METHOD FOR FORMING PACKAGE STRUCTURE

Organization Name

Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor(s)

METHOD FOR FORMING PACKAGE STRUCTURE

This abstract first appeared for US patent application 18958990 titled 'METHOD FOR FORMING PACKAGE STRUCTURE

Original Abstract Submitted

A package structure includes a first semiconductor package and a second semiconductor package over the first semiconductor package. The first semiconductor package includes a dielectric structure, a semiconductor device on the dielectric structure, under bump metallization (UBM) structures in the dielectric structure. The USB structures each include a first region and a second region surrounded by the first region. The first region has more metal layers than the second region. The bumps are respectively on the second regions of the UBM structures.