Category:Ruilong Xie of Niskayuna NY US
Appearance
Ruilong Xie
Ruilong Xie from Niskayuna NY US has applied for patents in technology areas such as H01L23/48, H01L21/8238, H01L27/092 with international business machines corporation.
Patents
Pages in category "Ruilong Xie of Niskayuna NY US"
The following 150 pages are in this category, out of 150 total.
1
- 18370611. SEMICONDUCTOR DEVICE WITH GATE CONTACT OVER AN ACTIVE REGION (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18371889. STACKED FETS CONTAINING DIFFERENT SHAPED INNER SPACERS (International Business Machines Corporation)
- 18374881. FIELD-EFFECT TRANSISTOR CRESCENT-SHAPED DIELECTRIC ISOLATION (International Business Machines Corporation)
- 18374924. SEMICONDUCTOR STRUCTURE WITH PLACEHOLDER POSITION MARGIN (International Business Machines Corporation)
- 18377672. DUAL SIDE STACKED TRANSISTOR (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18378803. LATE SRAM CUT WITH BACKSIDE CONTACT (International Business Machines Corporation)
- 18379353. CO-INTEGRATION OF S/D METAL CONTACT CUT AND WRAP-AROUND-CONTACT (International Business Machines Corporation)
- 18382471. HYBRID HIGH BANDWIDTH MEMORY STACK (International Business Machines Corporation)
- 18388074. MODULE-LESS NANOSHEET FETS WITH DIRECT BACKSIDE CONTACT (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18466871. METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR) (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18468279. DIELECTRIC AND TWO-DIMENSIONAL SEMICONDUCTOR MATERIAL NANOSHEET DEVICES (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18468729. BACKSIDE OFFSET GATE CONTACT FOR BACKSIDE SPACING (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18468977. NANOSHEET DEVICE WITH ALIGNED ISOLATION AND EPITAXIAL GROWTH (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18469618. METAL TIP-TO-TIP SCALING (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18469836. BOTTOM CONTACT JUMPERS FOR STACKED FIELD EFFECT TRANSISTOR SEMICONDUCTORS (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18470117. CMOS INTEGRATION FOR DOPED PLACEHOLDER AS DIRECT BACKSIDE CONTACT (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18470354. STRAIN INDUCING TRENCHES FOR SOURCE/DRAIN REGIONS (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18470646. BACKSIDE RESISTOR CONNECTED TO BACKSIDE BACK END OF LINE NETWORK (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18470655. BACKSIDE FUSE CONNECTED TO BACKSIDE BACK END OF THE LINE NETWORK (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18470664. BACKSIDE FUSE STRUCTURE UTILIZING BACKSIDE CONTACT (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18470669. SOURCE/DRAIN REGIONS FOR NANOSHEET DEVICES (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18471408. SELF-ALIGNED CONTACT FOR FIELD EFFECT TRANSISTORS (International Business Machines Corporation)
- 18471645. SPACER TO AVOID SOURCE AND DRAIN SHORTING (International Business Machines Corporation)
- 18471778. SPACER PROTECTING SEMICONDUCTOR SUBSTRATE UNDER PASSIVE DEVICE DURING BACKSIDE CONTACT FORMATION (International Business Machines Corporation)
- 18472470. SPACER MODIFICATION FOR SELECTIVE AIRGAP SPACER FORMATION (International Business Machines Corporation)
- 18474574. GATE METAL JUMPER IN STACKED FET SRAM (International Business Machines Corporation)
- 18476545. DUAL-SIDE BRIDGE CHIPS CONNECTING TWO SEMICONDUCTOR CHIPS WITH STACKED SEMICONDUCTOR DEVICES (International Business Machines Corporation)
- 18476816. ACTIVE PRIME REGION WITH CONDUCTIVE BYPASS (International Business Machines Corporation)
