Samsung electro-mechanics co., ltd. (20250126712). PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Organization Name
samsung electro-mechanics co., ltd.
Inventor(s)
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
This abstract first appeared for US patent application 20250126712 titled 'PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Original Abstract Submitted
a printed circuit board according to an embodiment includes: a first insulating layer; a first wiring layer buried in the first insulating layer; a first via disposed within a first via hole in the first insulating layer; a second insulating layer disposed below the first insulating layer; a second wiring layer buried in the second insulating layer; a first solder resist layer disposed on the first insulating layer; and a cavity extending along a height direction by penetrating the first solder resist layer and penetrating a portion of the first insulating layer. the cavity includes a first portion, a second portion, and a third portion having different 10 widths. along the height direction, the first portion is disposed on the second portion and the third portion is disposed on the first portion. the first via is exposed through the second portion of the cavity.