US Patent Application 18365527. DETERMINATION OF SUBSTRATE LAYER THICKNESS WITH POLISHING PAD WEAR COMPENSATION simplified abstract
DETERMINATION OF SUBSTRATE LAYER THICKNESS WITH POLISHING PAD WEAR COMPENSATION
Organization Name
Inventor(s)
Benjamin Cherian of San Jose CA (US)
Kiran Lall Shrestha of San Jose CA (US)
DETERMINATION OF SUBSTRATE LAYER THICKNESS WITH POLISHING PAD WEAR COMPENSATION - A simplified explanation of the abstract
This abstract first appeared for US patent application 18365527 titled 'DETERMINATION OF SUBSTRATE LAYER THICKNESS WITH POLISHING PAD WEAR COMPENSATION
Simplified Explanation
The patent application describes a method for training a neural network to estimate the thickness profile of a test substrate during a polishing process.
- The method involves obtaining two ground truth thickness profiles for the test substrate.
- Two thickness profiles are also obtained using an in-situ monitoring system while the test substrate is on polishing pads of different thicknesses.
- An estimated thickness profile for another thickness value is generated by interpolating between the two profiles.
- The neural network is then trained using the estimated thickness profile.
Original Abstract Submitted
A method of training a neural network includes obtaining two ground truth thickness profiles a test substrate, obtaining two thickness profiles for the test substrate as measured by an in-situ monitoring system while the test substrate is on polishing pads of different thicknesses, generating an estimated thickness profile for another thickness value that is between the two thickness values by interpolating between the two profiles, and training a neural network using the estimated thickness profile.
