PRINTED CIRCUIT BOARD AND PACKAGE SUBSTRATE INCLUDING SAME

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PRINTED CIRCUIT BOARD AND PACKAGE SUBSTRATE INCLUDING SAME

This abstract first appeared for US patent application 18983966 titled 'PRINTED CIRCUIT BOARD AND PACKAGE SUBSTRATE INCLUDING SAME

Original Abstract Submitted

A printed circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; and a pad disposed on the first insulating layer and exposed through the cavity; wherein the second insulating layer includes a first portion disposed on an upper surface of the first insulating layer in a region where the cavity is formed; and a second portion other than the first portion, and wherein a thickness of the first portion is smaller than a thickness of the second portion.