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18473905. SELECTIVE LAYER TRANSFER (Intel Corporation)

From WikiPatents

SELECTIVE LAYER TRANSFER

Organization Name

Intel Corporation

Inventor(s)

Adel Elsherbini of Chandler AZ US

Thomas L. Sounart of Chandler AZ US

Feras Eid of Chandler AZ US

Tushar Kanti Talukdar of Wilsonville OR US

Brandon M. Rawlings of Chandler AZ US

Andrey Vyatskikh of Hillsboro OR US

Carlos Bedoya Arroyave of Portland OR US

Kimin Jun of Portland OR US

Shawna M. Liff of Scottsdale AZ US

Grant M. Kloster of Lake Oswego OR US

Richard F. Vreeland of Beaverton OR US

William P. Brezinski of Beaverton OR US

Johanna Swan of Scottsdale AZ US

SELECTIVE LAYER TRANSFER

This abstract first appeared for US patent application 18473905 titled 'SELECTIVE LAYER TRANSFER

Original Abstract Submitted

Methods of selectively transferring portions of layers between substrates, and devices and systems formed using the same, are disclosed herein. In one embodiment, a first substrate with a layer of integrated circuit (IC) components is received, and a second substrate with one or more adhesive areas is received. The first substrate is partially bonded to the second substrate, such that a subset of IC components on the first substrate are bonded to the adhesive areas on the second substrate. The first substrate is then separated from the second substrate, and the subset of IC components bonded to the second substrate are separated from the first substrate and remain on the second substrate.

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