18616721. COOLING STRUCTURE AND METHOD FOR SEMICONDUCTOR DEVICE (SAMSUNG ELECTRONICS CO., LTD.)
COOLING STRUCTURE AND METHOD FOR SEMICONDUCTOR DEVICE
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COOLING STRUCTURE AND METHOD FOR SEMICONDUCTOR DEVICE
This abstract first appeared for US patent application 18616721 titled 'COOLING STRUCTURE AND METHOD FOR SEMICONDUCTOR DEVICE
Original Abstract Submitted
A semiconductor device may include: a semiconductor chip may include a heat radiation part; a pressure chamber formed on the heat radiation part, wherein the pressure chamber is configured to contain coolant such that an internal pressure in the pressure chamber increases as the coolant absorbs heat from the heat radiation part, and the coolant is ejected in a first direction away from the heat radiation part as the internal pressure of the pressure chamber increases; and a cooling channel providing a flow path configured such that the coolant ejected from the pressure chamber flows through the flow path and back into the pressure chamber.