20240025009. POLISHING PADS HAVING SELECTIVELY ARRANGED POROSITY simplified abstract (Applied Materials, Inc.)

POLISHING PADS HAVING SELECTIVELY ARRANGED POROSITY

Organization Name

Applied Materials, Inc.

Inventor(s)

Aniruddh Jagdish Khanna of Fremont CA (US)

Jason G. Fung of Santa Clara CA (US)

Puneet Narendra Jawali of San Jose CA (US)

Rajeev Bajaj of Fremont CA (US)

Adam Wade Manzonie of Eagle ID (US)

Nandan Baradanahalli Kenchappa of Santa Clara CA (US)

Veera Raghava Reddy Kakireddy of Santa Clara CA (US)

Joonho An of Pyeongtaek (KR)

Jaeseok Kim of Cupertino CA (US)

Mayu Yamamura of San Mateo CA (US)

POLISHING PADS HAVING SELECTIVELY ARRANGED POROSITY - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240025009 titled 'POLISHING PADS HAVING SELECTIVELY ARRANGED POROSITY

Simplified Explanation

The abstract describes a patent application for polishing pads that have discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material. In one embodiment, the polishing pad includes multiple polishing elements, each with a polishing surface and sidewalls that create channels between them. Some of the polishing elements are made of a continuous phase of polymer material with regions of different porosity.

• The polishing pad has regions of varying porosity within a continuous phase of polymer material.
• The polishing elements have polishing surfaces and sidewalls that define channels between them.
• Some of the polishing elements are made of a continuous phase of polymer material with regions of different porosity.
• The second porosity is less than the first porosity.

Potential Applications:

• Polishing and finishing of various materials, such as metals, ceramics, and glass.
• Semiconductor manufacturing processes.
• Optical lens polishing.
• Precision machining and surface preparation.

Problems Solved:

• Provides improved control over the polishing process.
• Allows for selective polishing of different materials or surfaces.
• Reduces the risk of over-polishing or damage to delicate surfaces.
• Enhances the efficiency and effectiveness of polishing operations.

Benefits:

• Increased precision and accuracy in polishing operations.
• Reduced time and cost in achieving desired surface finishes.
• Enhanced surface quality and smoothness.
• Improved control over material removal rates.
• Versatility in polishing different materials and surfaces.

Original Abstract Submitted

polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein. in one embodiment a polishing pad features a plurality of polishing elements each comprising a polishing surface and sidewalls extending downwardly from the polishing surface to define a plurality of channels disposed between the polishing elements, wherein one or more of the polishing elements is formed of a continuous phase of polymer material having one or more first regions comprising a first porosity and a second region comprising a second porosity, wherein the second porosity is less than the first porosity.