Intel corporation (20250112173). PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES
PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES
Organization Name
Inventor(s)
Adel Elsherbini of Chandler AZ US
Thomas Sounart of Chandler AZ US
PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES
This abstract first appeared for US patent application 20250112173 titled 'PRE-ASSEMBLY WARPAGE COMPENSATION OF THIN DIE STRUCTURES
Original Abstract Submitted
a surface of an integrated circuit (ic) die structure and a substrate to which the ic die structure is to be bonded include biphilic regions suitable for liquid droplet formation and droplet-based fine alignment of the ic die structure to the substrate. to ensure warpage of the ic die structure does not interfere with droplet-based fine alignment process, an ic die structure of greater thickness is aligned to the substrate and thickness of the ic die structure subsequently reduced. in some embodiments, a back side of the ic die structure is polished back post attachment. in some alternative embodiments, the ic die structure includes sacrificial die-level carrier is removed after fine alignment and/or bonding.