- 18482213. ELECTRONIC FUSE VIA AND LOGIC DEVICE CO-INTEGRATION WITH BACKSIDE POWER DELIVERY NETWORK (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18483913. CUT SHAPES FOR BACKSIDE METALS (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18484470. SELF-ALIGNED TOPVIA AND METAL LINE WITH INCREASED HEIGHT (International Business Machines Corporation)
- 18484550. LOGIC AND MEMORY DEVICE WITH COMMON VERTICAL CHANNEL (International Business Machines Corporation)
- 18485346. LINE-VIA-LINE STRUCTURE FOR BSPDN (International Business Machines Corporation)
- 18486724. GATE CUT STRUCTURE INCLUDING AN AIRGAP (International Business Machines Corporation)
- 18487156. FORKSHEET TRANSISTOR STRUCTURE (International Business Machines Corporation)
- 18488236. SEMICONDUCTOR STRUCTURES WITH MULTI-STAGE VIAS (International Business Machines Corporation)
- 18489056. STACKED FET WITH ASYMMETRIC CELL BOUNDARY (International Business Machines Corporation)
- 18490134. CONTACT PLACEHOLDER FORMATION FOR DIFFERENT DEVICE TYPES (International Business Machines Corporation)
- 18490298. ANGLED GATE CUT REGION (International Business Machines Corporation)
- 18490867. INNER SPACER HAVING A CURVED PORTION (International Business Machines Corporation)
- 18495832. BONDING A WAFER WITH A SUBSTRATE TO A WAFER WITH BACKSIDE INTERCONNECT WIRING (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18497311. BOTTOM ISOLATION EXTENSION REGION (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18498097. FORKSHEET TRANSISTOR WITH ADVANCED CELL HEIGHT SCALING (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18499266. VIA CONNECTION IN MIDDLE BEOL WIRING (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18501129. SEMICONDUCTOR STRUCTURES WITH INTEGRATED ELECTROSTATIC DISCHARGE CLAMP CIRCUITS (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18502125. FULL AND HALF SINGLE DIFFUSION BREAK WITH STACKED FET (INTERNATIONAL BUSINESS MACHINES CORPORATION)
- 18503322. FORKSHEET FIELD EFFECT TRANSISTOR INCLUDING T-SHAPED BACKBONE (INTERNATIONAL BUSINESS MACHINES CORPORATION)
2
- 20250167076. Ba (International Business Machines)
- 20250167118. St (International Business Machines)
- 20250169131. Se (International Business Machines)
- 20250169138. Ex (International Business Machines)
- 20250169145. Se (International Business Machines)
- 20250169147. Op (International Business Machines)
- 20250169160. Du (International Business Machines)
- 20250169168. Ba (International Business Machines)
- 20250169172. Me (International Business Machines)
- 20250169177. Ba (International Business Machines)
- 20250176214. Ba (INTERNATIONAL BUSINESS MACHINES)
- 20250176246. Wr (INTERNATIONAL BUSINESS MACHINES)
- 20250183145. Co (INTERNATIONAL BUSINESS MACHINES)
- 20250183172. Ch (INTERNATIONAL BUSINESS MACHINES)
- 20250185291. Em (INTERNATIONAL BUSINESS MACHINES)
- 20250185292. Ex (INTERNATIONAL BUSINESS MACHINES)
- 20250185298. U- (INTERNATIONAL BUSINESS MACHINES)
- 20250185299. En (INTERNATIONAL BUSINESS MACHINES)
- 20250185307. Mu (INTERNATIONAL BUSINESS MACHINES)
- 20250185314. Se (INTERNATIONAL BUSINESS MACHINES)
- 20250185315. Co (INTERNATIONAL BUSINESS MACHINES)
- 20250185331. St (INTERNATIONAL BUSINESS MACHINES)
- 20250185337. Se (INTERNATIONAL BUSINESS MACHINES)
- 20250185345. (INTERNATIONAL BUSINESS MACHINES)
- 20250185352. (INTERNATIONAL BUSINESS MACHINES)
- 20250185356. Se (INTERNATIONAL BUSINESS MACHINES)
- 20250185361. St (INTERNATIONAL BUSINESS MACHINES)
- 20250185368. Ba (INTERNATIONAL BUSINESS MACHINES)
- 20250185377. Co (INTERNATIONAL BUSINESS MACHINES)
