20240038527. FORMING FILMS WITH IMPROVED FILM QUALITY simplified abstract (Applied Materials, Inc.)

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FORMING FILMS WITH IMPROVED FILM QUALITY

Organization Name

Applied Materials, Inc.

Inventor(s)

Bhargav S. Citla of Fremont CA (US)

Srinivas D. Nemani of Saratoga CA (US)

Purvam Modi of Sunnyvale CA (US)

Ellie Y. Yieh of San Jose CA (US)

FORMING FILMS WITH IMPROVED FILM QUALITY - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240038527 titled 'FORMING FILMS WITH IMPROVED FILM QUALITY

Simplified Explanation

The method described in this patent application involves depositing a flowable film on a substrate using different precursor flows and plasma effluents. The film is then partially removed from the sidewall of a feature within the substrate, leaving a remaining portion. The hydrogen content of the remaining portion is reduced to obtain a densified film, which is then treated according to a film treatment process.

  • The method involves depositing a flowable film on a substrate using precursor flows and plasma effluents.
  • A portion of the flowable film is removed from the sidewall of a feature within the substrate.
  • The remaining portion of the flowable film is densified by reducing its hydrogen content.
  • The densified film is then treated according to a film treatment process.

Potential Applications:

  • This method can be used in the manufacturing of microelectronics and semiconductor devices.
  • It can be applied in the production of thin film coatings for various industries, such as optics, solar cells, and displays.
  • The method may find applications in the fabrication of microelectromechanical systems (MEMS) and nanoelectromechanical systems (NEMS).

Problems Solved:

  • The method allows for precise control over the deposition and removal of the flowable film, enabling the creation of complex structures with high accuracy.
  • By reducing the hydrogen content and densifying the film, the method improves the film's mechanical and electrical properties.
  • The film treatment process further enhances the performance and stability of the densified film.

Benefits:

  • The method offers a more efficient and controlled approach to depositing and modifying flowable films on substrates.
  • It enables the production of high-quality films with improved properties, leading to enhanced device performance.
  • The method allows for the fabrication of intricate structures and patterns, expanding the possibilities for device design and functionality.


Original Abstract Submitted

a method includes depositing a flowable film on a substrate by providing a first input flow, the first input flow including plasma effluents of a first precursor, removing a portion of the flowable film from a sidewall of a feature defined within the substrate to obtain a remaining portion of the flowable film by providing a second input flow, the second input flow including plasma effluents of a second precursor, reducing hydrogen content of the remaining portion of the flowable film to obtain a densified film by providing a third input flow, the third input flow including plasma effluents of a third precursor, and treating the densified film in accordance with a film treatment process.

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