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Category:H05K3/46
Subcategories
This category has the following 42 subcategories, out of 42 total.
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Pages in category "H05K3/46"
The following 121 pages are in this category, out of 121 total.
1
- 17849453. LITHOGRAPHIC STRAIN GAUGE IN AN ELECTRICALLY CONDUCTING SUBSTRATE simplified abstract (Microsoft Technology Licensing, LLC)
- 17894070. SEMICONDUCTOR PACKAGING WITH REDUCED STANDOFF HEIGHT simplified abstract (Micron Technology, Inc.)
- 17956338. EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE ARCHITECTURE simplified abstract (Intel Corporation)
- 17957330. NON-PLANAR ANTENNAS FOR PORTABLE STORAGE DEVICES simplified abstract (Western Digital Technologies, Inc.)
- 17968438. INFORMATION HANDLING SYSTEM AND PERIPHERAL PRINTED CIRCUIT BOARD HAVING NON-HOMOGENEOUS SUBSTRATE MATERIAL AND INTEGRATED THERMAL SOLUTION simplified abstract (Dell Products L.P.)
- 18094683. FLEXIBLE PRINTED CIRCUIT AND MANUFACTURING METHOD THEREOF, ELECTRONIC DEVICE MODULE AND ELECTRONIC DEVICE simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)
- 18130719. HIGHLY INTEGRATED POWER ELECTRONICS AND METHODS OF MANUFACTURING THE SAME simplified abstract (TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.)
- 18159132. METHOD OF MANUFACTURING PACKAGE UNIT, PACKAGE UNIT, ELECTRONIC MODULE, AND EQUIPMENT simplified abstract (CANON KABUSHIKI KAISHA)
- 18200224. PRINTED CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18208415. REDISTRIBUTION SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING REDISTRIBUTION SUBSTRATE simplified abstract (Samsung Electronics Co., Ltd.)
- 18212867. PRINTED CIRCUIT BOARD simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18231936. CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18235062. INTERPOSER BOARD AND CIRCUIT BOARD INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18264093. ELECTRONIC DEVICE AND METHOD OF FABRICATING ELECTRONIC DEVICE (BOE TECHNOLOGY GROUP CO., LTD.)
- 18271544. CIRCUIT BOARD AND PACKAGE SUBSTRATE COMPRISING SAME simplified abstract (LG INNOTEK CO., LTD.)
- 18335145. ENVIRONMENTALLY FRIENDLY MULTI-LAYER PRINTED CIRCUIT BOARD (Intel Corporation)
- 18344147. CROSSTALK NOISE REDUCTION BY HIGH PERMEABILITY INSULATOR (International Business Machines Corporation)
- 18346327. MOUNTING OF CAPACITORS ON PRINTED CIRCUIT BOARDS FOR NON-VOLATILE MEMORY DEVICES simplified abstract (Western Digital Technologies, Inc.)
- 18346566. SYSTEMS AND METHODS FOR A LOW-PROFILE RECTIFIER FOR EV WIRELESS CHARGING USING EMBEDDED PCB (TOYOTA JIDOSHA KABUSHIKI KAISHA)
- 18346566. SYSTEMS AND METHODS FOR A LOW-PROFILE RECTIFIER FOR EV WIRELESS CHARGING USING EMBEDDED PCB (Toyota Motor Engineering & Manufacturing North America, Inc.)
- 18382321. CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC COMPONENT PACKAGE INCLUDING THE SAME simplified abstract (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18383969. REDUCED PRINTED CIRCUIT BOARD EXPANSION IN INTEGRATED SENSOR-LENS ASSEMBLIES (GoPro, Inc.)
- 18400022. PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE simplified abstract (Huawei Technologies Co., Ltd.)
- 18416591. WIRING BOARD, MANUFACTURING METHOD OF WIRING BOARD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC DEVICE simplified abstract (CANON KABUSHIKI KAISHA)
- 18441422. PRINTED CIRCUIT BOARD (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18463397. GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICATION OF TAMPER-RESPONDENT SENSORS (International Business Machines Corporation)
- 18475920. METHODS AND APPARATUS TO MANAGE NOISE FOR TIMING CIRCUITRY (Intel Corporation)
- 18480343. WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC DEVICE simplified abstract (CANON KABUSHIKI KAISHA)
- 18485825. SYSTEMS AND METHODS FOR GENERATING UNIFORM CIRCUIT BOARD THICKNESS (Dell Products L.P.)
