Patent Applications by Samsung Electro-Mechanics Co., Ltd. on April 24th, 2025

Samsung Electro-Mechanics Co., Ltd.: 14 patent applications

Samsung Electro-Mechanics Co., Ltd. has applied for patents in the areas of H01G4/232 (3), H01G4/30 (3), H01G4/12 (3), G02B13/00 (3), H01F5/04 (2) G02B13/0045 (2), G02B7/006 (1), G02B7/028 (1), G02B9/62 (1), H01F5/04 (1)

With keywords such as: lens, disposed, surface, direction, optical, portion, power, layer, including, and coil in patent application abstracts.

Patent Applications by Samsung Electro-Mechanics Co., Ltd.

20250130389. LENS ASSEMBLY_simplified_abstract_(samsung electro-mechanics co., ltd.)

Inventor(s): Eun Chong LEE of Suwon-si KR for samsung electro-mechanics co., ltd.

IPC Code(s): G02B7/00, G02B7/02

CPC Code(s): G02B7/006

Abstract: a lens assembly includes a lens barrel, a lens disposed on the lens barrel, and a filter configured to filter light passing through the lens, wherein the lens barrel includes a seating portion in which the filter is disposed, and a step portion disposed facing the filter between the seating portion and an optical axis, wherein an avoidance groove formed to be concave in an optical axis direction is disposed on an upper surface of the seating portion.

20250130394. LENS ASSEMBLY_simplified_abstract_(samsung electro-mechanics co., ltd.)

Inventor(s): Eun Chong LEE of Suwon-si KR for samsung electro-mechanics co., ltd.

IPC Code(s): G02B7/02, G03B17/08, G03B17/12

CPC Code(s): G02B7/028

Abstract: a lens assembly includes a first lens barrel; a second lens barrel disposed in front of the first lens barrel while surrounding at least a portion of the first lens barrel; and a first lens disposed in front of the second lens barrel in contact with a portion of the second lens barrel, wherein a thermal conductance of the second lens barrel is higher than a thermal conductance of the first lens barrel.

20250130397. OPTICAL IMAGING SYSTEM_simplified_abstract_(samsung electro-mechanics co., ltd.)

Inventor(s): Tae Youn LEE of Suwon-si KR for samsung electro-mechanics co., ltd., Yong Joo JO of Suwon-si KR for samsung electro-mechanics co., ltd.

IPC Code(s): G02B9/62, G02B13/00, G02B13/02

CPC Code(s): G02B9/62

Abstract: an optical imaging system includes first, second, third, fourth, fifth, and sixth lenses each having a refractive power. the first to sixth lenses are sequentially disposed in ascending numerical order along an optical axis of the optical imaging system from an object side of the optical imaging system toward an imaging plane of the optical imaging system, and are the only lenses having a refractive power in the optical imaging system. a radius of curvature of an object-side surface of the fourth lens at the optical axis is greater than a radius of curvature of an object-side surface of the second lens at the optical axis and a radius of curvature of an image-side surface of the second lens at the optical axis. a thickness of the third lens is greater than a distance from an image-side surface of the third lens to the object-side surface of the fourth lens.

20250130401. OPTICAL IMAGING SYSTEM_simplified_abstract_(samsung electro-mechanics co., ltd.)

Inventor(s): Seong Il CHO of Suwon-si KR for samsung electro-mechanics co., ltd., You Jin JEONG of Suwon-si KR for samsung electro-mechanics co., ltd., Yong Joo JO of Suwon-si KR for samsung electro-mechanics co., ltd.

IPC Code(s): G02B13/00, G02B9/04

CPC Code(s): G02B13/0045

Abstract: an optical imaging system is provided. the optical imaging system includes a first lens group including at least one lens disposed toward a first optical axis; a second lens group including at least one lens disposed in a second optical axis direction perpendicular to the first optical axis direction; and a prism disposed between the first lens group and the second lens group and configured to convert a path of incident light from the first optical axis direction to the second optical axis direction, wherein the conditional expression 0.200≤d1/oal2≤0.500 is satisfied, wherein d1 is a maximum effective diameter of the first lens group, and oal2 is a distance on a second optical axis from a reflective surface of the prism to an imaging plane.

20250130402. IMAGING LENS SYSTEM_simplified_abstract_(samsung electro-mechanics co., ltd.)

Inventor(s): Hyuk Joo KIM of Suwon-si KR for samsung electro-mechanics co., ltd., Eun Chong LEE of Suwon-si KR for samsung electro-mechanics co., ltd., Kyu Min CHAE of Suwon-si KR for samsung electro-mechanics co., ltd.

