18231936. CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF simplified abstract (Samsung Electro-Mechanics Co., Ltd.)
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Organization Name
Samsung Electro-Mechanics Co., Ltd.
Inventor(s)
Changhwa Park of Suwon-si (KR)
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract
This abstract first appeared for US patent application 18231936 titled 'CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Simplified Explanation:
The disclosed circuit board includes multiple layers and components for electrical connections.
- A first insulation layer is present.
- A conductive layer is placed on the first insulation layer.
- A first via layer is embedded in the first insulation layer to connect to the conductive layer.
- A first wire layer is located beneath the first insulation layer and linked to the first via layer.
- A trench extends from the conductive layer to at least a portion of the first insulation layer.
Key Features and Innovation:
- Multiple layers for electrical connections.
- Use of vias for connecting conductive layers.
- Trench for specific routing of electrical signals.
Potential Applications:
- Electronics manufacturing.
- Circuit board design.
- Electrical engineering.
Problems Solved:
- Efficient electrical connections.
- Improved signal routing.
- Enhanced circuit board design.
Benefits:
- Enhanced electrical performance.
- Increased reliability.
- Improved signal integrity.
Commercial Applications:
Potential commercial applications include:
- Consumer electronics.
- Telecommunications equipment.
- Automotive electronics.
Questions about Circuit Board Technology: 1. How does the trench in the circuit board improve signal routing? 2. What are the advantages of using multiple layers for electrical connections?
Original Abstract Submitted
A disclosed circuit board may include: a first insulation layer, a conductive layer disposed on the first insulating layer; a first via layer disposed in the first insulating layer to be connected to the conductive layer; and a first wire layer disposed under the first insulating layer and connected to the first via layer, and a trench extending from the conductive layer to at least a portion of the first insulating layer may be disposed.