Samsung Electro-Mechanics Co., Ltd. patent applications on April 17th, 2025
Patent Applications by Samsung Electro-Mechanics Co., Ltd. on April 17th, 2025
Samsung Electro-Mechanics Co., Ltd.: 21 patent applications
Samsung Electro-Mechanics Co., Ltd. has applied for patents in the areas of H01G4/30 (7), H05K1/11 (7), H05K1/02 (5), H05K1/18 (4), H01G4/232 (4) H01G4/2325 (3), H05K1/115 (2), G02B9/64 (1), H05K1/0271 (1), H05K1/183 (1)
With keywords such as: layer, disposed, portion, electrode, insulating, including, surface, direction, body, and substrate in patent application abstracts.
Patent Applications by Samsung Electro-Mechanics Co., Ltd.
20250123462. OPTICAL IMAGING SYSTEM_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Ju Hwa SON of Suwon-si KR for samsung electro-mechanics co., ltd., Min Hyuk IM of Suwon-si KR for samsung electro-mechanics co., ltd., Yong Joo JO of Suwon-si KR for samsung electro-mechanics co., ltd., Ga Young AN of Suwon-si KR for samsung electro-mechanics co., ltd.
IPC Code(s): G02B9/64, G02B5/00, G02B13/00, G02B13/18, G02B27/00, H04N23/55
CPC Code(s): G02B9/64
Abstract: an optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens sequentially disposed in numerical order along an optical axis of the optical imaging system from an object side of the optical imaging system toward an imaging plane of the optical imaging system, wherein the optical imaging system satisfies 1<|f123457−f|/f, where f123457 is a composite focal length of the first to seventh lenses calculated with an index of refraction of the sixth lens set to 1.0, f is an overall focal length of the optical imaging system, and f123457 and f are expressed in a same unit of measurement.
20250125081. Coil Component_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Soon Seong Jeong of Suwon-si KR for samsung electro-mechanics co., ltd., Jong Min Lee of Suwon-si KR for samsung electro-mechanics co., ltd.
IPC Code(s): H01F27/28, H01F27/29, H01F41/04, H01F41/12
CPC Code(s): H01F27/2804
Abstract: a coil component includes an insulating substrate; a coil portion including a coil pattern, having a planar spiral shape, disposed on the insulating substrate; and a body embedding the insulating substrate and the coil portion, wherein the coil pattern comprises a first conductive layer disposed to contact the insulating substrate, and a second conductive layer disposed on the first conductive layer, wherein a thickness (t) of the insulating substrate and a thickness (t) of the first conductive layer satisfy 10≤t1/t2≤20.
20250125085. COIL COMPONENT_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Sang Jin Kim of Suwon-si KR for samsung electro-mechanics co., ltd., Boum Seock Kim of Suwon-si KR for samsung electro-mechanics co., ltd., Byeong Cheol Moon of Suwon-si KR for samsung electro-mechanics co., ltd., Ju Hwan Yang of Suwon-si KR for samsung electro-mechanics co., ltd., Han Lee of Suwon-si KR for samsung electro-mechanics co., ltd.
IPC Code(s): H01F27/30, H01F27/28, H01F27/29
CPC Code(s): H01F27/306
Abstract: a coil component includes a body, a first coil including a first coil portion having a winding axis oriented in a first direction and first and second lead-out portions, a second coil including a second coil portion having a winding axis oriented in the first direction and third and fourth lead-out portions, a coupling adjustment portion including a first region located in at least a portion of regions overlapping a first core of the first coil portion and a second core of the second coil portion in the first direction, and a second region located in at least a portion of regions surrounding the first region in a lateral direction and having magnetic permeability, different from magnetic permeability of the first region, first to fourth external electrodes respectively connected to the firth to fourth lead-out portions.
20250125087. COIL COMPONENT_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Kwang II PARK of Suwon-si KR for samsung electro-mechanics co., ltd.
IPC Code(s): H01F27/32, H01F27/29
CPC Code(s): H01F27/32
Abstract: a coil component includes a body including a first surface, a second surface facing the first surface in a first direction, and a plurality of side surfaces connecting the first surface to the second surface, a support member disposed within the body and having a through-hole, and a coil disposed on at least one surface of the support member, wherein the support member includes a first layer, a second layer disposed on both surfaces of the first layer and contacting the coil, both ends of the coil extend to both side surfaces of the body facing each other in a second direction, respectively, and the first layer extends to one of both side surfaces of the body facing each other in a third direction.