IPC Code(s): G02B13/00, G02B9/62

CPC Code(s): G02B13/0045

Abstract: an imaging lens system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, and a sixth lens, sequentially arranged from an object side. the imaging lens system satisfies the following conditional expressions: −2.6<f1/f6<−2.0, and 0.26≤f/f4≤0.32, where f is a focal length of the imaging lens system, f1 is a focal length of the first lens, f4 is a focal length of the fourth lens, and f6 is a focal length of the sixth lens.

20250132077. COIL COMPONENT_simplified_abstract_(samsung electro-mechanics co., ltd.)

Inventor(s): Han LEE of Suwon-si KR for samsung electro-mechanics co., ltd., Boum Seock KIM of Suwon-si KR for samsung electro-mechanics co., ltd.

IPC Code(s): H01F5/04, H01F27/28

CPC Code(s): H01F5/04

Abstract: a coil component includes: a body; a support member disposed inside the body and having one surface and another surface opposing each other; a first coil disposed on the one surface of the support member and including a first core; a second coil disposed on the other surface of the support member and including a second core; a first lead portion disposed on the other surface of the support member and connected to the first coil; and a second lead portion disposed on the one surface of the support member and connected to the second coil, in which the first core partially overlaps the second core when viewed in a stacking direction of the first and second coils on the support member, and a length of the second coil in one direction is larger than a length of the first coil in the one direction.

20250132085. COIL COMPONENT_simplified_abstract_(samsung electro-mechanics co., ltd.)

Inventor(s): Tae Hyun KIM of Suwon-si KR for samsung electro-mechanics co., ltd., Byeong Cheol MOON of Suwon-si KR for samsung electro-mechanics co., ltd.

IPC Code(s): H01F27/29, H01F27/255, H01F27/30, H01F27/32

CPC Code(s): H01F27/292

Abstract: a coil component includes: a body having a first surface and a second surface opposing each other in a first direction, and a third surface and a fourth surface opposing each other in a second direction perpendicular to the first direction; a support member disposed inside the body and having one surface and another surface opposing each other, and a side surface connecting the one surface and the other surface to each other; a coil disposed on the support member 10 and including coil portions respectively having at least one turn and lead portions extending from respective outermost turns of the coil portions and bent toward the first surface; and external electrodes disposed on the first surface and connected to the respective lead portions.

20250132086. COIL COMPONENT_simplified_abstract_(samsung electro-mechanics co., ltd.)

Inventor(s): Byeong Cheol MOON of Suwon-si KR for samsung electro-mechanics co., ltd., Sang Jin KIM of Suwon-si KR for samsung electro-mechanics co., ltd., Boum Seock KIM of Suwon-si KR for samsung electro-mechanics co., ltd.

IPC Code(s): H01F27/30, H01F5/04, H01F27/29

CPC Code(s): H01F27/306

Abstract: a coil component includes: a body having a first surface, a second surface opposing the first surface in a first direction, and one or more side surfaces connecting the first and second surfaces to each other; first and second support members disposed to be spaced apart from each other in the first direction inside the body; and a coil portion including first and third coils disposed on both surfaces of the first support member, a first via connecting the first and third coils to each other, second and fourth coils disposed on both surfaces of the second support member, and a second via connecting the second and fourth coils to each other, in which the third coil and the fourth coil are bonded to each other inside the body.

20250132092. MULTILAYER ELECTRONIC COMPONENT_simplified_abstract_(samsung electro-mechanics co., ltd.)

Inventor(s): Geon Yong LEE of Suwon-si KR for samsung electro-mechanics co., ltd.

IPC Code(s): H01G4/012, H01G4/12, H01G4/232, H01G4/30

CPC Code(s): H01G4/012

Abstract: a multilayer electronic component includes: a body including a dielectric layer and first and second internal electrodes alternately disposed in a first direction while having the dielectric layer interposed therebetween; and first and second external electrodes disposed on opposite surfaces of the body in a second direction perpendicular to the first direction, wherein the body includes a main portion in which the first and second internal electrodes are alternately disposed in the first direction, a first cover portion disposed on one surface of the main portion in the first direction, and a second cover portion disposed on the other surface of the main portion in the first direction, one of the first and second cover portions includes a cover electrode whose average size in the second direction is larger than that of the first or second internal electrode.

20250132093. MULTILAYER ELECTRONIC COMPONENT_simplified_abstract_(samsung electro-mechanics co., ltd.)

Inventor(s): Jong Hoon YOO of Suwon-si KR for samsung electro-mechanics co., ltd., Ji Hyun LEE of Suwon-si KR for samsung electro-mechanics co., ltd., Dong Geon YOO of Suwon-si KR for samsung electro-mechanics co., ltd., Eun Hye CHO of Suwon-si KR for samsung electro-mechanics co., ltd.

