HEAT TRANSPORT DEVICE AND SEMICONDUCTOR MODULE

Organization Name

TOYOTA JIDOSHA KABUSHIKI KAISHA

Inventor(s)

Shinya Ito of Nisshin-shi (JP)

Tomohito Iwashige of Nisshin-shi (JP)

Masayuki Kamiya of Nisshin-shi (JP)

Hiroki Yokoyama of Higashiosaka-shi (JP)

HEAT TRANSPORT DEVICE AND SEMICONDUCTOR MODULE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18418559 titled 'HEAT TRANSPORT DEVICE AND SEMICONDUCTOR MODULE

The patent application describes a heat transport device with a housing, a wick, and a vapor passage. The device utilizes a working fluid sealed in a sealed space within the housing.

The wick creates a capillary passage for the liquid-phase working fluid to flow inside the housing.
A gas-phase working fluid flows through the vapor passage within the housing.
The housing's outer wall has a heating element disposing portion where a heating element is placed, and a non-disposing portion where a heating element is not placed.
An internal portion of the housing includes a heat receiving portion overlapping with the heating element disposing portion and a heat radiating portion overlapping with the non-disposing portion.
Both the wick and the vapor passage extend over the heat receiving and heat radiating portions.

Potential Applications: - Heat transfer systems - Cooling systems - Thermal management devices

Problems Solved: - Efficient heat transfer - Controlled temperature regulation

Benefits: - Enhanced thermal performance - Improved energy efficiency

Commercial Applications: Title: Advanced Heat Transport Systems for Industrial Cooling Applications This technology can be used in industrial cooling systems, HVAC systems, and electronic devices to improve heat dissipation and overall performance.

Questions about the technology: 1. How does the heat transport device improve energy efficiency in cooling systems? 2. What are the potential industrial applications of this innovative heat transfer technology?

Original Abstract Submitted

A heat transport device includes a housing, a wick, and a vapor passage. The housing has a sealed space in which a working fluid is sealed. The wick forms a capillary passage through which a liquid-phase working fluid flows inside the housing. A gas-phase working fluid flows through the vapor passage inside the housing. An outer wall of the housing has a heating element disposing portion on which a heating element is disposed, and a non-disposing portion on which a heating element is not disposed. An internal portion of the housing has a heat receiving portion overlapping with the heating element disposing portion in a thickness direction of the housing and a heat radiating portion overlapping with the non-disposing portion in the thickness direction. Both the wick and the vapor passage are provided to extend over the heat receiving portion and the heat radiating portion.