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Category:H01L23/525
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This category has the following 39 subcategories, out of 39 total.
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Pages in category "H01L23/525"
The following 108 pages are in this category, out of 108 total.
1
- 17412999. ELECTRICAL FUSE BIT CELL IN INTEGRATED CIRCUIT HAVING BACKSIDE CONDUCTING LINES simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17453670. ELECTRONIC FUSE STRUCTURE EMBEDDED IN TOP VIA simplified abstract (International Business Machines Corporation)
- 17456016. ANTI-FUSE WITH LATERALLY EXTENDED LINER simplified abstract (International Business Machines Corporation)
- 17748291. TRANSISTOR CAPABLE OF ELECTRICALLY CONTROLLING A THRESHOLD VOLTAGE AND SEMICONDUCTOR DEVICE INCLUDING THE TRANSISTOR simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17835863. INTERCONNECT VIA METAL-INSULATOR-METAL (MIM) FUSE FOR INTEGRATED CIRCUITRY simplified abstract (Intel Corporation)
- 17838448. SEMICONDUCTOR DEVICE WITH PROGRAMMABLE FEATURE simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 17839796. SEMICONDUCTOR DEVICE WITH FUSE STRUCTURE simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 17840097. METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH FUSE STRUCTURE simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 17851170. SEMICONDUCTOR CHIP AND METHOD OF FABRICATING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17936843. ANTI-FUSE AND FUSE STRUCTURES USING ANISOTROPIC ETCHING OF THE SUBSTRATE USING A PATTERN OF ETCH RELEASE HOLES FOR IMPROVING THE FUNCTIONALITY OF QUBIT CIRCUITS simplified abstract (International Business Machines Corporation)
- 17936845. ANTI-FUSE AND FUSE STRUCTURES FOR IMPROVING THE FUNCTIONALITY OF QUBIT CIRCUITS simplified abstract (International Business Machines Corporation)
- 18065923. TWO-TRANSISTOR CHIP AND THREE-TRANSISTOR CHIP IDENTIFICATION BIT CELLS simplified abstract (International Business Machines Corporation)
- 18148147. VIA FUSE WITH METAL-INSULATOR-METAL ARCHITECTURE AND IMPROVED ELECTRODE MATERIAL simplified abstract (Intel Corporation)
- 18157418. MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18186734. DIELECTRIC FILM BASED ONE-TIME PROGRAMMABLE (OTP) MEMORY CELL simplified abstract (QUALCOMM Incorporated)
- 18187993. SECURE ANTI-FUSE ONE TIME PROGRAMMABLE BIT CELL DESIGN simplified abstract (QUALCOMM Incorporated)
- 18217717. SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FUSE STRUCTURE EMBEDDED IN SUBSTRATE (NANYA TECHNOLOGY CORPORATION)
- 18333189. SEMICONDUCTOR DEVICES WITH ELECTRICAL FUSES AND METHODS OF FABRICATING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18382218. SEMICONDUCTOR DEVICE STRUCTURE INCLUDING FUSE STRUCTURE EMBEDDED IN SUBSTRATE (NANYA TECHNOLOGY CORPORATION)
- 18401815. Conductive Traces in Semiconductor Devices and Methods of Forming Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18410190. EFUSE CELLS WITH BACKSIDE POWER RAILS (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.)
- 18428920. ANTI-FUSE CELLS WITH BACKSIDE POWER RAILS (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.)
- 18436731. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME simplified abstract (Renesas Electronics Corporation)
- 18438808. BACK SIDE ILLUMINATED IMAGE SENSOR WITH REDUCED SIDEWALL-INDUCED LEAKAGE (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18467755. VERTICAL ANTIFUSE (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18468758. TAPERED ANTIFUSE (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18469649. HORIZONTAL ANTIFUSE (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18470472. ANTIFUSE AND RESISTOR (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18470655. BACKSIDE FUSE CONNECTED TO BACKSIDE BACK END OF THE LINE NETWORK (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18470664. BACKSIDE FUSE STRUCTURE UTILIZING BACKSIDE CONTACT (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18478880. SYSTEMS AND METHODS FOR ENABLING A FEATURE OF A SEMICONDUCTOR DEVICE (Advanced Micro Devices, Inc.)
- 18482213. ELECTRONIC FUSE VIA AND LOGIC DEVICE CO-INTEGRATION WITH BACKSIDE POWER DELIVERY NETWORK (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18514796. MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18524621. MODIFIED FUSE STRUCTURE AND METHOD OF USE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18594011. METHOD OF FORMING ELECTRICAL FUSE MATRIX simplified abstract (NANYA TECHNOLOGY CORPORATION)
- 18663697. METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCAPSULANT simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18670472. MIM MEMORY CELL WITH BACKSIDE INTERCONNECT STRUCTURES simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.)
- 18672981. FUSE STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18753168. INTEGRATED CIRCUIT INCLUDING ELECTRONIC FUSE BIT CELL (SAMSUNG ELECTRONICS CO., LTD.)
