SAMSUNG ELECTRO-MECHANICS CO., LTD. patent applications on March 6th, 2025
Patent Applications by SAMSUNG ELECTRO-MECHANICS CO., LTD. on March 6th, 2025
SAMSUNG ELECTRO-MECHANICS CO., LTD.: 25 patent applications
SAMSUNG ELECTRO-MECHANICS CO., LTD. has applied for patents in the areas of H01G4/30 (6), G02B13/00 (4), H05K1/11 (4), H01G4/12 (3), H01M8/1213 (3) H01M10/0562 (2), H05K1/0298 (2), H04N23/55 (2), H01G4/012 (2), H01G4/1227 (2)
With keywords such as: layer, surface, electrode, lens, disposed, including, portion, body, direction, and having in patent application abstracts.
Patent Applications by SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s): Jungdeok Park of Suwon-si, Gyeonggi-do (KR) for samsung electro-mechanics co., ltd., Jaeseok Yi of Suwon-si, Gyeonggi-do (KR) for samsung electro-mechanics co., ltd., Hongryul Lee of Suwon-si, Gyeonggi-do (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): C25B1/042, C25B11/054, C25B11/067, C25B11/077, H01M8/1213
CPC Code(s): C25B1/042
Abstract: a solid oxide composite according to present disclosure includes a solid oxide electrolyte including mesopores; and an oxide-based electrode active material in the mesopores.
20250076614. IMAGING LENS SYSTEM_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Seong Il CHO of Suwon-si (KR) for samsung electro-mechanics co., ltd., You Jin JEONG of Suwon-si (KR) for samsung electro-mechanics co., ltd., Byung Hyun KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd., Geon Hwi PARK of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): G02B13/00, G02B9/62
CPC Code(s): G02B13/0045
Abstract: an imaging lens system is provided. the imaging lens system includes a first lens having refractive power, a second lens having refractive power, a third lens having a convex object-side surface, a fourth lens having refractive power, a fifth lens having refractive power, and a sixth lens having refractive power. the first lens to the sixth lens are sequentially arranged from an object side toward an imaging plane. the imaging lens system satisfies the conditional expressions ttl/f<1.0 and 0.9<f1/f4<1.4, where ttl is a distance from an object-side surface of the first lens to the imaging plane, f is a focal length of the imaging lens system, f1 is a focal length of the first lens, and f4 is a focal length of the fourth lens.
20250076617. LENS MODULE_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Il Yong PARK of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): G02B13/00, G02B9/62
CPC Code(s): G02B13/0045
Abstract: a lens module includes a first lens having refractive power, a second lens having refractive power, a third lens having refractive power, a fourth lens having refractive power, a fifth lens having refractive power and having a concave object-side surface and a concave image-side surface, and a sixth lens having refractive power and a concave image-side surface. the first to sixth lenses are sequentially disposed from an object side to an image side.
20250076618. IMAGING LENS SYSTEM_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Tae Yeon LIM of Suwon-si (KR) for samsung electro-mechanics co., ltd., Byung Hyun KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd., Gil Hun LEE of Suwon-si (KR) for samsung electro-mechanics co., ltd., Young Suk KANG of Suwon-si (KR) for samsung electro-mechanics co., ltd., Yong Joo JO of Suwon-si (KR) for samsung electro-mechanics co., ltd., Young Su JIN of Suwon-si (KR) for samsung electro-mechanics co., ltd., Han Na JANG of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): G02B13/00, G02B3/00, G03B17/17
CPC Code(s): G02B13/0065
Abstract: an imaging lens system includes a first lens group, an optical path conversion element, and a second lens group arranged in order from an object side. an optical axis of the second lens group is disposed eccentrically in a direction with respect to a geometric optical axis of the optical path conversion element.
20250079060. COIL COMPONENT_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Tae Hyun KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd., Byeong Cheol MOON of Suwon-si (KR) for samsung electro-mechanics co., ltd., Dong Jin LEE of Suwon-si (KR) for samsung electro-mechanics co., ltd., Dong Hwan LEE of Suwon-si (KR) for samsung electro-mechanics co., ltd., Dae Ki LIM of Suwon-si (KR) for samsung electro-mechanics co., ltd., Boum Seock KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01F27/22, H01F27/32
CPC Code(s): H01F27/22
Abstract: a coil component according to an aspect of the present disclosure includes a coil component having a body including a first surface and a second surface opposing each other in a first direction, and a third surface and a fourth surface connecting the first surface to the second surface and opposing each other in a second direction; a coil disposed in the body; an external electrode disposed on the body and connected to the coil; and a first heat dissipation portion disposed on the first surface, wherein the body includes a groove disposed in a region between the first heat dissipation portion and the external electrode.
