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Category:H01L23/427
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This category has the following 44 subcategories, out of 44 total.
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Pages in category "H01L23/427"
The following 77 pages are in this category, out of 77 total.
1
- 17837312. HEAT DISSIPATION STRUCTURES FOR INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18088360. CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE simplified abstract (Intel Corporation)
- 18090140. SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBSTRATES simplified abstract (Intel Corporation)
- 18149617. MIXED PHASE THERMAL INTERFACE MATERIAL ASSEMBLY WITH HIGH THERMAL CONDUCTIVITY AND LOW INTERNAL CONTACT RESISTANCE simplified abstract (NVIDIA Corporation)
- 18202613. SEMICONDUCTOR DEVICE HAVING TWO-PHASE COOLING STRUCTURE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18216830. PASSIVE COOLING HEAT SPREADER WITH PHASE CHANGE MATERIAL INFUSED MESH (Intel Corporation)
- 18229700. Three-Dimensional Chip Comprising Heat Transfer Means simplified abstract (Nokia Technologies Oy)
- 18323880. ELECTRONIC DEVICE INCLUDING HEAT PIPE SURROUNDING MULTIPLE INTEGRATED CIRCUITS simplified abstract (Samsung Electronics Co., Ltd.)
- 18379133. INVERTED MEMORY STACK (Advanced Micro Devices, Inc.)
- 18394575. HEAT DISSIPATION STRUCTURES simplified abstract (Samsung Electronics Co., Ltd.)
- 18397505. EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHODS OF MANUFACTURING THE SAME simplified abstract (ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.)
- 18410761. HEAT RADIATION DEVICES (SAMSUNG ELECTRONICS CO., LTD.)
- 18418559. HEAT TRANSPORT DEVICE AND SEMICONDUCTOR MODULE simplified abstract (DENSO CORPORATION)
- 18418559. HEAT TRANSPORT DEVICE AND SEMICONDUCTOR MODULE simplified abstract (TOYOTA JIDOSHA KABUSHIKI KAISHA)
- 18419915. INTEGRATED CHIP STRUCTURE WITH HIGH THERMAL CONDUCTIVITY LAYER (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18422392. HEAT DISSIPATION BY NANO PIPES (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18505412. HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract (Samsung Electronics Co., Ltd.)
- 18514514. SEMICONDUCTOR DEVICE WITH 2-PHASE COOLING STRUCTURE simplified abstract (Samsung Electronics Co., Ltd.)
- 18520425. COOLING SYSTEMS WITH MAIN AND REMOTE COOLING MASSES HAVING INTEGRATED FLEXIBILITY simplified abstract (Intel Corporation)
- 18616721. COOLING STRUCTURE AND METHOD FOR SEMICONDUCTOR DEVICE (SAMSUNG ELECTRONICS CO., LTD.)
- 18643907. Power, Signaling and Thermal Path Co-optimization (Apple Inc.)
- 18728617. HYBRID HEAT SINK (Siemens Aktiengesellschaft)
- 18958990. METHOD FOR FORMING PACKAGE STRUCTURE (Taiwan Semiconductor Manufacturing Co., Ltd.)
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- Intel corporation (20240105585). SOLID STATE ELECTROLYTES FOR BACKEND SUPERCAPACITORS simplified abstract
- Intel corporation (20240105677). RECONSTITUTED WAFER WITH SIDE-STACKED INTEGRATED CIRCUIT DIE simplified abstract
- Intel corporation (20240186206). INTEGRATED TOP SIDE POWER DELIVERY THERMAL TECHNOLOGY simplified abstract
- Intel corporation (20240188212). PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING simplified abstract
- Intel corporation (20240213111). CONFIGURABLE MICRO HEAT PIPE (MHP) AND MICROCHANNEL FOR IMPROVED COOLING OF GLASS CORE SUBSTRATE simplified abstract
- Intel corporation (20240222288). SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBSTRATES simplified abstract
- Intel corporation (20240260233). DIMM COOLING ASSEMBLIES
- Intel corporation (20240260233). DIMM COOLING ASSEMBLIES simplified abstract
- Intel corporation (20240355778). EM AND RF MITIGATION SILICON STRUCTURES IN STACKED DIE MICROPROCESSORS FOR DIE TO PLATFORM AND DIE-DIE RF NOISE SUPPRESSION simplified abstract
- Intel corporation (20250006588). PASSIVE COOLING HEAT SPREADER WITH PHASE CHANGE MATERIAL INFUSED MESH
- Intel corporation (20250079262). METHODS AND APPARATUS FOR MULTI-ZONE TEMPERATURE CONTROL OF JET IMPINGEMENT COOLING OF INTEGRATED CIRCUIT PACKAGES
- Intel Corporation patent applications on August 1st, 2024
- Intel Corporation patent applications on January 25th, 2024
- Intel Corporation patent applications on January 2nd, 2025
- Intel Corporation patent applications on July 4th, 2024
- Intel Corporation patent applications on June 27th, 2024
- Intel Corporation patent applications on June 6th, 2024
- Intel Corporation patent applications on March 28th, 2024
- Intel Corporation patent applications on March 6th, 2025
- Intel Corporation patent applications on October 24th, 2024
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- Samsung electronics co., ltd. (20240203821). SEMICONDUCTOR DEVICE HAVING TWO-PHASE COOLING STRUCTURE simplified abstract
- Samsung electronics co., ltd. (20240321679). HEAT DISSIPATION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240321680). SEMICONDUCTOR DEVICE WITH 2-PHASE COOLING STRUCTURE simplified abstract
- Samsung electronics co., ltd. (20240321682). HEAT DISSIPATION STRUCTURES simplified abstract
- Samsung electronics co., ltd. (20240413053). HEAT RADIATION DEVICES
- Samsung electronics co., ltd. (20250062241). SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF SEMICONDUCTOR CHIPS
- Samsung electronics co., ltd. (20250105093). COOLING STRUCTURE AND METHOD FOR SEMICONDUCTOR DEVICE
- Samsung Electronics Co., Ltd. patent applications on December 12th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 12th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 20th, 2025
- Samsung Electronics Co., Ltd. patent applications on February 29th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 20th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on June 20th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 27th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 27th, 2025
- Samsung Electronics Co., Ltd. patent applications on September 26th, 2024
- Siemens aktiengesellschaft (20250112118). SEMICONDUCTOR ASSEMBLY COMPRISING A FIRST SEMICONDUCTOR ELEMENT AND A FIRST CONNECTION ELEMENT
- Siemens Aktiengesellschaft patent applications on April 3rd, 2025
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- Taiwan semiconductor manufacturing co., ltd. (20250087648). METHOD FOR FORMING PACKAGE STRUCTURE
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 13th, 2025
- Taiwan semiconductor manufacturing company, ltd. (20250140644). HEAT DISSIPATION BY NANO PIPES
- Taiwan semiconductor manufacturing company, ltd. (20250140697). INTEGRATED CHIP STRUCTURE WITH HIGH THERMAL CONDUCTIVITY LAYER
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 1st, 2025