20250125091. MULTILAYERED CAPACITOR_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Yuhong Oh of Suwon-si KR for samsung electro-mechanics co., ltd., Wonmi Choi of Suwon-si KR for samsung electro-mechanics co., ltd., Sumin Shin of Suwon-si KR for samsung electro-mechanics co., ltd., Sunghwan Lee of Suwon-si KR for samsung electro-mechanics co., ltd., Byungkun Kim of Suwon-si KR for samsung electro-mechanics co., ltd., Jihye Ahn of Suwon-si KR for samsung electro-mechanics co., ltd., Dojeon Kim of Suwon-si KR for samsung electro-mechanics co., ltd.
IPC Code(s): H01G4/008, H01G4/12, H01G4/30
CPC Code(s): H01G4/008
Abstract: a multilayered capacitor according to the present disclosure includes a capacitor body that includes a dielectric layer and an internal electrode, and an external electrode that is disposed on the outside of the capacitor body, and the internal electrode contain a ni—ge alloy, and when the average content (wt %) of ge relative to ni at the center portion of the internal electrode is denoted by x and the average content (wt %) of ge relative to ni at points spaced 20 nm apart from the interface between the internal electrode and the dielectric layer toward the center portion of the internal electrode is denoted by y, the relationship between x and y satisfies expression 1:
20250125091. MULTILAYERED CAPACITOR_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Yuhong Oh of Suwon-si KR for samsung electro-mechanics co., ltd., Wonmi Choi of Suwon-si KR for samsung electro-mechanics co., ltd., Sumin Shin of Suwon-si KR for samsung electro-mechanics co., ltd., Sunghwan Lee of Suwon-si KR for samsung electro-mechanics co., ltd., Byungkun Kim of Suwon-si KR for samsung electro-mechanics co., ltd., Jihye Ahn of Suwon-si KR for samsung electro-mechanics co., ltd., Dojeon Kim of Suwon-si KR for samsung electro-mechanics co., ltd.
IPC Code(s): H01G4/008, H01G4/12, H01G4/30
CPC Code(s): H01G4/008
Abstract:
Inventor(s): Chang Min LEE of Suwon-si KR for samsung electro-mechanics co., ltd., Seong Gu KANG of Suwon-si KR for samsung electro-mechanics co., ltd., Gyeong Ju SONG of Suwon-si KR for samsung electro-mechanics co., ltd., Sang Eon PARK of Suwon-si KR for samsung electro-mechanics co., ltd., Sung Hyung KANG of Suwon-si KR for samsung electro-mechanics co., ltd., Hyun Min LIM of Suwon-si KR for samsung electro-mechanics co., ltd.
IPC Code(s): H01G4/012, H01G4/30
CPC Code(s): H01G4/012
Abstract: a multilayer electronic component may include: a body including a dielectric layer and internal electrodes alternately disposed in a first direction; and an external electrode disposed on the body and connected to the internal electrode, wherein the internal electrode may include a plurality of electrode portions and disconnection portions, and the disconnection portion may include at least one of a dielectric and a pore.
Inventor(s): Ki Hun JEON of Suwon-si KR for samsung electro-mechanics co., ltd., Ji Won LEE of Suwon-si KR for samsung electro-mechanics co., ltd., Sang Yeop KIM of Suwon-si KR for samsung electro-mechanics co., ltd.
IPC Code(s): H01G4/224, H01G2/24, H01G4/232, H01G4/30
CPC Code(s): H01G4/224
Abstract: a multilayer electronic component may include: a body including a capacitance formation portion including a dielectric layer and an internal electrode alternately disposed with the dielectric layer in a first direction, an upper cover portion disposed above the capacitance formation portion in the first direction, a lower cover portion disposed below the capacitance formation portion in the first direction, and an identification portion disposed above the upper cover portion in the first direction; and an external electrode disposed on the body, and an average thickness of the lower cover portion may be greater than an average thickness of the upper cover portion, and the identification portion may include a water-repellent material and a non-conductive heat-resistant paint.
Inventor(s): Sungsoo Kim of Suwon-si KR for samsung electro-mechanics co., ltd., Jaeyoung Na of Suwon-si KR for samsung electro-mechanics co., ltd.
IPC Code(s): H01G4/232, H01G4/12, H01G4/30
CPC Code(s): H01G4/2325
Abstract: a multi-layer ceramic electronic component includes: a ceramic body having a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface opposing each other in a third direction perpendicular to the first direction and the second direction, and including a plurality of dielectric layers, and a first internal electrode and a second internal electrode alternately disposed in the third direction while having the dielectric layer interposed therebetween; a first external electrode connected to the first internal electrode and including a first conductive layer including a first groove in a surface and a first plating layer disposed on the first conductive layer; a first coating portion disposed in the first groove and in contact with the first plating layer.
