Intel corporation (20240422899). ENVIRONMENTALLY FRIENDLY MULTI-LAYER PRINTED CIRCUIT BOARD
ENVIRONMENTALLY FRIENDLY MULTI-LAYER PRINTED CIRCUIT BOARD
Organization Name
Inventor(s)
Srinivas B Reddy of Bangalore (IN)
Jayprakash Thakur of Bangalore (IN)
Bindu Prabhakar Rao of Bangalore (IN)
ENVIRONMENTALLY FRIENDLY MULTI-LAYER PRINTED CIRCUIT BOARD
This abstract first appeared for US patent application 20240422899 titled 'ENVIRONMENTALLY FRIENDLY MULTI-LAYER PRINTED CIRCUIT BOARD
Original Abstract Submitted
the present disclosure generally relates to a multi-layer printed circuit board. the multi-layer printed circuit board may include a core layer and a first prepreg layer adjacent the core layer. the core layer may include a first biodegradable material sandwiched between two electrically conducting layers. a method for forming a multi-layer printed circuit board is also provided herein.