- 20250218863. Or (INTERNATIONAL BUSINESS MACHINES)
- 20250218941. Po (INTERNATIONAL BUSINESS MACHINES)
- 20250218944. Po (INTERNATIONAL BUSINESS MACHINES)
- 20250218946. As (INTERNATIONAL BUSINESS MACHINES)
- 20250218977. Co (INTERNATIONAL BUSINESS MACHINES)
- 20250219022. Em (INTERNATIONAL BUSINESS MACHINES)
- 20250220987. Ch (INTERNATIONAL BUSINESS MACHINES)
- 20250221002. Ai (INTERNATIONAL BUSINESS MACHINES)
- 20250221028. Se (INTERNATIONAL BUSINESS MACHINES)
- 20250221029. Sh (INTERNATIONAL BUSINESS MACHINES)
- 20250221030. St (INTERNATIONAL BUSINESS MACHINES)
- 20250234631. Sh (International Business Machines)
- 20250605 Patent Applications Report for June 5th, 2025
- 20250612 Patent Applications Report for June 12th, 2025
- 20250619 Patent Applications Report for June 19th, 2025
- 20250703 Patent Applications Report for July 3rd, 2025
I
- International business machines corporation (20250006590). DOUBLE-SIDED INTEGRATED CIRCUIT WITH STABILIZING CAGE
- International business machines corporation (20250006629). DOUBLE-SIDED INTEGRATED CIRCUIT WITH DAMAGE SENSOR
- International business machines corporation (20250006638). PITCH CHANGE BETWEEN METAL LINES
- International business machines corporation (20250006663). DOUBLE-SIDED INTEGRATED CIRCUIT WITH ELECTROSTATIC GUARD RING
- International business machines corporation (20250006664). THREE DIMENSIONAL MECHANICALLY BOLTING STAPLE FILL
- International business machines corporation (20250006730). STACKED TRANSISTORS WITH DIELECTRIC INSULATOR LAYERS
- International business machines corporation (20250006786). STACKED FET WITH LOW PARASITIC-CAPACITANCE GATE
- International business machines corporation (20250006820). TUNNEL NANOSHEET FET FORMATION WITH INCREASED CURRENT
- International business machines corporation (20250008719). SRAM FORMATION FOR VERTICAL FET TRANSISTOR WITH BACKSIDE CONTACT
- International business machines corporation (20250096074). BACKSIDE OFFSET GATE CONTACT FOR BACKSIDE SPACING
- International business machines corporation (20250096126). BACKSIDE FUSE CONNECTED TO BACKSIDE BACK END OF THE LINE NETWORK
- International business machines corporation (20250096127). BACKSIDE FUSE STRUCTURE UTILIZING BACKSIDE CONTACT
- International business machines corporation (20250096128). BOTTOM CONTACT JUMPERS FOR STACKED FIELD EFFECT TRANSISTOR SEMICONDUCTORS
- International business machines corporation (20250096132). METAL TIP-TO-TIP SCALING
- International business machines corporation (20250098198). NANOSHEET DEVICE WITH ALIGNED ISOLATION AND EPITAXIAL GROWTH
- International business machines corporation (20250098215). SEMICONDUCTOR DEVICE WITH GATE CONTACT OVER AN ACTIVE REGION
- International business machines corporation (20250098229). STRAIN INDUCING TRENCHES FOR SOURCE/DRAIN REGIONS
- International business machines corporation (20250098240). DIELECTRIC AND TWO-DIMENSIONAL SEMICONDUCTOR MATERIAL NANOSHEET DEVICES
- International business machines corporation (20250098245). SOURCE/DRAIN REGIONS FOR NANOSHEET DEVICES
- International business machines corporation (20250098268). CMOS INTEGRATION FOR DOPED PLACEHOLDER AS DIRECT BACKSIDE CONTACT
- International business machines corporation (20250098288). BACKSIDE RESISTOR CONNECTED TO BACKSIDE BACK END OF LINE NETWORK
- International business machines corporation (20250098322). METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)
- International business machines corporation (20250105061). SELF-ALIGNED CONTACT FOR FIELD EFFECT TRANSISTORS
- International business machines corporation (20250107059). GATE METAL JUMPER IN STACKED FET SRAM