IPC Code(s): H01G4/232, H01G4/008, H01G4/12, H01G4/30

CPC Code(s): H01G4/2325

Abstract: a multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode, and a plating layer disposed on the electrode layer, wherein the electrode layer includes a connection electrode layer including copper (cu) and glass, and a band electrode layer including silver (ag) and glass, and the external electrode further includes a conductive resin layer disposed between the band electrode layer and the plating layer and including a conductive metal and a resin.

20250132095. MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME_simplified_abstract_(samsung electro-mechanics co., ltd.)

Inventor(s): Myungwoo Lee of Suwon-si KR for samsung electro-mechanics co., ltd., Jaemin Han of Suwon-si KR for samsung electro-mechanics co., ltd., Jinseong Kim of Suwon-si KR for samsung electro-mechanics co., ltd., Yongju Yoo of Suwon-si KR for samsung electro-mechanics co., ltd., Hyungjoon Jeon of Suwon-si KR for samsung electro-mechanics co., ltd.

IPC Code(s): H01G4/30, H01G4/12, H01G4/232

CPC Code(s): H01G4/30

Abstract: a multilayer ceramic capacitor including: a capacitor body including a dielectric layer and an internal electrode layer; and an external electrode arranged outside the capacitor body, wherein the dielectric layer includes a barium titanate-based main ingredient and an element of phosphorus (p), and the element of phosphorus (p) is included in an amount of 0.006 parts by mole to 0.23 parts by mole based on 100 parts by mole of the barium titanate-based main ingredient, and a manufacturing method thereof are provided.

20250132224. PRINTED CIRCUIT BOARD_simplified_abstract_(samsung electro-mechanics co., ltd.)

Inventor(s): Jung Chul GONG of Suwon-si KR for samsung electro-mechanics co., ltd., Seung Eun LEE of Suwon-si KR for samsung electro-mechanics co., ltd.

IPC Code(s): H01L23/373, H01L23/00, H01L29/417, H01L29/45, H05K1/11, H05K1/18, H05K3/42, H05K3/46

CPC Code(s): H01L23/3736

Abstract: a printed circuit board includes: a substrate having a cavity; a semiconductor device at least partially disposed in the cavity, with a first metal pad and a gate being disposed on a lower side of the semiconductor device and a second metal pad being disposed on an upper side of the semiconductor device; a metal block at least partially disposed in the cavity, the metal block being connected to the second metal pad; and a first insulating layer covering at least a portion of each of the substrate, the semiconductor device, and the metal block, and filling at least a portion of the cavity.

20250132739. POWER SUPPLY SELECTION SWITCH CIRCUIT AND POWER AMPLIFIER MODULE WITH POWER SUPPLY SELECTION SWITCH CIRCUIT_simplified_abstract_(samsung electro-mechanics co., ltd.)

Inventor(s): Shinichi IIZUKA of Suwon-si KR for samsung electro-mechanics co., ltd., Youngwong JANG of Suwon-si KR for samsung electro-mechanics co., ltd., Hyejin LEE of Suwon-si KR for samsung electro-mechanics co., ltd., Jeonghoon KIM of Suwon-si KR for samsung electro-mechanics co., ltd.

IPC Code(s): H03F3/24, H03K5/00, H03K19/20

CPC Code(s): H03F3/245

Abstract: a power selection switch circuit configured to select either one or both of a first power supply voltage and a second power supply voltage, and supply the selected power supply voltage to a power amplifier, the power selection switch circuit includes: an n-type first transistor configured to turn on in response to a first switching control signal having a first voltage generated by charge pumping the first power supply voltage, and supply the first power supply voltage to a power supply terminal of the power amplifier when turned on; and an n-type second transistor configured to turn on in response to a second switching control signal having a second voltage generated by charge pumping the second power supply voltage, and supply the second power supply voltage to the power supply terminal of the power amplifier when turned on.

20250133279. CAMERA MODULE_simplified_abstract_(samsung electro-mechanics co., ltd.)

Inventor(s): Junho JEONG of Suwon-si KR for samsung electro-mechanics co., ltd.

IPC Code(s): H04N23/51, G03B11/00, H04N23/54

CPC Code(s): H04N23/51

Abstract: a camera module includes a lens barrel; an image sensor, mounted on a substrate, disposed below the lens barrel along an optical axis direction of the lens barrel; and a sub-housing, disposed between the lens barrel and the substrate, comprising a seating portion on which an infrared filter is accommodated, and a frame portion supported by the substrate. the sub-housing is configured to space apart the seating portion from the substrate. the sub-housing comprises an inner surface facing the image sensor and an outer surface facing away from the inner surface. the frame portion includes a gas discharge portion including a first channel communicating the inner surface with the outer surface in a first direction and a second channel extending from the first channel to the outer surface along the optical axis direction in a second direction different from the first direction.

Samsung Electro-Mechanics Co., Ltd. patent applications on April 24th, 2025