- 18755298. FUSE CELL STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18789432. TESTING ACCESS FOR STACKED SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODS (Micron Technology, Inc.)
- 18955160. EFUSE (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18958537. FAIL-OPEN ISOLATOR (TEXAS INSTRUMENTS INCORPORATED)
- 18991798. SEMICONDUCTOR STRUCTURE HAVING FUSE BELOW GATE STRUCTURE AND METHOD OF MANUFACTURING THEREOF (NANYA TECHNOLOGY CORPORATION)
- 19001619. METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH FUSE STRUCTURE (NANYA TECHNOLOGY CORPORATION)
- 19004494. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.)
- 19013102. SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME (Micron Technology, Inc.)
- 19014455. SEMICONDUCTOR DEVICE (Taiwan Semiconductor Manufacturing Company, Ltd.)
A
I
- Intel corporation (20240222270). VIA FUSE WITH METAL-INSULATOR-METAL ARCHITECTURE AND IMPROVED ELECTRODE MATERIAL simplified abstract
- Intel Corporation patent applications on February 13th, 2025
- Intel Corporation patent applications on July 4th, 2024
- International business machines corporation (20240112056). ANTI-FUSE AND FUSE STRUCTURES USING ANISOTROPIC ETCHING OF THE SUBSTRATE USING A PATTERN OF ETCH RELEASE HOLES FOR IMPROVING THE FUNCTIONALITY OF QUBIT CIRCUITS simplified abstract
- International business machines corporation (20240113015). ANTI-FUSE AND FUSE STRUCTURES FOR IMPROVING THE FUNCTIONALITY OF QUBIT CIRCUITS simplified abstract
- International business machines corporation (20240202305). TWO-TRANSISTOR CHIP AND THREE-TRANSISTOR CHIP IDENTIFICATION BIT CELLS simplified abstract
- International business machines corporation (20250096122). VERTICAL ANTIFUSE
- International business machines corporation (20250096123). TAPERED ANTIFUSE
- International business machines corporation (20250096124). HORIZONTAL ANTIFUSE
- International business machines corporation (20250096125). ANTIFUSE AND RESISTOR
- International business machines corporation (20250096126). BACKSIDE FUSE CONNECTED TO BACKSIDE BACK END OF THE LINE NETWORK
- International business machines corporation (20250096127). BACKSIDE FUSE STRUCTURE UTILIZING BACKSIDE CONTACT
- International business machines corporation (20250118660). ELECTRONIC FUSE VIA AND LOGIC DEVICE CO-INTEGRATION WITH BACKSIDE POWER DELIVERY NETWORK
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on April 10th, 2025
- International Business Machines Corporation patent applications on April 4th, 2024
- International Business Machines Corporation patent applications on February 20th, 2025
- International Business Machines Corporation patent applications on June 20th, 2024
- INTERNATIONAL BUSINESS MACHINES CORPORATION patent applications on March 20th, 2025
M
- Micron technology, inc. (20250087537). TESTING ACCESS FOR STACKED SEMICONDUCTOR DEVICES AND ASSOCIATED SYSTEMS AND METHODS
- Micron technology, inc. (20250149391). SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Micron Technology, Inc. patent applications on March 13th, 2025
- Micron Technology, Inc. patent applications on May 8th, 2025
N
- Nanya technology corporation (20250125257). SEMICONDUCTOR STRUCTURE HAVING FUSE BELOW GATE STRUCTURE AND METHOD OF MANUFACTURING THEREOF
- Nanya technology corporation (20250125258). METHOD FOR FABRICATING SEMICONDUCTOR DEVICE WITH FUSE STRUCTURE
- NANYA TECHNOLOGY CORPORATION patent applications on April 17th, 2025
Q
S
T
- Taiwan semiconductor manufacturing co., ltd. (20240096789). MODIFIED FUSE STRUCTURE AND METHOD OF USE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240313770). FUSE STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240421177). BACK SIDE ILLUMINATED IMAGE SENSOR WITH REDUCED SIDEWALL-INDUCED LEAKAGE
- Taiwan semiconductor manufacturing co., ltd. (20250087582). EFUSE
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on December 19th, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 13th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications on September 19th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240136280). Conductive Traces in Semiconductor Devices and Methods of Forming Same simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240292609). METHOD AND STRUCTURE FOR REDUCE OTP CELL AREA AND LEAKAGE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240297115). SEMICONDUCTOR DEVICES WITH ELECTRICAL FUSES AND METHODS OF FABRICATING THE SAME simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240297131). METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCAPSULANT simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240349495). FUSE CELL STRUCTURE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250149073). SEMICONDUCTOR DEVICE
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 25th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on August 29th, 2024
- Taiwan Semiconductor Manufacturing Company, LTD. patent applications on February 6th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on February 8th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 8th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 17th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 5th, 2024
- Texas instruments incorporated (20250087583). FAIL-OPEN ISOLATOR
- Texas Instruments Incorporated patent applications on February 29th, 2024
- TEXAS INSTRUMENTS INCORPORATED patent applications on March 13th, 2025