Intel corporation (20250112196). SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES
SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES
Organization Name
Inventor(s)
Johanna Swan of Scottsdale AZ US
Adel Elsherbini of Chandler AZ US
Thomas L. Sounart of Chandler AZ US
Tushar Kanti Talukdar of Wilsonville OR US
Brandon M. Rawlings of Chandler AZ US
Andrey Vyatskikh of Hillsboro OR US
Shawna M. Liff of Scottsdale AZ US
SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES
This abstract first appeared for US patent application 20250112196 titled 'SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES
Original Abstract Submitted
an embodiment discloses an electronic device, comprising an integrated circuit (ic) die, a mesa structure formed on the ic die, and a die bonded to the ic die through the mesa structure.
Categories:
- Intel corporation
- Feras Eid of Chandler AZ US
- Johanna Swan of Scottsdale AZ US
- Adel Elsherbini of Chandler AZ US
- Thomas L. Sounart of Chandler AZ US
- Tushar Kanti Talukdar of Wilsonville OR US
- Brandon M. Rawlings of Chandler AZ US
- Kimin Jun of Portland OR US
- Andrey Vyatskikh of Hillsboro OR US
- Shawna M. Liff of Scottsdale AZ US
- H01L23/00
- H01L21/48
- H01L21/683
- H01L23/373
- H01L23/38
- H01L23/433
- H01L23/538
- H10N19/00
- CPC H01L24/32