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Category:C23C16/34
Subcategories
This category has the following 70 subcategories, out of 70 total.
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Pages in category "C23C16/34"
The following 73 pages are in this category, out of 73 total.
1
- 18074197. MULTI-PULSE DEPOSITION PROCESSES simplified abstract (Applied Materials, Inc.)
- 18228220. METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE simplified abstract (Samsung Electronics Co., Ltd.)
- 18396857. METHOD AND SYSTEM FOR DEPOSITING BORON CARBON NITRIDE simplified abstract (ASM IP Holding B.V.)
- 18398146. ETCHING METHOD AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18482560. ARC REDUCTION AND RF CONTROL FOR ELECTROSTATIC CHUCKS IN SEMICONDUCTOR PROCESSING (Applied Materials, Inc.)
- 18515842. Semiconductor Device, Method and Machine of Manufacture simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18520621. METHOD OF FORMING PATTERN STRUCTURE INCLUDING SILICON NITRIDE simplified abstract (SEMES CO., LTD.)
- 18522825. PRECOAT METHOD FOR SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
- 18544315. PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD simplified abstract (Samsung Display Co., LTD.)
- 18547888. FILM FORMING METHOD, PROCESSING APPARATUS, AND PROCESSING SYSTEM simplified abstract (Tokyo Electron Limited)
- 18555055. SURFACE TREATMENT METHOD AND SUBSTRATE TREATMENT DEVICE simplified abstract (Tokyo Electron Limited)
- 18591336. SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
- 18592646. SUBSTRATE PROCESSING APPARATUS, CLEANING METHOD, SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
- 18609433. IMMERSION EXPOSURE TOOL simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18611093. METHOD OF PROCESSING SUBSTRATE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM simplified abstract (Kokusai Electric Corporation)
- 18623278. n-TYPE GaN CRYSTAL, GaN WAFER, AND GaN CRYSTAL, GaN WAFER AND NITRIDE SEMICONDUCTOR DEVICE PRODUCTION METHOD simplified abstract (Mitsubishi Chemical Corporation)
- 18638530. FLEXIBLE DISPLAY AND METHOD OF MANUFACTURING THE SAME simplified abstract (Samsung Display Co., LTD.)
- 18650014. PECVD OF SIBN THIN FILMS WITH LOW LEAKAGE CURRENT simplified abstract (Applied Materials, Inc.)
- 18660318. Adjusting Work Function Through Adjusting Deposition Temperature simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18709780. CONFORMAL, CARBON-DOPED SILICON NITRIDE FILMS AND METHODS THEREOF (Lam Research Corporation)
- 18740699. METHOD, SYSTEM, AND APPARATUS FOR DEPOSITION OF TRANSITION METAL FILM (ASM IP Holding B.V.)
- 18819238. FILM-FORMING METHOD AND FILM-FORMING APPARATUS (Tokyo Electron Limited)
- 18884897. SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM (Kokusai Electric Corporation)
- 18907141. CYCLIC PEALD/PECVD THIN FILM ENCAPSULATION BARRIER (Applied Materials, Inc.)
- 18914403. Method and system for filling a gap (ASM IP Holding B.V.)
- 18930631. METHOD FOR FORMING A RARE-EARTH-CONTAINING LAYER, APPARATUS, AND STRUCTURE (ASM IP Holding B.V.)
- 18957283. TIN OXIDE MANDRELS IN PATTERNING (Lam Research Corporation)
- 18965507. CYCLIC LOW TEMPERATURE FILM GROWTH PROCESSES (Tokyo Electron Limited)
- 18970001. METHODS FOR DEPOSITING A MOLYBDENUM NITRIDE FILM ON A SURFACE OF A SUBSTRATE BY A CYCLICAL DEPOSITION PROCESS AND RELATED SEMICONDUCTOR DEVICE STRUCTURES INCLUDING A MOLYBDENUM NITRIDE FILM (ASM IP Holding B.V.)
- 18975559. MODIFIED STACKS FOR 3D NAND (Applied Materials, Inc.)
- 18975622. SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE (Kokusai Electric Corporation)
A
- Applied materials, inc. (20240258109). METHOD OF DEPOSITING A TUNGSTEN CONTAINING LAYER simplified abstract
- Applied materials, inc. (20240304437). PECVD OF SIBN THIN FILMS WITH LOW LEAKAGE CURRENT simplified abstract
- Applied materials, inc. (20250003061). INTERFACE TUNING FOR EROSION AND CORROSION RESISTANT COATINGS FOR SEMICONDUCTOR COMPONENTS
- Applied materials, inc. (20250006474). INTERCONNECT CAPPING WITH INTEGRATED PROCESS STEPS
- Applied materials, inc. (20250101578). MODIFIED STACKS FOR 3D NAND
- Applied materials, inc. (20250113718). CYCLIC PEALD/PECVD THIN FILM ENCAPSULATION BARRIER
- Applied materials, inc. (20250116001). ARC REDUCTION AND RF CONTROL FOR ELECTROSTATIC CHUCKS IN SEMICONDUCTOR PROCESSING
- Applied Materials, Inc. patent applications on April 10th, 2025
- Applied Materials, Inc. patent applications on April 3rd, 2025
- Applied Materials, Inc. patent applications on August 1st, 2024
- Applied Materials, Inc. patent applications on January 23rd, 2025
- Applied Materials, Inc. patent applications on January 2nd, 2025
- Applied Materials, Inc. patent applications on January 30th, 2025
- Applied Materials, Inc. patent applications on March 27th, 2025
- Applied Materials, Inc. patent applications on March 6th, 2025
- Applied Materials, Inc. patent applications on September 12th, 2024
B
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- Samsung display co., ltd. (20240240320). PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD simplified abstract
- Samsung display co., ltd. (20240266440). FLEXIBLE DISPLAY AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Samsung Display Co., LTD. patent applications on August 8th, 2024
- Samsung Display Co., LTD. patent applications on July 18th, 2024
- Samsung electronics co., ltd. (20240213017). METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE simplified abstract
- Samsung electronics co., ltd. (20240429043). METHOD OF FORMING INSULATING FILM BY USING ATOMIC LAYER DEPOSITION
- Samsung Electronics Co., Ltd. patent applications on December 26th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 27th, 2024
T
- Taiwan semiconductor manufacturing co., ltd. (20240093357). Semiconductor Device, Method and Machine of Manufacture simplified abstract
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 21st, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240231240). IMMERSION EXPOSURE TOOL simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240297080). Adjusting Work Function Through Adjusting Deposition Temperature simplified abstract
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on July 11th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 5th, 2024
- Tokyo electron limited (20240240307). METHOD OF FORMING SILICON NITRIDE FILM simplified abstract
- Tokyo electron limited (20240297209). FILM FORMING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND PROCESSING SYSTEM simplified abstract
- Tokyo Electron Limited patent applications on February 6th, 2025
- Tokyo Electron Limited patent applications on July 18th, 2024
- Tokyo Electron Limited patent applications on September 5th, 2024