- International business machines corporation (20250107197). SPACER TO AVOID SOURCE AND DRAIN SHORTING
- International business machines corporation (20250107218). STACKED FETS CONTAINING DIFFERENT SHAPED INNER SPACERS
- International business machines corporation (20250107219). SPACER MODIFICATION FOR SELECTIVE AIRGAP SPACER FORMATION
- International business machines corporation (20250107227). SPACER PROTECTING SEMICONDUCTOR SUBSTRATE UNDER PASSIVE DEVICE DURING BACKSIDE CONTACT FORMATION
- International business machines corporation (20250112121). ACTIVE PRIME REGION WITH CONDUCTIVE BYPASS
- International business machines corporation (20250112203). DUAL-SIDE BRIDGE CHIPS CONNECTING TWO SEMICONDUCTOR CHIPS WITH STACKED SEMICONDUCTOR DEVICES
- International business machines corporation (20250113537). SEMICONDUCTOR STRUCTURE WITH PLACEHOLDER POSITION MARGIN
- International business machines corporation (20250113560). FIELD-EFFECT TRANSISTOR CRESCENT-SHAPED DIELECTRIC ISOLATION
- International business machines corporation (20250118630). DUAL SIDE STACKED TRANSISTOR
- International business machines corporation (20250118660). ELECTRONIC FUSE VIA AND LOGIC DEVICE CO-INTEGRATION WITH BACKSIDE POWER DELIVERY NETWORK
- International business machines corporation (20250118661). CUT SHAPES FOR BACKSIDE METALS
- International business machines corporation (20250125193). SELF-ALIGNED TOPVIA AND METAL LINE WITH INCREASED HEIGHT
- International business machines corporation (20250125250). LINE-VIA-LINE STRUCTURE FOR BSPDN
- International business machines corporation (20250125261). SEMICONDUCTOR STRUCTURES WITH MULTI-STAGE VIAS
- International business machines corporation (20250126768). LATE SRAM CUT WITH BACKSIDE CONTACT
- International business machines corporation (20250126798). LOGIC AND MEMORY DEVICE WITH COMMON VERTICAL CHANNEL
- International business machines corporation (20250126829). GATE CUT STRUCTURE INCLUDING AN AIRGAP
- International business machines corporation (20250126838). CO-INTEGRATION OF S/D METAL CONTACT CUT AND WRAP-AROUND-CONTACT
- International business machines corporation (20250126884). FORKSHEET TRANSISTOR STRUCTURE
- International business machines corporation (20250132161). ANGLED GATE CUT REGION
- International business machines corporation (20250132293). HYBRID HIGH BANDWIDTH MEMORY STACK
- International business machines corporation (20250133799). INNER SPACER HAVING A CURVED PORTION
- International business machines corporation (20250133816). STACKED FET WITH ASYMMETRIC CELL BOUNDARY
- International business machines corporation (20250133827). CONTACT PLACEHOLDER FORMATION FOR DIFFERENT DEVICE TYPES
- International business machines corporation (20250140648). BONDING A WAFER WITH A SUBSTRATE TO A WAFER WITH BACKSIDE INTERCONNECT WIRING
- International business machines corporation (20250140650). VIA CONNECTION IN MIDDLE BEOL WIRING
- International business machines corporation (20250142892). FORKSHEET TRANSISTOR WITH ADVANCED CELL HEIGHT SCALING
- International business machines corporation (20250142903). BOTTOM ISOLATION EXTENSION REGION
- International business machines corporation (20250151342). FULL AND HALF SINGLE DIFFUSION BREAK WITH STACKED FET
- International business machines corporation (20250151345). MODULE-LESS NANOSHEET FETS WITH DIRECT BACKSIDE CONTACT
- International business machines corporation (20250151373). FORKSHEET FIELD EFFECT TRANSISTOR INCLUDING T-SHAPED BACKBONE
- International business machines corporation (20250151400). SEMICONDUCTOR STRUCTURES WITH INTEGRATED ELECTROSTATIC DISCHARGE CLAMP CIRCUITS