Inventor(s): Seung Ah Kim of Suwon-si KR for samsung electro-mechanics co., ltd., Chae Dong Lee of Suwon-si KR for samsung electro-mechanics co., ltd., Gyu Ho Yeon of Suwon-si KR for samsung electro-mechanics co., ltd., Kang Ha Lee of Suwon-si KR for samsung electro-mechanics co., ltd.
IPC Code(s): H01G4/232, H01G4/30
CPC Code(s): H01G4/2325
Abstract: a multilayer electronic component includes a body containing a dielectric layer and an internal electrode alternately disposed with the dielectric layer, and an external electrode disposed on the body and connected to the internal electrode. the external electrode includes a conductive resin layer including metal particles, core-shell particles including a polymer core and a metal shell disposed on at least a portion of the polymer core, and a resin. the conductive resin layer includes a first region adjacent to the body and a second region adjacent to an outside of the conductive resin layer. in at least one cross section passing through the body, an area fraction occupied by the core-shell particles in the second region is greater than an area fraction occupied by the core-shell particles in the first region.
Inventor(s): Seung Min AHN of Suwon-si KR for samsung electro-mechanics co., ltd., Hyung Duk YUN of Suwon-si KR for samsung electro-mechanics co., ltd., Dong Hyeon LEE of Suwon-si KR for samsung electro-mechanics co., ltd., Byung Jun JEON of Suwon-si KR for samsung electro-mechanics co., ltd., Chae Min PARK of Suwon-si KR for samsung electro-mechanics co., ltd., Joon Hwan KWAG of Suwon-si KR for samsung electro-mechanics co., ltd., Hong Seok KIM of Suwon-si KR for samsung electro-mechanics co., ltd.
IPC Code(s): H01G4/232, H01G4/012, H01G4/30
CPC Code(s): H01G4/2325
Abstract: a multilayer electronic component of the present disclosure may include: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; a connection portion disposed in an end of the internal electrode; an interface plating layer disposed to contact at least a portion of an end of the dielectric layer disposed between the internal electrodes and to cover the connection portion; and an external electrode disposed on the interface plating layer, wherein the connection portion may have a different crystal structure from the internal electrode.
Inventor(s): Jong Hoon YOO of Suwon-si KR for samsung electro-mechanics co., ltd., Ji Hyun LEE of Suwon-si KR for samsung electro-mechanics co., ltd., Dong Geon YOO of Suwon-si KR for samsung electro-mechanics co., ltd., Eun Hye CHO of Suwon-si KR for samsung electro-mechanics co., ltd.
IPC Code(s): H01G4/30, H01G4/008, H01G4/012, H01G4/12
CPC Code(s): H01G4/30
Abstract: a multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes, the body having a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction, and a fifth surface and a sixth surface opposing each other in a third direction, an external electrode including a lower electrode layer, the lower electrode layer disposed between extension lines of the first and second surfaces, an upper electrode layer disposed on the lower electrode layer, the upper electrode layer disposed to extend onto a portion of the first and the second surfaces, and a glass layer disposed between the lower and upper electrode layers. the lower electrode layer includes ag and a first glass. the upper electrode layer includes cu and a second glass.
20250125238. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Jin Uk LEE of Suwon-si, Gyeonggi-do KR for samsung electro-mechanics co., ltd., Gopal Garg of Suwon-si, Gyeonggi-do KR for samsung electro-mechanics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L25/065, H01L25/18
CPC Code(s): H01L23/49822
Abstract: a semiconductor package includes a first substrate including a first insulating layer and a first wiring layer disposed on or in the first insulating layer; first and second packages disposed on the first substrate, and each including a substrate, a semiconductor chip on the substrate, connection members connecting the substrate to the semiconductor chip, and a serdes chip embedded in the substrate; 1-1 connection members connecting the first substrate to the first package; and 2-1 connection members connecting the first substrate to the second package. the number of connection members of the first package is greater than the number of 1-1 connection members. the number of connection members of the second package is greater than the number of 2-1 connection members.
Inventor(s): Seung Min LEE of Suwon-si KR for samsung electro-mechanics co., ltd.
