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Create the page "Applied Materials, Inc" on this wiki! See also the search results found.
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- =HIGH-K DIELECTRIC MATERIALS COMPRISING ZIRCONIUM OXIDE UTILIZED IN DISPLAY DEVICES= [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]4 KB (562 words) - 04:11, 16 April 2024
- =IMPRINT COMPOSITIONS WITH PASSIVATED NANOPARTICLES AND MATERIALS AND PROCESSES FOR MAKING THE SAME= [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]4 KB (541 words) - 04:58, 25 March 2024
- [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]4 KB (600 words) - 02:56, 16 April 2024
- [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]5 KB (778 words) - 02:56, 16 April 2024
- '''Summary of the patent applications from Applied Materials, Inc. on October 5th, 2023''' * Applied Materials, Inc. has recently filed patents related to various technologies and methods in6 KB (658 words) - 01:40, 12 October 2023
- '''Summary of the patent applications from Applied Materials, Inc. on November 9th, 2023''' Applied Materials, Inc. has recently filed several patents related to semiconductor processing and9 KB (1,094 words) - 03:47, 4 December 2023
- '''Summary of the patent applications from Applied Materials, Inc. on November 30th, 2023''' Applied Materials, Inc. has recently filed several patents related to various aspects of semicondu8 KB (935 words) - 06:38, 7 December 2023
- ==Patent applications for Applied Materials, Inc. on December 14th, 2023== ...H-VOLTAGE SET AND RESET OPERATIONS simplified abstract (Applied Materials, Inc.)|17838718]])===43 KB (6,334 words) - 18:40, 1 January 2024
- 20240033878. MINIMIZING SUBSTRATE BOW DURING POLISHING simplified abstract (Applied Materials, Inc.)[[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]5 KB (735 words) - 09:38, 1 February 2024
- '''Summary of the patent applications from Applied Materials, Inc. on March 21st, 2024''' ...ption material with photocurable compounds and ultraviolet light absorbing materials to form pixel isolation structures on LED substrates.6 KB (672 words) - 08:06, 27 March 2024
- [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]4 KB (621 words) - 02:55, 16 April 2024
- [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]4 KB (548 words) - 02:57, 16 April 2024
- ==Patent applications for Applied Materials, Inc. on April 4th, 2024== ===METHOD FOR CMP TEMPERATURE CONTROL ([[Applied Materials, Inc. (18537574). METHOD FOR CMP TEMPERATURE CONTROL simplified abstract|18537575 KB (548 words) - 02:57, 16 April 2024
- [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]5 KB (634 words) - 04:11, 16 April 2024
- '''Summary of the patent applications from Applied Materials, Inc. on April 11th, 2024''' ...4F vertical dynamic random-access memory devices, high dielectric constant materials for thin film transistor structures, and bipolar electrostatic chucks for m5 KB (587 words) - 11:04, 16 April 2024
- [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]4 KB (549 words) - 05:09, 12 January 2024
- [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]4 KB (614 words) - 10:56, 25 January 2024
- [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]4 KB (556 words) - 04:00, 2 February 2024
- 20240047232. HIGH CONDUCTANCE DIVERT LINE ARCHITECTURE simplified abstract (Applied Materials, Inc.)[[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]4 KB (583 words) - 03:44, 9 February 2024
- [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]4 KB (507 words) - 03:44, 9 February 2024
Page text matches
- '''Summary of the patent applications from Applied Materials, Inc. on April 11th, 2024''' ...4F vertical dynamic random-access memory devices, high dielectric constant materials for thin film transistor structures, and bipolar electrostatic chucks for m5 KB (587 words) - 11:04, 16 April 2024
- ==Patent applications for Applied Materials, Inc. on April 4th, 2024== ===METHOD FOR CMP TEMPERATURE CONTROL ([[Applied Materials, Inc. (18537574). METHOD FOR CMP TEMPERATURE CONTROL simplified abstract|18537575 KB (548 words) - 02:57, 16 April 2024
- '''Summary of the patent applications from Applied Materials, Inc. on March 21st, 2024''' ...ption material with photocurable compounds and ultraviolet light absorbing materials to form pixel isolation structures on LED substrates.6 KB (672 words) - 08:06, 27 March 2024
- [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]4 KB (597 words) - 05:00, 25 March 2024
- [[:Category:micron technology, inc.|micron technology, inc.]] [[Category:micron technology, inc.]]4 KB (587 words) - 04:17, 26 April 2024
- =SILICON-AND-CARBON-CONTAINING MATERIALS WITH LOW DIELECTRIC CONSTANTS= [[Applied Materials, Inc.]]2 KB (256 words) - 14:57, 11 November 2023
- [[:Category:micron technology, inc.|micron technology, inc.]] [[Category:micron technology, inc.]]3 KB (410 words) - 04:17, 26 April 2024
- [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]2 KB (276 words) - 10:26, 4 December 2023
- [[:Category:Micron Technology, Inc.|Micron Technology, Inc.]] [[Category:Micron Technology, Inc.]]3 KB (497 words) - 05:50, 18 March 2024
- '''Summary of the patent applications from Applied Materials, Inc. on November 30th, 2023''' Applied Materials, Inc. has recently filed several patents related to various aspects of semicondu8 KB (935 words) - 06:38, 7 December 2023
- =PIEZOELECTRIC MATERIALS FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BONDING AND ASSOCIATED SYSTEMS AND [[:Category:Micron Technology, Inc.|Micron Technology, Inc.]]2 KB (330 words) - 05:06, 4 March 2024
- [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]2 KB (336 words) - 10:26, 4 December 2023
- [[:Category:apple inc.|apple inc.]] [[Category:apple inc.]]4 KB (489 words) - 06:46, 10 April 2024
- [[:Category:LG Electronics Inc.|LG Electronics Inc.]] [[Category:LG Electronics Inc.]]3 KB (391 words) - 06:42, 8 May 2024
- 20240033878. MINIMIZING SUBSTRATE BOW DURING POLISHING simplified abstract (Applied Materials, Inc.)[[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]5 KB (735 words) - 09:38, 1 February 2024
- =IMPRINT COMPOSITIONS WITH PASSIVATED NANOPARTICLES AND MATERIALS AND PROCESSES FOR MAKING THE SAME= [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]4 KB (541 words) - 04:58, 25 March 2024
- [[:Category:lg electronics inc.|lg electronics inc.]] [[Category:lg electronics inc.]]3 KB (371 words) - 08:38, 12 April 2024
- [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]2 KB (322 words) - 10:26, 4 December 2023
- [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]] [[Category:Applied Materials, Inc.]]2 KB (308 words) - 10:26, 4 December 2023
- =HIGH-K DIELECTRIC MATERIALS COMPRISING ZIRCONIUM OXIDE UTILIZED IN DISPLAY DEVICES= [[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]4 KB (562 words) - 04:11, 16 April 2024