Applied materials, inc. (20250113718). CYCLIC PEALD/PECVD THIN FILM ENCAPSULATION BARRIER
CYCLIC PEALD/PECVD THIN FILM ENCAPSULATION BARRIER
Organization Name
Inventor(s)
Wenhui Li of Santa Clara CA US
Kevin Chen of Santa Clara CA US
Yu-Min Wang of Santa Clara CA US
Zongkai Wu of Santa Clara CA US
Kwang Soo Huh of Palo Alto CA US
CYCLIC PEALD/PECVD THIN FILM ENCAPSULATION BARRIER
This abstract first appeared for US patent application 20250113718 titled 'CYCLIC PEALD/PECVD THIN FILM ENCAPSULATION BARRIER
Original Abstract Submitted
embodiments described herein relate to an optical device and methods of forming an optical device. the optical device includes a substrate, an illumination source, a capping layer, an encapsulation layer, and a passivation layer. the encapsulation layer includes a first atomic layer deposition (ald) layer, a chemical vapor deposition (cvd) layer, and a second ald layer. the method includes disposing a capping layer over an illumination layer, the illumination layer disposed over a substrate in a processing chamber; disposing a first atomic layer deposition (ald) layer over the capping layer; disposing a chemical vapor deposition (cvd) layer over the first ald layer; disposing a second ald layer over the cvd layer; and disposing a passivation layer over the second ald layer.