major surfaces, first and second wiring electrodes respectively coupled to the first and second excitation electrodes, and an insulating layer on the second major surface and covering at least a portion of the second excitation electrode and the second wiring electrode. the piezoelectric layer is sandwiched between the first and second excitation electrodes. a region in the piezoelectric layer sandwiched between the first and second excitation electrodes defines an excitation region. an acoustic reflector is provided within the insulating layer and overlaps the excitation region. the first and second wiring electrodes do not overlap the acoustic reflector. material arrangements of the first and second excitation electrodes are the same, and material arrangements of the first and second wiring electrodes are the same.
20250015779. ACOUSTIC WAVE DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Toru YAMAJI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Sunao YAMAZAKI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Hiroya SUZUKI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03H9/13, H03H9/02
CPC Code(s): H03H9/132
Abstract: an acoustic wave device includes a support including a support substrate, a piezoelectric layer on the support in a first direction, a functional electrode on the piezoelectric layer, and a reinforcement film on the piezoelectric layer. the support includes a space portion that opens on a side of the piezoelectric layer, and an extended passage extending farther toward an outer side than an edge of the space portion in a second direction intersecting the first direction. a through-hole is provided at a position not overlapping the functional electrode in plan view in the first direction, communicates with the extended passage, and penetrates the piezoelectric layer. the reinforcement film is provided in a region between the through-hole and the space portion and overlaps at least a portion of a region where the piezoelectric layer and the extended passage overlap each other in the plan view.
20250015781. ACOUSTIC WAVE DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Katsuya DAIMON of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Akihiro IYAMA of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Toru YAMAJI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03H9/145, H03H9/02, H03H9/05
CPC Code(s): H03H9/14541
Abstract: an acoustic wave device includes a support, a piezoelectric layer on the support, an idt electrode on the piezoelectric layer and including busbars and electrode fingers, and mass-added films on the electrode fingers. an acoustic reflection portion is provided in the support and overlaps at least a portion of the idt electrode. d/p is about 0.5 or less. when viewed in an electrode finger orthogonal direction, a region in which the electrode fingers adjacent to each other overlap each other is an intersecting region including a central region, and first and second edge regions. at least a portion of the mass-added films overlaps the central region in plan view.
Inventor(s): Hidetaka TAKAHASHI of Nagaokakyo-shi (JP) for murata manufacturing co., ltd., Takanori ITO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03H9/54, H03H9/13, H03H9/205, H05K1/18
CPC Code(s): H03H9/54
Abstract: a radio frequency module including a mounting board, a first acoustic wave filter, a second acoustic wave filter, and a shield electrode. the second acoustic wave filter is disposed on the first acoustic wave filter. the first acoustic wave filter supports a first communication band, and the second acoustic wave filter supports a second communication band. the first acoustic wave filter includes a first support member and a first functional electrode. the second acoustic wave filter includes a second support member and a second functional electrode. the first functional electrode and the second functional electrode are located in a hollow space formed between the first support member and the second support member in a thickness direction of the mounting board, and face each other. the shield electrode is located in the hollow space and covers at least one of the first functional electrode and the second functional electrode.
20250015784. ACOUSTIC WAVE DEVICE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Sho NAGATOMO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H03H9/58, H03H9/02, H03H9/17
CPC Code(s): H03H9/584
Abstract: an acoustic wave device includes first and second acoustic wave resonators, each including a piezoelectric layer and a functional electrode, and an acoustic coupling layer laminated between the piezoelectric layer of each of the first and second acoustic wave resonators. each of the functional electrodes of the first and second acoustic wave resonators includes at least one pair of electrode fingers. in each of the first and second acoustic wave resonators, when a thickness of the piezoelectric layer is defined as d and a center-to-center distance of the electrode fingers adjacent to each other is defined as p, d/p is about 0.5 or smaller. the first and second acoustic wave resonators face each other across the acoustic coupling layer.
20250015823. COMMUNICATION MODULE_simplified_abstract_(murata manufacturing co., ltd.)
Inventor(s): Yuki OHMAE of Kyoto (JP) for murata manufacturing co., ltd.
IPC Code(s): H04B1/18, H01P5/18, H04B1/04, H04B1/16
CPC Code(s): H04B1/18
Abstract: a communication module able to have a favorable isolation characteristic is provided. the communication module includes a directional coupler inserted in a path extending toward an antenna from an amplifying part that amplifies a signal being input and a stub connected to the path. the directional coupler includes a main line and a sub line that couples with the main line and picks up a signal flowing through the main line. one end portion of the stub is connected to part of the path that is not the main line, another end portion of the stub is left open, and an extending direction of the stub from the one end portion to the other end portion is a direction moving away from the directional coupler.