IPC Code(s): H05K1/02, H05K1/09, H05K1/11, H05K1/18, H05K3/10, H05K3/40
CPC Code(s): H05K1/0271
Abstract: a printed circuit board includes an insulating layer, a wiring layer disposed on the insulating layer and including a plurality of metal pads and at least one metal pattern, and a solder resist layer disposed on an upper portion of the insulating layer, covering at least a portion of the wiring layer, and having a plurality of first openings respectively exposing at least a portion of each of the plurality of metal pads and one or more second openings respectively exposing at least a portion of the at least one metal pattern. the one or more second openings respectively have at least two concave portions concave in a plane toward an inside of each of the second openings. the plurality of first openings and the one or more second openings are disposed in a mounting area of a semiconductor chip of the solder resist layer.
Inventor(s): Eun Su KWON of Suwon-si KR for samsung electro-mechanics co., ltd.
IPC Code(s): H05K1/02
CPC Code(s): H05K1/0296
Abstract: the present disclosure relates to a printed circuit board and a manufacturing method of the printed circuit board. the printed circuit board includes: a first insulating layer including a groove portion on an upper side; and a first wiring layer having an embedded portion embedded in the groove portion and a protruding portion protruding onto the first insulating layer. the protruding portion of the first wiring layer has a width of a lower end portion, narrower than a width of an upper end portion.
20250126707. PRINTED CIRCUIT BOARD_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Sang Won HAN of Suwon-si KR for samsung electro-mechanics co., ltd., Sang Ho JEONG of Suwon-si KR for samsung electro-mechanics co., ltd., Chang Hwa PARK of Suwon-si KR for samsung electro-mechanics co., ltd., Hyun Hu LEE of Suwon-si KR for samsung electro-mechanics co., ltd., Deok Hong JO of Suwon-si KR for samsung electro-mechanics co., ltd., Jong Eun PARK of Suwon-si KR for samsung electro-mechanics co., ltd.
IPC Code(s): H05K1/02, H05K1/09
CPC Code(s): H05K1/0298
Abstract: a printed circuit board includes an insulating layer and a wiring pattern disposed on or within the insulating layer, wherein the wiring pattern includes a first metal layer, a second metal layer disposed on an upper surface of the first metal layer, and an inorganic oxide film disposed on a side surface of the second metal layer.
20250126710. PRINTED CIRCUIT BOARD_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Man Gon KIM of Suwon-si KR for samsung electro-mechanics co., ltd., Heui Un JANG of Suwon-si KR for samsung electro-mechanics co., ltd., Jin Young HEO of Suwon-si KR for samsung electro-mechanics co., ltd.
IPC Code(s): H05K1/11
CPC Code(s): H05K1/113
Abstract: a printed circuit board includes a core layer, a plurality of first wirings disposed on the core layer, a first pad disposed on the core layer, the first pad including an adjacent portion having a side disposed to be substantially parallel to a side of an adjacent first wiring of the plurality of first wirings, and an open portion disposed to not be parallel to the adjacent wiring, among the plurality of first wirings, and a first build-up insulating layer disposed on the core layer, the first build-up insulating layer covering at least a portion of the plurality of first wirings and the first pad. the core layer includes an insulating material, substantially different from that of the first build-up insulating layer.
20250126711. PRINTED CIRCUIT BOARD_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Seung Eun LEE of Suwon-si KR for samsung electro-mechanics co., ltd., Jung Chul GONG of Suwon-si KR for samsung electro-mechanics co., ltd., Ki Hwan KIM of Suwon-si KR for samsung electro-mechanics co., ltd.
IPC Code(s): H05K1/11, H05K1/02, H05K1/18
CPC Code(s): H05K1/115
Abstract: a printed circuit board includes a substrate with first through-portion; a magnetic layer disposed in at least a portion of the first through-portion and having a second through-portion; an electronic component having at least a portion disposed in the second through-portion; a first wiring pattern disposed on an upper surface of the magnetic layer; a second wiring pattern disposed on a lower surface of the magnetic layer; and a first through-via having at least a portion surrounded by the magnetic layer, and including a first via pattern connecting the first and second wiring patterns to each other.
Inventor(s): Young Kuk Ko of Suwon-si KR for samsung electro-mechanics co., ltd., Sanghoon Kim of Suwon-si KR for samsung electro-mechanics co., ltd., Jiho Yoon of Suwon-si KR for samsung electro-mechanics co., ltd., Gyumook Kim of Suwon-si KR for samsung electro-mechanics co., ltd., Taehun Kim of Suwon-si KR for samsung electro-mechanics co., ltd., Heasung Kim of Suwon-si KR for samsung electro-mechanics co., ltd.
