HEAT TRANSPORT DEVICE AND SEMICONDUCTOR MODULE

Organization Name

DENSO CORPORATION

Inventor(s)

Shinya Ito of Nisshin-shi (JP)

Tomohito Iwashige of Nisshin-shi (JP)

Masayuki Kamiya of Nisshin-shi (JP)

Hiroki Yokoyama of Higashiosaka-shi (JP)

HEAT TRANSPORT DEVICE AND SEMICONDUCTOR MODULE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18418559 titled 'HEAT TRANSPORT DEVICE AND SEMICONDUCTOR MODULE

The patent application describes a heat transport device with a housing, a wick, and a vapor passage. The device utilizes a working fluid sealed in a sealed space within the housing.

The wick allows a liquid-phase working fluid to flow through a capillary passage inside the housing.
A gas-phase working fluid flows through the vapor passage within the housing.
The housing's outer wall has a heating element disposing portion where a heating element is placed, and a non-disposing portion where a heating element is not placed.
An internal portion of the housing has a heat receiving portion overlapping with the heating element disposing portion and a heat radiating portion overlapping with the non-disposing portion.
Both the wick and the vapor passage extend over the heat receiving and heat radiating portions.

Potential Applications: - Heat transfer systems - Cooling systems - Thermal management in electronic devices

Problems Solved: - Efficient heat transfer - Controlled temperature regulation - Compact design for space-constrained applications

Benefits: - Improved thermal performance - Energy efficiency - Compact and versatile design

Commercial Applications: Title: Advanced Heat Transport Device for Efficient Cooling Systems This technology can be used in various industries such as electronics, automotive, aerospace, and HVAC for efficient heat transfer and cooling applications.

Questions about the technology: 1. How does the heat transport device improve thermal management in electronic devices? - The device allows for efficient heat transfer and controlled temperature regulation in compact spaces, enhancing the overall performance of electronic devices. 2. What are the potential market implications of this advanced heat transport technology? - The technology can revolutionize cooling systems in various industries, leading to energy savings and improved performance.

Original Abstract Submitted

A heat transport device includes a housing, a wick, and a vapor passage. The housing has a sealed space in which a working fluid is sealed. The wick forms a capillary passage through which a liquid-phase working fluid flows inside the housing. A gas-phase working fluid flows through the vapor passage inside the housing. An outer wall of the housing has a heating element disposing portion on which a heating element is disposed, and a non-disposing portion on which a heating element is not disposed. An internal portion of the housing has a heat receiving portion overlapping with the heating element disposing portion in a thickness direction of the housing and a heat radiating portion overlapping with the non-disposing portion in the thickness direction. Both the wick and the vapor passage are provided to extend over the heat receiving portion and the heat radiating portion.