20250218847. Configurable Carrier Tra (Intel)
CONFIGURABLE CARRIER FOR TRANSFER AND SELF-ASSEMBLY OF MULTIPLE INTEGRATED CIRCUIT DEVICES
Abstract: a first carrier comprises a plurality of regions. each region comprises a first zone and a second zone. the second zone comprises a portion that surrounds the first zone. each first zone comprises a hydrophilic surface, and each second zone comprises a hydrophobic surface. a first liquid is deposited on the first carrier. the plurality of regions are aligned with a plurality of dies on a second carrier. the dies are transferred from the second carrier to the first carrier. a second liquid is deposited on a substrate, which includes a plurality of bond areas. each die bond area comprises a hydrophilic surface. the dies are transferred from the first carrier to the substrate.
Inventor(s): Veronica A. Strong, Feras Eid, Chien-An Chen, Wenhao Li, Bhaskar Jyoti Krishnatreya, Thomas Sounart, Adel Elsherbini, Kimin Jun, Johanna Swan
CPC Classification: H01L21/6835 ({using temporarily an auxiliary support})
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- Patent Applications
- Intel Corporation
- CPC H01L21/6835
- Veronica A. Strong of Brussels BE
- Feras Eid of Chandler AZ US
- Chien-An Chen of San Jose CA US
- Wenhao Li of Chandler AZ US
- Bhaskar Jyoti Krishnatreya of Hillsboro OR US
- Thomas Sounart of Chandler AZ US
- Adel Elsherbini of Chandler AZ US
- Kimin Jun of Portland OR US
- Johanna Swan of Scottsdale AZ US