Intel corporation (20240260233). DIMM COOLING ASSEMBLIES simplified abstract

DIMM COOLING ASSEMBLIES

Organization Name

intel corporation

Inventor(s)

Ming Zhang of Shanghai (CN)

Yuehong Fan of Shanghai (CN)

Peng Wei of Shanghai (CN)

Chuanlou Wang of Shanghai (CN)

Rajiv K. Mongia of Portland OR (US)

Guocheng Zhang of Shanghai (CN)

Yingqiong Bu of Shanghai (CN)

Berhanu Wondimu of Beaverton OR (US)

Guixiang Tan of Portland OR (US)

Xiang Que of Suzhou (CN)

Qing Jiang of Shanghai (CN)

Liu Yu of Shanghai (CN)

Wei-Ming Chu of New Taipei City (TW)

Chen Zhang of Shanghai (CN)

Hao Zhou of Shanghai (CN)

Feng Qi of Shanghai (CN)

Catharina Biber of Bend OR (US)

Devdatta Prakash Kulkarni of Portland OR (US)

Xiang Li of Portland OR (US)

Yechi Zhang of Shanghai (CN)

DIMM COOLING ASSEMBLIES - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240260233 titled 'DIMM COOLING ASSEMBLIES

Simplified Explanation

The patent application describes heat pipes and vapor chambers as components of a cooling assembly for DIMM modules.

Key Features and Innovation

• Integration of heat pipes and vapor chambers in a DIMM cooling assembly.
• Efficient heat dissipation for improved performance.
• Enhanced thermal management for electronic devices.
• Potential for compact and effective cooling solutions.
• Utilization of advanced cooling technologies for optimal heat transfer.

Potential Applications

The technology can be applied in:

• High-performance computing systems.
• Data centers.
• Gaming PCs.
• Industrial electronics.
• Automotive electronics.

Problems Solved

The technology addresses:

• Overheating issues in electronic devices.
• Thermal throttling.
• Performance degradation due to heat.
• Space constraints for cooling solutions.
• Reliability concerns in high-temperature environments.

Benefits

• Improved performance and reliability of electronic devices.
• Enhanced thermal management capabilities.
• Compact and efficient cooling solutions.
• Extended lifespan of electronic components.
• Reduction in maintenance and downtime costs.

Commercial Applications

The technology can be utilized in various commercial applications such as:

• Manufacturing of high-performance computers.
• Integration into data center cooling systems.
• Incorporation into gaming laptops and desktops.
• Implementation in automotive electronic control units.
• Adoption in industrial automation systems.

Questions about Heat Pipes and Vapor Chambers

How do heat pipes and vapor chambers contribute to the cooling efficiency of electronic devices?

Heat pipes and vapor chambers are designed to efficiently transfer heat away from electronic components, ensuring optimal thermal management and preventing overheating.

What are the potential drawbacks or limitations of using heat pipes and vapor chambers in cooling assemblies?

While heat pipes and vapor chambers offer efficient heat dissipation, they may face challenges in certain environmental conditions or when dealing with extremely high heat loads. Regular maintenance and monitoring may be required to ensure optimal performance.

Original Abstract Submitted

heat pipes and vapor chambers that are components of a dimm cooling assembly are described.