- 18502990. SYSTEMS AND METHODS FOR OPTIMIZING METAL WEIGHT OF CONDUCTIVE LAYERS OF CIRCUIT BOARD (Dell Products L.P.)
- 18503462. CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
- 18534734. ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE simplified abstract (InnoLux Corporation)
- 18542381. PACKAGED INTEGRATED CIRCUIT HAVING PACKAGE SUBSTRATE WITH INTEGRATED ISOLATION CIRCUIT simplified abstract (Texas Instruments Incorporated)
- 18576236. SUBSTRATE JOINING STRUCTURE simplified abstract (Mitsubishi Electric Corporation)
- 18594573. THERMALLY IMPROVED SUBSTRATE STRUCTURE AND PACKAGE ASSEMBLY WITH THE SAME simplified abstract (MEDIATEK Inc.)
- 18601337. PRINTED CIRCUIT BOARD simplified abstract (Hamilton Sundstrand Corporation)
- 18629159. PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
- 18663314. PATTERNED CONDUCTIVE ARTICLE simplified abstract (3M INNOVATIVE PROPERTIES COMPANY)
- 18670986. CERAMIC SUBSTRATE, JOINED BODY, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, AND METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD simplified abstract (Kabushiki Kaisha Toshiba)
- 18678813. HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD simplified abstract (Intel Corporation)
- 18687180. PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD (Resonac Corporation)
- 18711596. PRINTED WIRING BOARD (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
- 18768907. PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF (Samsung Electro-Mechanics Co., Ltd.)
- 18782870. ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF (InnoLux Corporation)
- 18790090. PRINTED CIRCUIT BOARD (Samsung Electro-Mechanics Co., Ltd.)
- 18810911. ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME (InnoLux Corporation)
- 18892610. PATTERNED ARTICLE INCLUDING ELECTRICALLY CONDUCTIVE ELEMENTS (3M INNOVATIVE PROPERTIES COMPANY)
- 18895961. THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE (DAI NIPPON PRINTING CO., LTD.)
- 18979994. TRANSFORMER GUARD TRACE (TEXAS INSTRUMENTS INCORPORATED)
- 18980026. COMPOSITE FILM, RIGID FLEXIBLE PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE INCLUDING SAME (SAMSUNG ELECTRONICS CO., LTD.)
- 18983966. PRINTED CIRCUIT BOARD AND PACKAGE SUBSTRATE INCLUDING SAME (LG INNOTEK CO., LTD.)
3
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- Canon kabushiki kaisha (20240121885). WIRING BOARD, MANUFACTURING METHOD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC DEVICE simplified abstract
- Canon kabushiki kaisha (20240251500). WIRING BOARD, MANUFACTURING METHOD OF WIRING BOARD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC DEVICE simplified abstract
- CANON KABUSHIKI KAISHA patent applications on April 11th, 2024
- CANON KABUSHIKI KAISHA patent applications on July 25th, 2024
D
- Dell products l.p. (20240130041). INFORMATION HANDLING SYSTEM AND PERIPHERAL PRINTED CIRCUIT BOARD HAVING NON-HOMOGENEOUS SUBSTRATE MATERIAL AND INTEGRATED THERMAL SOLUTION simplified abstract
- Dell products l.p. (20250126724). SYSTEMS AND METHODS FOR GENERATING UNIFORM CIRCUIT BOARD THICKNESS
- Dell products l.p. (20250151208). SYSTEMS AND METHODS FOR OPTIMIZING METAL WEIGHT OF CONDUCTIVE LAYERS OF CIRCUIT BOARD
- Dell Products L.P. patent applications on April 17th, 2025
- Dell Products L.P. patent applications on April 18th, 2024
- Dell Products L.P. patent applications on May 8th, 2025
H
I
- Intel corporation (20240114622). EMBEDDED PASSIVES WITH CAVITY SIDEWALL INTERCONNECT IN GLASS CORE ARCHITECTURE simplified abstract
