19004494. SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.)

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

Inventor(s)

JEN-YUAN Chang of HSINCHU CITY TW

CHIA-PING Lai of HSINCHU CITY TW

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

This abstract first appeared for US patent application 19004494 titled 'SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

Original Abstract Submitted

A semiconductor structure and a method for forming the semiconductor structure are disclosed. The semiconductor structure includes a first die including a fuse structure in a topmost layer of the first die, the fuse structure including a pair of conductive segments, wherein one of the pair of conductive segments is electrically connected to a bonding pad of the first die, wherein the bonding pad is electrically connected to ground; and an inductor electrically connected to the one of the pair of conductive segments.