IPC Code(s): H05K1/11, H05K1/02, H05K3/46
CPC Code(s): H05K1/115
Abstract: a printed circuit board according to an embodiment includes: a first insulating layer; a first wiring layer buried in the first insulating layer; a first via disposed within a first via hole in the first insulating layer; a second insulating layer disposed below the first insulating layer; a second wiring layer buried in the second insulating layer; a first solder resist layer disposed on the first insulating layer; and a cavity extending along a height direction by penetrating the first solder resist layer and penetrating a portion of the first insulating layer. the cavity includes a first portion, a second portion, and a third portion having different 10 widths. along the height direction, the first portion is disposed on the second portion and the third portion is disposed on the first portion. the first via is exposed through the second portion of the cavity.
20250126715. PRINTED CIRCUIT BOARD_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Byung Hak KANG of Suwon-si KR for samsung electro-mechanics co., ltd., Seung Eun LEE of Suwon-si KR for samsung electro-mechanics co., ltd.
IPC Code(s): H05K1/14, H05K1/11, H05K3/30, H05K3/38
CPC Code(s): H05K1/144
Abstract: a printed circuit board includes a first substrate including a first wiring layer; a second substrate disposed on the first substrate and including a second wiring layer; a metal layer disposed between the first and second substrates; and a bonding layer disposed between the first and second substrates. each of the first and second substrates includes an organic material, and the bonding layer includes an inorganic material.
Inventor(s): Cheolmin Shin of Suwon-si KR for samsung electro-mechanics co., ltd., Kigon Kim of Suwon-si KR for samsung electro-mechanics co., ltd., Dongho Park of Suwon-si KR for samsung electro-mechanics co., ltd., Kangwon Kim of Suwon-si KR for samsung electro-mechanics co., ltd.
IPC Code(s): H05K1/18, H05K1/11
CPC Code(s): H05K1/183
Abstract: an embodiment of the present disclosure provides a circuit board including: an insulating layer including a first area on one surface on which an electronic component is mounted and a second area adjacent to the first area; a connection pad disposed in the first area; and a solder resist layer covering the one surface of the insulating layer and being opened to expose the connection pad. at least a portion of the solder resist layer extends from the second area to the first area, and a portion of the insulating layer is exposed from the solder resist layer in the first area.
20250126718. PRINTED CIRCUIT BOARD_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Jae Ho SHIN of Suwon-si KR for samsung electro-mechanics co., ltd., Jae Woong CHOI of Suwon-si KR for samsung electro-mechanics co., ltd.
IPC Code(s): H05K1/18, H05K1/03, H05K1/11, H05K1/14, H05K3/38
CPC Code(s): H05K1/185
Abstract: a printed circuit board includes a first substrate including a first antenna pattern; a second substrate disposed on a first substrate and including a second antenna pattern; a metal layer disposed between the first and second substrates; and a bonding layer disposed between the first and second substrates. at least one of the first and second substrates has a cavity having at least a portion disposed between the first and second antenna patterns, each of the first and second substrates includes an organic material, and the bonding layer includes an inorganic material.
Samsung Electro-Mechanics Co., Ltd. patent applications on April 17th, 2025
- Samsung Electro-Mechanics Co., Ltd.
- G02B9/64
- G02B5/00
- G02B13/00
- G02B13/18
- G02B27/00
- H04N23/55
- CPC G02B9/64
- Samsung electro-mechanics co., ltd.
- H01F27/28
- H01F27/29
- H01F41/04
- H01F41/12
- CPC H01F27/2804
- H01F27/30
- CPC H01F27/306
- H01F27/32
- CPC H01F27/32
- H01G4/008
- H01G4/12
- H01G4/30
- CPC H01G4/008
- H01G4/012
- CPC H01G4/012
- H01G4/224
- H01G2/24
- H01G4/232
- CPC H01G4/224
- CPC H01G4/2325
- CPC H01G4/30
- H01L23/498
- H01L23/00
- H01L25/065
- H01L25/18
- CPC H01L23/49822
- H05K1/02
- H05K1/09
- H05K1/11
- H05K1/18
- H05K3/10
- H05K3/40
- CPC H05K1/0271
- CPC H05K1/0296
- CPC H05K1/0298
- CPC H05K1/113
- CPC H05K1/115
- H05K3/46
- H05K1/14
- H05K3/30
- H05K3/38
- CPC H05K1/144
- CPC H05K1/183
- H05K1/03
- CPC H05K1/185