US Patent Application 17968608. OPERATION OF CLAMPING RETAINER FOR CHEMICAL MECHANICAL POLISHING simplified abstract
Contents
OPERATION OF CLAMPING RETAINER FOR CHEMICAL MECHANICAL POLISHING
Organization Name
Inventor(s)
Steven M. Zuniga of Soquel CA (US)
Jeonghoon Oh of Saratoga CA (US)
Andrew J. Nagengast of Sunnyvale CA (US)
OPERATION OF CLAMPING RETAINER FOR CHEMICAL MECHANICAL POLISHING - A simplified explanation of the abstract
This abstract first appeared for US patent application 17968608 titled 'OPERATION OF CLAMPING RETAINER FOR CHEMICAL MECHANICAL POLISHING
Simplified Explanation
The patent application describes a method of polishing substrates using a polishing pad and a retainer. The method involves the following steps:
- Bringing the substrate into contact with the polishing pad and creating relative motion between them.
- Using a retainer to hold the substrate on the polishing pad.
- During the polishing process, the diameter of the inner surface of the retainer is alternated between reducing and increasing.
- Reducing the diameter of the inner surface of the retainer clamps the substrate, while increasing the diameter releases the substrate from clamping.
- The substrate is continuously retained on the polishing pad throughout the process.
This method aims to improve the polishing process by providing a mechanism to securely hold the substrate in place while allowing for easy release when needed.
Original Abstract Submitted
A method of polishing includes bringing a substrate into contact with a polishing pad and generating relative motion between the substrate and the polishing pad, retaining the substrate on the polishing pad with a retainer, and during polishing of the substrate alternating between reducing a diameter of an inner surface of the retainer to clamp the substrate and increasing the diameter of the inner surface of the retainer to release the substrate from clamping while continuing to retain the substrate.
