SEMICONDUCTOR DEVICE HAVING TWO-PHASE COOLING STRUCTURE

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SEMICONDUCTOR DEVICE HAVING TWO-PHASE COOLING STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18202613 titled 'SEMICONDUCTOR DEVICE HAVING TWO-PHASE COOLING STRUCTURE

The semiconductor device described in the patent application includes a semiconductor chip with an integrated circuit and a cooling channel that contains a liquid coolant. The cooling channel has a fine pattern on the wall surface that generates a capillary force to facilitate the flow of the liquid coolant. The channel is divided into a liquid channel area, where the liquid coolant flows, and a gas channel area, where a gaseous coolant passes through.

The semiconductor device features a cooling channel with a fine pattern on the wall surface to enhance the flow of liquid coolant.
The cooling channel is divided into a liquid channel area and a gas channel area to optimize the cooling process.
The capillary force generated by the fine pattern helps in the efficient cooling of the semiconductor chip.
By separating the liquid and gas channel areas, the device ensures effective cooling of the semiconductor chip.
The innovative design of the cooling channel improves the overall performance and reliability of the semiconductor device.

Potential Applications: - High-performance computing systems - Data centers - Automotive electronics - Aerospace technology - Medical devices

Problems Solved: - Overheating of semiconductor chips - Inefficient cooling systems - Reliability issues due to heat buildup - Performance degradation under high temperatures - Limited thermal management options

Benefits: - Enhanced cooling efficiency - Improved performance and reliability - Extended lifespan of semiconductor devices - Better thermal management capabilities - Increased overall system efficiency

Commercial Applications: Title: Advanced Semiconductor Cooling Technology for High-Performance Applications This technology can be utilized in various commercial applications such as high-performance computing systems, data centers, automotive electronics, aerospace technology, and medical devices. The improved cooling efficiency and thermal management capabilities make it an ideal solution for industries requiring reliable and high-performance semiconductor devices.

Questions about Semiconductor Cooling Technology: 1. How does the fine pattern on the wall surface of the cooling channel enhance the flow of liquid coolant? The fine pattern generates a capillary force that helps in the efficient flow of the liquid coolant through the channel, improving the cooling process. 2. What are the potential applications of this semiconductor cooling technology? This technology can be applied in high-performance computing systems, data centers, automotive electronics, aerospace technology, and medical devices, among others.

Original Abstract Submitted

A semiconductor device includes a semiconductor chip including a semiconductor integrated circuit, and a cooling channel including at least a first portion that is inside the semiconductor chip, a wall surface including a fine pattern configured to generate a capillary force that causes a liquid coolant to flow in the cooling channel, a liquid channel area in a first area of the cooling channel where the fine pattern is formed and configured to pass the liquid coolant, and a gas channel area in a second area of the cooling channel where the fine pattern is not formed and configured to pass a gaseous coolant.