Intel corporation (20250006666). MICROSTRIP ROUTING ON EMBEDDED HIGH-K DIELECTRIC

MICROSTRIP ROUTING ON EMBEDDED HIGH-K DIELECTRIC

Organization Name

intel corporation

Inventor(s)

Jiun Hann Sir of Gelugor MY

Poh Boon Khoo of Perai MY

MICROSTRIP ROUTING ON EMBEDDED HIGH-K DIELECTRIC

This abstract first appeared for US patent application 20250006666 titled 'MICROSTRIP ROUTING ON EMBEDDED HIGH-K DIELECTRIC

Original Abstract Submitted

an integrated circuit (ic) device includes an ic die on a substrate, and the substrate includes a group of conductive lines between a high-permittivity dielectric layer and a low-permittivity dielectric layer, with a ground plane separated from the conductive lines by either the high- or low-permittivity dielectric layer. the substrate may include other low-permittivity dielectric layers. the substrate may include other groups of conductive lines between ground planes. the high-permittivity dielectric layer may be within a low-permittivity dielectric core layer.