18335145. ENVIRONMENTALLY FRIENDLY MULTI-LAYER PRINTED CIRCUIT BOARD (Intel Corporation)
ENVIRONMENTALLY FRIENDLY MULTI-LAYER PRINTED CIRCUIT BOARD
Organization Name
Inventor(s)
Srinivas B Reddy of Bangalore (IN)
Jayprakash Thakur of Bangalore (IN)
Bindu Prabhakar Rao of Bangalore (IN)
ENVIRONMENTALLY FRIENDLY MULTI-LAYER PRINTED CIRCUIT BOARD
This abstract first appeared for US patent application 18335145 titled 'ENVIRONMENTALLY FRIENDLY MULTI-LAYER PRINTED CIRCUIT BOARD
Original Abstract Submitted
The present disclosure generally relates to a multi-layer printed circuit board. The multi-layer printed circuit board may include a core layer and a first prepreg layer adjacent the core layer. The core layer may include a first biodegradable material sandwiched between two electrically conducting layers. A method for forming a multi-layer printed circuit board is also provided herein.