Inventor(s): Hironari YAMAMOTO of Nagaokakyo-shi (JP) for murata manufacturing co., ltd.
IPC Code(s): H04R17/10
CPC Code(s): H04R17/10
Abstract: a dimension in a longitudinal direction inside one or more frame bodies is equal to or greater than four times a dimension in a short direction orthogonal or substantially orthogonal to the longitudinal direction inside the one or more frame bodies and is greater than a minimum dimension in the longitudinal direction of one or more ultrasonic vibrators. an average length in the longitudinal direction of a gap between an edge on at least one side in the longitudinal direction of an inner circumferential surface of the one or more frame bodies and an edge on the at least one side in the longitudinal direction of a surface of the one or more ultrasonic vibrators on a frame body side is equal to or less than about 1.3 times a dimension in the short direction inside the one or more frame bodies.
Inventor(s): Gregory Szczeszynski of Nashua NH (US) for murata manufacturing co., ltd., Tim Wen Hui Yu of Fremont CA (US) for murata manufacturing co., ltd., John Weld of San Diego CA (US) for murata manufacturing co., ltd.
IPC Code(s): H05K1/02, H02M1/00, H02M3/00, H02M3/07, H02M3/158, H05K1/18
CPC Code(s): H05K1/0262
Abstract: an apparatus may include a printed circuit board including an integrated circuit including buck converter circuitry and an inductor coupled to the integrated circuit.
Murata Manufacturing Co., Ltd. patent applications on January 9th, 2025
- Murata Manufacturing Co., Ltd.
- A61M16/00
- CPC A61M16/0066
- Murata manufacturing co., ltd.
- B32B7/03
- B32B15/08
- B32B15/20
- CPC B32B7/03
- G01R31/392
- G01R31/3842
- CPC G01R31/392
- G06F30/10
- G06F17/16
- CPC G06F30/10
- H01C7/02
- H01C1/14
- CPC H01C7/027
- H01F41/02
- B22F1/08
- B22F1/12
- B22F1/16
- B22F10/28
- B33Y10/00
- B33Y70/10
- H01F1/147
- CPC H01F41/0246
- H01G4/008
- H01G4/12
- H01G4/232
- H01G4/248
- H01G4/30
- CPC H01G4/008
- CPC H01G4/0085
- H01G4/012
- CPC H01G4/012
- H01G4/005
- CPC H01G4/1218
- H01G4/224
- H01G4/236
- H02M7/00
- CPC H01G4/224
- CPC H01G4/2325
- CPC H01G4/30
- H01G4/33
- CPC H01G4/33
- H01L23/532
- H01L23/522
- CPC H01L23/53295
- H01L23/66
- H01L23/00
- H01L25/065
- H01L25/10
- CPC H01L23/66
- H01L27/092
- H01L29/16
- H01L29/20
- CPC H01L24/08
- H01M4/131
- H01M4/02
- H01M4/62
- H01M10/052
- CPC H01M4/131
- H01M4/36
- H01M4/38
- H01M4/48
- H01M4/58
- H01M10/0562
- CPC H01M4/628
- H01M10/0569
- H01M10/0525
- H01M10/0568
- H01M10/0587
- CPC H01M10/0569
- H01M10/52
- H01M10/653
- H01M50/213
- H01M50/291
- CPC H01M10/52
- H01M50/242
- H01M10/48
- H01M50/244
- H01M50/284
- CPC H01M50/242
- H01M50/595
- H01M50/105
- H01M50/186
- H01M50/531
- H01M50/586
- CPC H01M50/595
- H01Q9/04
- H01Q1/24
- H01Q1/48
- H01Q5/10
- H01Q5/28
- H01Q5/385
- H01Q9/28
- CPC H01Q9/0414
- H03F1/02
- G01R25/00
- G01R27/16
- H03F3/24
- H03G3/30
- CPC H03F1/0288
- H03H3/02
- H03H9/02
- H03H9/205
- H03H9/56
- CPC H03H3/02
- H03H9/05
- H03H9/10
- H03H9/13
- H03H9/17
- CPC H03H9/02133
- CPC H03H9/132
- H03H9/145
- CPC H03H9/14541
- H03H9/54
- H05K1/18
- CPC H03H9/54
- H03H9/58
- CPC H03H9/584
- H04B1/18
- H01P5/18
- H04B1/04
- H04B1/16
- CPC H04B1/18
- H04R17/10
- CPC H04R17/10
- H05K1/02
- H02M1/00
- H02M3/00
- H02M3/07
- H02M3/158
- CPC H05K1/0262