Intel corporation (20240260233). DIMM COOLING ASSEMBLIES
DIMM COOLING ASSEMBLIES
Organization Name
Inventor(s)
Rajiv K. Mongia of Portland OR US
Berhanu Wondimu of Beaverton OR US
Guixiang Tan of Portland OR US
Wei-Ming Chu of New Taipei City TW
Devdatta Prakash Kulkarni of Portland OR US
DIMM COOLING ASSEMBLIES
This abstract first appeared for US patent application 20240260233 titled 'DIMM COOLING ASSEMBLIES
Original Abstract Submitted
heat pipes and vapor chambers that are components of a dimm cooling assembly are described.
Categories:
- Intel corporation
- Ming Zhang of Shanghai CN
- Yuehong Fan of Shanghai CN
- Peng Wei of Shanghai CN
- Chuanlou Wang of Shanghai CN
- Rajiv K. Mongia of Portland OR US
- Guocheng Zhang of Shanghai CN
- Yingqiong Bu of Shanghai CN
- Berhanu Wondimu of Beaverton OR US
- Guixiang Tan of Portland OR US
- Xiang Que of Suzhou CN
- Qing Jiang of Shanghai CN
- Liu Yu of Shanghai CN
- Wei-Ming Chu of New Taipei City TW
- Chen Zhang of Shanghai CN
- Hao Zhou of Shanghai CN
- Feng Qi of Shanghai CN
- Catharina Biber of Bend OR US
- Devdatta Prakash Kulkarni of Portland OR US
- Xiang Li of Portland OR US
- Yechi Zhang of Shanghai CN
- H05K7/20
- G06F1/20
- H01L23/40
- H01L23/427
- H01L23/473
- CPC H05K7/20336