HEAT DISSIPATION BY NANO PIPES

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Ming-Hsien Lin of Hsinchu County TW

Wen-Che Liao of New Taipei City TW

Kun-Yen Liao of Taipei City TW

Hsiao-Kang Chang of Hsinchu City TW

HEAT DISSIPATION BY NANO PIPES

This abstract first appeared for US patent application 18422392 titled 'HEAT DISSIPATION BY NANO PIPES

Original Abstract Submitted

A contact structure according to the present disclosure includes a conductive feature, an etch stop layer (ESL) over the conductive feature, a dielectric layer over the ESL, and a contact feature extending through the dielectric layer and the ESL to contact the conductive feature. The dielectric layer includes a low-k dielectric matrix material, and nano-pipes disposed in the low-k dielectric matrix material and configured to reduce a thermal resistance of the dielectric layer.