20250079068. COIL ELECTRONIC COMPONENT_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Jun Tae Kang of Suwon-si (KR) for samsung electro-mechanics co., ltd., Woonghwan Choi of Suwon-si (KR) for samsung electro-mechanics co., ltd., Iljin Park of Suwon-si (KR) for samsung electro-mechanics co., ltd., Taeryung Hu of Suwon-si (KR) for samsung electro-mechanics co., ltd., Sle Lee of Suwon-si (KR) for samsung electro-mechanics co., ltd., Heeju Kim of Suwon-si (KR) for samsung electro-mechanics co., ltd., Seonwoo Oh of Suwon-si (KR) for samsung electro-mechanics co., ltd., Donghyeon Kim of Suwon-si (KR) for samsung electro-mechanics co., ltd., Byeongseon Kuk of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01F27/28, H01F27/29, H01F27/32
CPC Code(s): H01F27/2804
Abstract: a coil electronic component includes a main body; a coil embedded in the main body, an insulating layer disposed on one surface of the main body, a first conductive layer covering a portion of the one surface, a second conductive layer covering another portion of the one surface, and first and external electrodes respectively covering the first conductive layer. the coil electronic component has a first length l in a first direction, and a second length l is a sum of a third length l in the first direction of a region where the insulating layer, the first conductive layer, and the first external electrode overlap and a fourth length l in the first direction of a region where the insulating layer, the second conductive layer, and the second external electrode overlap. a ratio l/l is 0.3 or more and 0.7 or less.
20250079074. COIL ELECTRONIC COMPONENT_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Minji Cho of Suwon-si (KR) for samsung electro-mechanics co., ltd., Juhwan Yang of Suwon-si (KR) for samsung electro-mechanics co., ltd., Boumseock Kim of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01F27/29, H01F27/28
CPC Code(s): H01F27/292
Abstract: a coil electronic component includes: a body surrounding a first coil with both ends exposed to the outside of the body and a second coil with both ends exposed to the outside of the body, and including a magnetic material; and external electrodes connected to the first coil and the second coil. one of the external electrodes includes an intermetallic compound disposed on the exposed ends of the first coil and the second coil, respectively.
20250079081. MULTILAYERED CAPACITOR_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Byeonggyu Park of Suwon-si (KR) for samsung electro-mechanics co., ltd., Yunsung Kang of Suwon-si (KR) for samsung electro-mechanics co., ltd., Sun-Hwa Kim of Suwon-si (KR) for samsung electro-mechanics co., ltd., Hyunsoo Park of Suwon-si (KR) for samsung electro-mechanics co., ltd., Wonjun Na of Suwon-si (KR) for samsung electro-mechanics co., ltd., Sungjoon Park of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01G4/012, H01G4/30
CPC Code(s): H01G4/012
Abstract: a multilayered capacitor includes: a body including a first internal electrode and a second internal electrode disposed in a first direction while having a dielectric layer therebetween; and a first external electrode and a second external electrode respectively disposed at ends of the body in a second direction. the first internal electrode includes a first capacitance forming portion and a plurality of first lead portions extending from the first capacitance forming portion to connect to the first external electrode. the second internal electrode includes a second capacitance forming portion overlapping the first capacitance forming portion in the first direction and a plurality of second lead portions extending from the second capacitance forming portion to connect to the second external electrode. for a thickness in the first direction, one of the plurality of the first lead portion has a thickness smaller than a thickness of the first capacitance forming portion.
20250079082. MULTILAYER CAPACITOR_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Wonmi Choi of Suwon-si (KR) for samsung electro-mechanics co., ltd., Sunghwan Lee of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01G4/012, H01G4/008, H01G4/12, H01G4/232, H01G4/30
CPC Code(s): H01G4/012
Abstract: a multilayer capacitor may include a capacitor body including a dielectric layer and an internal electrode, and an external electrode disposed outside the capacitor body, where the capacitor body may include titanium (ti) and indium (in), and in the entire capacitor body, the content of the indium (in) based on 100 moles of titanium (ti) may be 0.2 moles to 4 moles.
Inventor(s): Yonghwa Lee of Suwon-si (KR) for samsung electro-mechanics co., ltd., Seung Yong Lee of Suwon-si (KR) for samsung electro-mechanics co., ltd., Minsoo Kim of Suwon-si (KR) for samsung electro-mechanics co., ltd., Sang Jin Park of Suwon-si (KR) for samsung electro-mechanics co., ltd., Jinbok Shin of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01G4/12, C04B35/468, H01G4/30
CPC Code(s): H01G4/1227
Abstract: a dielectric composition according to the present disclosure includes dielectric grains containing barium titanate-based compounds; and a secondary phase located between the dielectric grains, and the secondary phase includes a first secondary phase including ga and si. a multilayered capacitor includes a capacitor body including a dielectric layer and an internal electrode; and an external electrode disposed outside the capacitor body. the dielectric layer includes the dielectric composition according to the present disclosure.
