Applied Materials, Inc. patent applications published on November 9th, 2023

Summary of the patent applications from Applied Materials, Inc. on November 9th, 2023

Applied Materials, Inc. has recently filed several patents related to semiconductor processing and equipment. These patents cover various aspects of the semiconductor manufacturing process, including impedance tuning, defect correction, film deposition, etching, and substrate handling.

In terms of impedance tuning, one patent application describes a method for measuring voltage and current signals of a transmission line in a semiconductor processing tool. These analog signals are then converted into digital signals, and a u-vector is calculated from them. The real components of the u-vector are used to determine the position of a first capacitor, while the imaginary components are used to determine the position of a second capacitor.

Another patent application focuses on correcting defects in microLED structures caused by a mesa etch process. The method involves a dry etch process that incrementally removes a small outer layer of the structures, preserving their overall shape. The resulting smooth surface is suitable for the application of a dielectric layer. The dry etch process consists of two steps: the first gas reacts with the surface to form a gallium compound layer, and the second gas selectively removes that layer. This process can be plasma-based or reactive thermal etches.

Applied Materials, Inc. has also filed patents related to film deposition and etching. One patent application describes methods for depositing transition metal dichalcogenide films on a substrate, as well as converting transition metal oxide films to transition metal dichalcogenide films. The process involves exposing the substrate to metal and chalcogenide precursors to form the desired films.

In terms of etching, one patent application describes a method for etching metal-containing features using a pattern mask. The exposed portion of the feature is then etched and replaced with a filler dielectric, reducing unwanted conductivity between adjacent features.

Applied Materials, Inc. has also developed innovative equipment for semiconductor processing. One patent application describes a process chamber with coaxial lift devices, including a bottom bowl lift and a pedestal lift. These lifts can independently move and tilt to create a small and symmetric process volume, improving film uniformity on processed substrates.

In summary, Applied Materials, Inc. has recently filed patents covering various aspects of semiconductor processing, including impedance tuning, defect correction, film deposition, etching, and equipment design. These patents demonstrate the company's commitment to advancing semiconductor manufacturing processes and improving the efficiency and quality of semiconductor devices.

Notable applications:

• Impedance tuning in semiconductor processing tools.
• Defect correction in microLED structures.
• Deposition of transition metal dichalcogenide films.
• Etching of metal-containing features.
• Coaxial lift devices for process chambers.
• Semiconductor processing using carbon-containing precursors.
• Plasma etch pulse for sample etching.
• Semiconductor processing using silicon and carbon precursors.

Patent applications for Applied Materials, Inc. on November 9th, 2023

OZONE-BASED LOW TEMPERATURE SILICON OXIDE COATING FOR PHARMACEUTICAL APPLICATIONS (18199625)

Main Inventor

Fei Wang

CHEMICAL MECHANICAL POLISHING TEMPERATURE SCANNING APPARATUS FOR TEMPERATURE CONTROL (18356604)

Main Inventor

Hari Soundararajan

Carrier Head Membrane With Regions of Different Roughness (18351260)

Main Inventor

Young J. Paik

COMPLIANT INNER RING FOR A CHEMICAL MECHANICAL POLISHING SYSTEM (17735655)

Main Inventor

Jeonghoon Oh

POLISHING HEAD WITH LOCAL INNER RING DOWNFORCE CONTROL (17735674)

Main Inventor

Jeonghoon Oh

METHODS, SYSTEMS, AND APPARATUS FOR INKJET PRINTING SELF-ASSEMBLED MONOLOAYER (SAM) STRUCTURES ON SUBSTRATES (18142305)

Main Inventor

Yingdong LUO

ALD CYCLE TIME REDUCTION USING PROCESS CHAMBER LID WITH TUNABLE PUMPING (18224206)

Main Inventor

Muhannad Mustafa

APPARATUS AND METHODS TO PROMOTE WAFER EDGE TEMPERATURE UNIFORMITY (17862138)

Main Inventor

Zubin HUANG

RF MEASUREMENT FROM A TRANSMISSION LINE SENSOR (17737682)

Main Inventor

David Coumou

METHODS AND MECHANISMS FOR ADJUSTING FILM DEPOSITION PARAMETERS DURING SUBSTRATE MANUFACTURING (17737318)

Main Inventor

Mitesh Sanghvi

HIGH BANDWIDTH ARCHITECTURE FOR CENTRALIZED COHERENT CONTROL AT THE EDGE OF PROCESSING TOOL (17737659)

Main Inventor

David Coumou

CONTROL AND PREDICTION OF MULTIPLE PLASMA COUPLING SURFACES AND CORRESPONDING POWER TRANSFER (17737670)

Main Inventor

David Coumou

OPTICAL DEVICE IMPROVEMENT (18131997)

Main Inventor

Yue CHEN

TEMPERATURE AND BIAS CONTROL OF EDGE RING (18356915)

Main Inventor

James ROGERS

AUTONOMOUS FREQUENCY RETRIEVAL FROM PLASMA POWER SOURCES (17737665)

Main Inventor

David Coumou

LARGE AREA GAPFILL USING VOLUMETRIC EXPANSION (17737340)

Main Inventor

Supriya Ghosh

SILICON-AND-CARBON-CONTAINING MATERIALS WITH LOW DIELECTRIC CONSTANTS (17737328)

Main Inventor

Zeqing Shen

PULSED ETCH PROCESS (17738526)

Main Inventor

Yifeng Zhou

LOW TEMPERATURE CARBON GAPFILL (17737311)

Main Inventor

Supriya Ghosh

WAFER FILM FRAME CARRIER (17735623)

Main Inventor

Jason A. Rye

COAXIAL LIFT DEVICE WITH DYNAMIC LEVELING (18356553)

Main Inventor

Jason M. SCHALLER

COAXIAL LIFT DEVICE WITH DYNAMIC LEVELING (18356579)

Main Inventor

Jason M. SCHALLER

SELF-ALIGNMENT ETCHING OF INTERCONNECT LAYERS (18224861)

Main Inventor

Suketu Arun PARIKH

CONFORMAL METAL DICHALCOGENIDES (17739856)

Main Inventor

Chandan Das

DRY TREATMENT FOR SURFACE LOSS REMOVAL IN MICRO-LED STRUCTURES (17736843)

Main Inventor

Michel Khoury

IMPEDANCE TUNING UTILITY OF VECTOR SPACE DEFINED BY TRANSMISSION LINE QUANTITIES (17737677)

Main Inventor

David Coumou