Pages that link to "Category:Kimin Jun of Portland OR US"
The following pages link to Category:Kimin Jun of Portland OR US:
Displaying 37 items.
- Intel corporation (20250006678). PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE HYBRID BONDING (← links)
- Intel corporation (20250006695). PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING (← links)
- Intel corporation (20250105046). SELECTIVE LAYER TRANSFER (← links)
- Intel corporation (20250105136). CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES (← links)
- 18473905. SELECTIVE LAYER TRANSFER (Intel Corporation) (← links)
- 18473887. CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES (Intel Corporation) (← links)
- Intel corporation (20250108459). PROTECTIVE DEBONDING STACK FOR SELECTIVE TRANSFER (← links)
- Intel corporation (20250112077). ARCHITECTURES FOR FACILITATING BONDING IN WAFER-LEVEL SELECTIVE TRANSFERS (← links)
- Intel corporation (20250112127). IC ASSEMBLIES WITH METAL PASSIVATION AT BOND INTERFACES (← links)
- Intel corporation (20250112155). CONFORMAL COATINGS WITH SPATIALLY DEFINED SURFACE ENERGIES FOR DIE-TO-WAFER SELF-ALIGNMENT ASSISTED ASSEMBLY (← links)
- Intel corporation (20250112173). PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES (← links)
- Intel corporation (20250112177). SELF-ALIGNMENT ASSISTED ASSEMBLY ON A STRUCTURAL WAFER FOR HYBRID BONDED DIE STACKS (← links)
- Intel corporation (20250112181). BONDING STRUCTURES HAVING NON-VERTICAL EDGES FOR SELF-ALIGNMENT ASSISTED ASSEMBLY OF INTEGRATED CIRCUIT DIE STACKS (← links)
- Intel corporation (20250112186). TILT MITIGATION IN SELF-ALIGNMENT ASSISTED ASSEMBLY OF IC DIE (← links)
- Intel corporation (20250112187). IC ASSEMBLIES WITH SELF-ALIGNMENT STRUCTURES HAVING ZERO MISALIGNMENT (← links)
- Intel corporation (20250112196). SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES (← links)
- Intel corporation (20250112199). SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES (← links)
- Intel corporation (20250112200). HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED ASSEMBLY (← links)
- Intel corporation (20250112208). SELECTIVE LAYER TRANSFER WITH GLASS PANELS (← links)
- Intel corporation (20250112218). SELECTIVE LAYER TRANSFER PROCESS IMPROVEMENTS (← links)
- Patent Applications Report for 4th Apr 2025 (← links)
- 18478770. PROTECTIVE DEBONDING STACK FOR SELECTIVE TRANSFER (INTEL CORPORATION) (← links)
- 18478391. ARCHITECTURES FOR FACILITATING BONDING IN WAFER-LEVEL SELECTIVE TRANSFERS (INTEL CORPORATION) (← links)
- 18374573. IC ASSEMBLIES WITH METAL PASSIVATION AT BOND INTERFACES (INTEL CORPORATION) (← links)
- 18374532. CONFORMAL COATINGS WITH SPATIALLY DEFINED SURFACE ENERGIES FOR DIE-TO-WAFER SELF-ALIGNMENT ASSISTED ASSEMBLY (INTEL CORPORATION) (← links)
- 18374577. PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES (INTEL CORPORATION) (← links)
- 18374516. SELF-ALIGNMENT ASSISTED ASSEMBLY ON A STRUCTURAL WAFER FOR HYBRID BONDED DIE STACKS (INTEL CORPORATION) (← links)
- 18374522. BONDING STRUCTURES HAVING NON-VERTICAL EDGES FOR SELF-ALIGNMENT ASSISTED ASSEMBLY OF INTEGRATED CIRCUIT DIE STACKS (INTEL CORPORATION) (← links)
- 18374574. TILT MITIGATION IN SELF-ALIGNMENT ASSISTED ASSEMBLY OF IC DIE (INTEL CORPORATION) (← links)
- 18374578. IC ASSEMBLIES WITH SELF-ALIGNMENT STRUCTURES HAVING ZERO MISALIGNMENT (INTEL CORPORATION) (← links)
- 18478843. SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES (INTEL CORPORATION) (← links)
- 18374520. SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES (INTEL CORPORATION) (← links)
- 18374559. HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED ASSEMBLY (INTEL CORPORATION) (← links)
- 18478686. SELECTIVE LAYER TRANSFER WITH GLASS PANELS (INTEL CORPORATION) (← links)
- 18478831. SELECTIVE LAYER TRANSFER PROCESS IMPROVEMENTS (INTEL CORPORATION) (← links)
- 20250218847. Configurable Carrier Tra (Intel) (← links)
- 20250220925. Three-dimensional Memory Arc (Intel) (← links)