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Category:CPC H01L23/535
Pages in category "CPC H01L23/535"
The following 100 pages are in this category, out of 100 total.
1
- 18089417. INTERCONNECT DEVICE AND METHOD simplified abstract (Intel Corporation)
- 18398370. SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF (SAMSUNG ELECTRONICS CO., LTD.)
- 18405023. SEMICONDUCTOR DEVICE (SAMSUNG ELECTRONICS CO., LTD.)
- 18616019. INDUCTORS WITH THROUGH-SUBSTRATE VIA CORES simplified abstract (Micron Technology, Inc.)
- 18623507. METHODS OF FORMING MICROELECTRONIC DEVICES simplified abstract (Micron Technology, Inc.)
- 18628233. SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18650306. SEMICONDUCTOR DEVICE (Samsung Electronics Co., Ltd.)
- 18743862. Integrated Circuit Apparatus And Oscillator (SEIKO EPSON CORPORATION)
- 18752525. METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING DIFFERENTLY SIZED CONDUCTIVE CONTACT STRUCTURES simplified abstract (Micron Technology, Inc.)
- 18753766. CONTACT OVER ACTIVE GATE STRUCTURES WITH ETCH STOP LAYERS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract (Intel Corporation)
- 18943201. THREE-DIMENSIONAL SEMICONDUCTOR DEVICE INCLUDING A THROUGH-VIA STRUCTURE HAVING A VIA LINER HAVING PROTRUDING PORTIONS (SAMSUNG ELECTRONICS CO., LTD.)
- 18961767. SEMICONDUCTOR MEMORY DEVICE INCLUDING WIRING CONTACT PLUGS (SAMSUNG ELECTRONICS CO., LTD.)
- 18976693. SEMICONDUCTOR MEMORY DEVICES, METHODS FOR FABRICATING THE SAME AND ELECTRONIC SYSTEMS INCLUDING THE SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18982005. PLASMA-DAMAGE-RESISTANT INTERCONNECT STRUCTURE AND METHODS FOR MANUFACTURING THE SAME (Taiwan Semiconductor Manufacturing Company Limited)
- 19012003. SEMICONDUCTOR MEMORY DEVICE HAVING WORD LINES SURROUNDED BY MEMORY LAYERS AND METHOD OF MAKING THE SEMICONDUCTOR MEMORY DEVICE (Taiwan Semiconductor Manufacturing Company, Ltd.)
2
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- IMEC VZW Patent Application Trends in 2024
- Intel corporation (20240213163). INTERCONNECT DEVICE AND METHOD simplified abstract
- Intel corporation (20240347465). CONTACT OVER ACTIVE GATE STRUCTURES WITH ETCH STOP LAYERS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION simplified abstract
- INTEL CORPORATION Patent Application Trends in 2025
- Intel Corporation Patent Application Trends in 2025
- Intel Corporation patent applications on January 23rd, 2025
- Intel Corporation patent applications on June 27th, 2024
- Intel Corporation patent applications on October 17th, 2024
- International Business Machines Corporation Patent Application Trends in 2025
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- MACRONIX INTERNATIONAL CO., LTD. Patent Application Trends in 2024
- Micron technology, inc. (20240234324). INDUCTORS WITH THROUGH-SUBSTRATE VIA CORES simplified abstract
- Micron technology, inc. (20240250033). METHODS OF FORMING MICROELECTRONIC DEVICES simplified abstract
- Micron technology, inc. (20240347464). METHODS OF FORMING MICROELECTRONIC DEVICES INCLUDING DIFFERENTLY SIZED CONDUCTIVE CONTACT STRUCTURES simplified abstract
- Micron Technology, Inc. Patent Application Trends in 2024
- MICRON TECHNOLOGY, INC. Patent Application Trends in 2025
- Micron Technology, Inc. patent applications on July 11th, 2024
- Micron Technology, Inc. patent applications on July 25th, 2024
- Micron Technology, Inc. patent applications on October 17th, 2024
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- SAMSUNG ELECTRONICS CO., LTD Patent Application Trends in 2024
- Samsung electronics co., ltd. (20240250034). SEMICONDUCTOR DEVICE AND DATA STORAGE SYSTEM INCLUDING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240258239). SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Samsung electronics co., ltd. (20240258239). SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME simplified abstract
- Samsung electronics co., ltd. (20240274540). INTEGRATED CIRCUIT CHIP INCLUDING GATE ELECTRODE WITH OBLIQUE CUT SURFACE, AND MANUFACTURING METHOD OF THE SAME simplified abstract
- Samsung electronics co., ltd. (20240421090). SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THEREOF
- Samsung electronics co., ltd. (20250006641). SEMICONDUCTOR DEVICE
- Samsung electronics co., ltd. (20250070029). THREE-DIMENSIONAL SEMICONDUCTOR DEVICE INCLUDING A THROUGH-VIA STRUCTURE HAVING A VIA LINER HAVING PROTRUDING PORTIONS
- Samsung electronics co., ltd. (20250096141). SEMICONDUCTOR MEMORY DEVICE INCLUDING WIRING CONTACT PLUGS
- Samsung electronics co., ltd. (20250105155). SEMICONDUCTOR MEMORY DEVICES, METHODS FOR FABRICATING THE SAME AND ELECTRONIC SYSTEMS INCLUDING THE SAME
- Samsung electronics co., ltd. (20250132257). SEMICONDUCTOR DEVICE
- Samsung Electronics Co., Ltd. Patent Application Trends in 2024
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2024
- Samsung electronics Co., Ltd. Patent Application Trends in 2024
- Samsung electronics CO., LTD. Patent Application Trends in 2025
- SAMSUNG ELECTRONICS CO., LTD. Patent Application Trends in 2025
- Samsung Electronics Co., Ltd. patent applications on April 24th, 2025
- Samsung Electronics Co., Ltd. patent applications on August 15th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on August 15th, 2024
- Samsung Electronics Co., Ltd. patent applications on August 1st, 2024
- Samsung Electronics Co., Ltd. patent applications on December 19th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 19th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 27th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on February 27th, 2025
- Samsung Electronics Co., Ltd. patent applications on January 2nd, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on January 2nd, 2025
- Samsung Electronics Co., Ltd. patent applications on July 25th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on July 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 20th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 20th, 2025
- Samsung Electronics Co., Ltd. patent applications on March 27th, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 27th, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation Patent Application Trends in 2025
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- Taiwan Semiconductor Manufacturing Co., Ltd Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. Patent Application Trends in 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company Limited Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company Patent Application Trends in 2025
- Taiwan semiconductor manufacturing company, ltd. (20240203885). SEMICONDUCTOR DEVICE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379563). REDUCING RC DELAY IN SEMICONDUCTOR DEVICES simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250149453). SEMICONDUCTOR MEMORY DEVICE HAVING WORD LINES SURROUNDED BY MEMORY LAYERS AND METHOD OF MAKING THE SEMICONDUCTOR MEMORY DEVICE
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. Patent Application Trends in 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. Patent Application Trends in 2025
- Taiwan Semiconductor Manufacturing Company, LTD. patent applications on February 6th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 23rd, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on June 20th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 6th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 8th, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024