Category:Kimin Jun of Portland OR US
Kimin Jun
Kimin Jun from Portland OR US has applied for patents in technology areas such as H01L23/00, H01L23/31, H01L23/544 with intel corporation.
Patents
Pages in category "Kimin Jun of Portland OR US"
The following 37 pages are in this category, out of 37 total.
1
- 18374516. SELF-ALIGNMENT ASSISTED ASSEMBLY ON A STRUCTURAL WAFER FOR HYBRID BONDED DIE STACKS (INTEL CORPORATION)
- 18374520. SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES (INTEL CORPORATION)
- 18374522. BONDING STRUCTURES HAVING NON-VERTICAL EDGES FOR SELF-ALIGNMENT ASSISTED ASSEMBLY OF INTEGRATED CIRCUIT DIE STACKS (INTEL CORPORATION)
- 18374532. CONFORMAL COATINGS WITH SPATIALLY DEFINED SURFACE ENERGIES FOR DIE-TO-WAFER SELF-ALIGNMENT ASSISTED ASSEMBLY (INTEL CORPORATION)
- 18374559. HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED ASSEMBLY (INTEL CORPORATION)
- 18374573. IC ASSEMBLIES WITH METAL PASSIVATION AT BOND INTERFACES (INTEL CORPORATION)
- 18374574. TILT MITIGATION IN SELF-ALIGNMENT ASSISTED ASSEMBLY OF IC DIE (INTEL CORPORATION)
- 18374577. PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES (INTEL CORPORATION)
- 18374578. IC ASSEMBLIES WITH SELF-ALIGNMENT STRUCTURES HAVING ZERO MISALIGNMENT (INTEL CORPORATION)
- 18473887. CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES (Intel Corporation)
- 18473905. SELECTIVE LAYER TRANSFER (Intel Corporation)
- 18478391. ARCHITECTURES FOR FACILITATING BONDING IN WAFER-LEVEL SELECTIVE TRANSFERS (INTEL CORPORATION)
- 18478686. SELECTIVE LAYER TRANSFER WITH GLASS PANELS (INTEL CORPORATION)
- 18478770. PROTECTIVE DEBONDING STACK FOR SELECTIVE TRANSFER (INTEL CORPORATION)
- 18478831. SELECTIVE LAYER TRANSFER PROCESS IMPROVEMENTS (INTEL CORPORATION)
- 18478843. SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES (INTEL CORPORATION)
I
- Intel corporation (20250006678). PACKAGING ARCHITECTURE FOR WAFER-SCALE KNOWN-GOOD-DIE HYBRID BONDING
- Intel corporation (20250006695). PACKAGING ARCHITECTURE INCLUDING COMPENSATION LAYERS FOR WAFER-SCALE KNOWN-GOOD-DIE TO KNOWN-GOOD-DIE HYBRID BONDING
- Intel corporation (20250105046). SELECTIVE LAYER TRANSFER
- Intel corporation (20250105136). CAPACITORS FOR USE WITH INTEGRATED CIRCUIT PACKAGES
- Intel corporation (20250108459). PROTECTIVE DEBONDING STACK FOR SELECTIVE TRANSFER
- Intel corporation (20250112077). ARCHITECTURES FOR FACILITATING BONDING IN WAFER-LEVEL SELECTIVE TRANSFERS
- Intel corporation (20250112127). IC ASSEMBLIES WITH METAL PASSIVATION AT BOND INTERFACES
- Intel corporation (20250112155). CONFORMAL COATINGS WITH SPATIALLY DEFINED SURFACE ENERGIES FOR DIE-TO-WAFER SELF-ALIGNMENT ASSISTED ASSEMBLY
- Intel corporation (20250112173). PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES
- Intel corporation (20250112177). SELF-ALIGNMENT ASSISTED ASSEMBLY ON A STRUCTURAL WAFER FOR HYBRID BONDED DIE STACKS
- Intel corporation (20250112181). BONDING STRUCTURES HAVING NON-VERTICAL EDGES FOR SELF-ALIGNMENT ASSISTED ASSEMBLY OF INTEGRATED CIRCUIT DIE STACKS
- Intel corporation (20250112186). TILT MITIGATION IN SELF-ALIGNMENT ASSISTED ASSEMBLY OF IC DIE
- Intel corporation (20250112187). IC ASSEMBLIES WITH SELF-ALIGNMENT STRUCTURES HAVING ZERO MISALIGNMENT
- Intel corporation (20250112196). SELECTIVE TRANSFER OF THERMAL MANAGEMENT DIES
- Intel corporation (20250112199). SELF-ALIGNMENT ASSISTED ASSEMBLY OF MULTI-LEVEL DIE COMPLEXES
- Intel corporation (20250112200). HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED ASSEMBLY
- Intel corporation (20250112208). SELECTIVE LAYER TRANSFER WITH GLASS PANELS
- Intel corporation (20250112218). SELECTIVE LAYER TRANSFER PROCESS IMPROVEMENTS