18215480. MICROSTRIP ROUTING ON EMBEDDED HIGH-K DIELECTRIC (Intel Corporation)

MICROSTRIP ROUTING ON EMBEDDED HIGH-K DIELECTRIC

Organization Name

Intel Corporation

Inventor(s)

Jiun Hann Sir of Gelugor (MY)

Poh Boon Khoo of Perai (MY)

MICROSTRIP ROUTING ON EMBEDDED HIGH-K DIELECTRIC

This abstract first appeared for US patent application 18215480 titled 'MICROSTRIP ROUTING ON EMBEDDED HIGH-K DIELECTRIC

Original Abstract Submitted

An integrated circuit (IC) device includes an IC die on a substrate, and the substrate includes a group of conductive lines between a high-permittivity dielectric layer and a low-permittivity dielectric layer, with a ground plane separated from the conductive lines by either the high- or low-permittivity dielectric layer. The substrate may include other low-permittivity dielectric layers. The substrate may include other groups of conductive lines between ground planes. The high-permittivity dielectric layer may be within a low-permittivity dielectric core layer.