- Intel corporation (20240186227). INTEGRATED CIRCUIT PACKAGE ARCHITECTURES WITH CORE AND/OR BUILD-UP LAYERS COMPRISING SPIN-ON GLASS (SOG) simplified abstract
- Intel corporation (20240188212). PACKAGE SUBSTRATE ARCHITECTURES WITH IMPROVED COOLING simplified abstract
- Intel corporation (20240321762). HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD simplified abstract
- Intel corporation (20240422899). ENVIRONMENTALLY FRIENDLY MULTI-LAYER PRINTED CIRCUIT BOARD
- Intel corporation (20250081348). BRIDGE PRINTED CIRCUIT BOARD EMBEDDED WITHIN ANOTHER PRINTED CIRCUIT BOARD
- Intel corporation (20250107003). METHODS AND APPARATUS TO MANAGE NOISE FOR TIMING CIRCUITRY
- Intel Corporation patent applications on April 4th, 2024
- Intel Corporation patent applications on December 19th, 2024
- Intel Corporation patent applications on February 29th, 2024
- Intel Corporation patent applications on June 6th, 2024
- Intel Corporation patent applications on March 27th, 2025
- Intel Corporation patent applications on March 6th, 2025
- Intel Corporation patent applications on September 26th, 2024
- International business machines corporation (20240334616). HEAT SPREADER FOR MODIFIED EDGE COOLING simplified abstract
- International business machines corporation (20250006647). CROSSTALK NOISE REDUCTION BY HIGH PERMEABILITY INSULATOR
- International business machines corporation (20250089174). GENERATION OF RANDOM SECURITY CIRCUIT PATTERNS FOR IN-SITU FABRICATION OF TAMPER-RESPONDENT SENSORS
- International Business Machines Corporation patent applications on January 2nd, 2025
- International Business Machines Corporation patent applications on March 13th, 2025
- International Business Machines Corporation patent applications on October 3rd, 2024
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- Samsung electro-mechanics co., ltd. (20240215165). PRINTED CIRCUIT BOARD simplified abstract
- Samsung electro-mechanics co., ltd. (20250126712). PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Samsung electro-mechanics co., ltd. (20250132224). PRINTED CIRCUIT BOARD
- Samsung Electro-Mechanics Co., Ltd. patent applications on April 17th, 2025
- Samsung Electro-Mechanics Co., Ltd. patent applications on April 24th, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD. patent applications on June 27th, 2024
- SAMSUNG ELECTRO-MECHANICS CO., LTD. patent applications on March 6th, 2025
- Samsung electronics co., ltd. (20240213133). REDISTRIBUTION SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING REDISTRIBUTION SUBSTRATE simplified abstract
- Samsung electronics co., ltd. (20250081360). ELECTRONIC DEVICE INCLUDING FLEXIBLE CIRCUIT BOARD
- Samsung electronics co., ltd. (20250113442). COMPOSITE FILM, RIGID FLEXIBLE PRINTED CIRCUIT BOARD, AND ELECTRONIC DEVICE INCLUDING SAME
- Samsung Electronics Co., Ltd. patent applications on April 3rd, 2025
- SAMSUNG ELECTRONICS CO., LTD. patent applications on April 3rd, 2025
- Samsung Electronics Co., Ltd. patent applications on June 27th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 6th, 2025
T
- Texas instruments incorporated (20250112148). TRANSFORMER GUARD TRACE
- TEXAS INSTRUMENTS INCORPORATED patent applications on April 3rd, 2025
- Toyota Motor Engineering & Manufacturing North America, Inc. (20240260201). UV CURABLE DIELECTRIC MATERIALS FOR 3D PRINTING AND 3D PRINTING SYSTEMS WITH THE SAME
- Toyota Motor Engineering & Manufacturing North America, Inc. (20240260201). UV CURABLE DIELECTRIC MATERIALS FOR 3D PRINTING AND 3D PRINTING SYSTEMS WITH THE SAME simplified abstract