Micron technology, inc. (20240130121). MICROELECTRONIC DEVICES INCLUDING A DOPED DIELECTRIC MATERIAL, METHODS OF FORMING THE MICROELECTRONIC DEVICES, AND RELATED SYSTEMS simplified abstract
Contents
- 1 MICROELECTRONIC DEVICES INCLUDING A DOPED DIELECTRIC MATERIAL, METHODS OF FORMING THE MICROELECTRONIC DEVICES, AND RELATED SYSTEMS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 MICROELECTRONIC DEVICES INCLUDING A DOPED DIELECTRIC MATERIAL, METHODS OF FORMING THE MICROELECTRONIC DEVICES, AND RELATED SYSTEMS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Potential Applications
- 1.6 Problems Solved
- 1.7 Benefits
- 1.8 Potential Commercial Applications
- 1.9 Possible Prior Art
- 1.10 Original Abstract Submitted
MICROELECTRONIC DEVICES INCLUDING A DOPED DIELECTRIC MATERIAL, METHODS OF FORMING THE MICROELECTRONIC DEVICES, AND RELATED SYSTEMS
Organization Name
Inventor(s)
John D. Hopkins of Meridian ID (US)
Jordan D. Greenlee of Boise ID (US)
MICROELECTRONIC DEVICES INCLUDING A DOPED DIELECTRIC MATERIAL, METHODS OF FORMING THE MICROELECTRONIC DEVICES, AND RELATED SYSTEMS - A simplified explanation of the abstract
This abstract first appeared for US patent application 20240130121 titled 'MICROELECTRONIC DEVICES INCLUDING A DOPED DIELECTRIC MATERIAL, METHODS OF FORMING THE MICROELECTRONIC DEVICES, AND RELATED SYSTEMS
Simplified Explanation
The patent application describes a microelectronic device with alternating tiers of dielectric and conductive materials, pillars extending through the tiers, and a doped dielectric material with dopants and conductive contact structures.
- The microelectronic device includes tiers of alternating dielectric and conductive materials.
- Pillars extend through the tiers to provide structural support.
- A doped dielectric material with dopants and conductive contact structures is adjacent to the tiers.
Potential Applications
This technology could be applied in:
- Semiconductor manufacturing
- Integrated circuits
- Microprocessors
Problems Solved
This technology addresses issues such as:
- Enhancing conductivity in microelectronic devices
- Improving structural integrity
- Increasing performance and efficiency
Benefits
The benefits of this technology include:
- Enhanced electrical properties
- Improved reliability
- Increased functionality in microelectronic devices
Potential Commercial Applications
The potential commercial applications of this technology could be in:
- Electronics industry
- Telecommunications sector
- Consumer electronics market
Possible Prior Art
One possible prior art for this technology could be:
- Microelectronic devices with doped dielectric materials and conductive structures
=== What are the specific materials used in the doped dielectric material? The specific materials used in the doped dielectric material are not mentioned in the abstract.
=== How do the pillars contribute to the overall performance of the microelectronic device? The abstract does not provide details on how the pillars contribute to the overall performance of the microelectronic device.
Original Abstract Submitted
a microelectronic device comprising tiers of alternating dielectric materials and conductive materials, pillars extending through the tiers, and a doped dielectric material adjacent to the tiers. the doped dielectric material comprises a heterogeneous chemical composition comprising one or more dopants. conductive contact structures are in the doped dielectric material. additional microelectronic devices, microelectronic systems, and methods of forming microelectronic devices are disclosed.