Inventor(s): Jin Yeop YOO of Suwon-si (KR) for samsung electro-mechanics co., ltd., Jong Pil PARK of Suwon-si (KR) for samsung electro-mechanics co., ltd., Chung Eun LEE of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01G4/12, H01G4/008, H01G4/252, H01G4/30
CPC Code(s): H01G4/1227
Abstract: a multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed in a first direction, and including first and second surfaces opposing each other in the first direction, the third and fourth surfaces connected to the first and second surfaces and connected to each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; an insulating layer disposed on the first, second, fifth and sixth surfaces and including at least one of aloand bn; an external electrode disposed on the body, wherein each of the first and second surfaces is concave into the body.
20250079086. MULTILAYER CERAMIC CAPACITOR_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Heesang Kang of Suwon-si (KR) for samsung electro-mechanics co., ltd., Sujin Lee of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01G4/232, H01G4/012, H01G4/30
CPC Code(s): H01G4/232
Abstract: the disclosed multilayer ceramic capacitor includes a ceramic main body including a first surface and a second surface facing in a first direction, a third surface and a fourth surface facing in a second direction and connecting the first surface and the second surface, and a fifth surface and a sixth surface facing in a third direction and connecting the first surface and the second surface, an internal electrode disposed inside the ceramic main body, a protective layer disposed on the third surface and the fourth surface of the ceramic main body, and a connection electrode covering the protective layer. the protective layer includes a first protective layer disposed on the third surface and a second protective layer disposed on the fourth surface, and has openings positioned on the third surface and the fourth surface.
Inventor(s): Sun Kyoung PARK of Suwon-si (KR) for samsung electro-mechanics co., ltd., Chae Dong LEE of Suwon-si (KR) for samsung electro-mechanics co., ltd., Jung Wun HWANG of Suwon-si (KR) for samsung electro-mechanics co., ltd., Wi Hun KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01G4/232, H01G4/30
CPC Code(s): H01G4/2325
Abstract: a multilayer electronic component according to an example embodiment may include: a body including dielectric layers and internal electrodes; and an external electrode including a connection portion, and a band portion extending from the connection portion, wherein the external electrode may include an electrode layer connected to the internal electrode and including a first conductive metal and glass, a conductive resin layer disposed on the electrode layer and including a second conductive metal and a resin, and a silver (ag) coating layer disposed between an electrode layer and a conductive resin layer of the band portion, and an average thickness of the silver (ag) coating layer may be 2 �m or more and 5 �m or less.
Inventor(s): Byungchul Jang of Suwon-si, Gyeonggi-do (KR) for samsung electro-mechanics co., ltd., Jeongsuong Yang of Suwon-si, Gyeonggi-do (KR) for samsung electro-mechanics co., ltd., Dongjin Kim of Suwon-si, Gyeonggi-do (KR) for samsung electro-mechanics co., ltd., Areum Jun of Suwon-si, Gyeonggi-do (KR) for samsung electro-mechanics co., ltd., Jaeseok Yi of Suwon-si, Gyeonggi-do (KR) for samsung electro-mechanics co., ltd., Hyegsoon An of Suwon-si, Gyeonggi-do (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01M4/86, C25B9/23, C25B11/031, C25B11/037, C25B11/047, C25B13/07, H01M4/90, H01M8/12, H01M8/1213, H01M8/1253, H01M8/126
CPC Code(s): H01M4/8626
Abstract: a solid oxide cell including a solid oxide electrolyte, and a fuel electrode on one side of the solid oxide electrolyte and an air electrode on the other side, wherein the fuel electrode includes core-shell hollow particles in which the core has an empty space and the shell includes nickel oxide (nio) particles.
Inventor(s): Jaeseok Yi of Suwon-si, Gyeonggi-do (KR) for samsung electro-mechanics co., ltd., Jungdeok Park of Suwon-si, Gyeonggi-do (KR) for samsung electro-mechanics co., ltd., Hongryul Lee of Suwon-si, Gyeonggi-do (KR) for samsung electro-mechanics co., ltd., Jeongsuong Yang of Suwon-si, Gyeonggi-do (KR) for samsung electro-mechanics co., ltd., Bonseok Koo of Suwon-si, Gyeonggi-do (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01M8/2483, C25B9/77, C25B13/02, C25B13/07, H01M8/12, H01M8/1213, H01M8/1246, H01M8/1253, H01M8/126, H01M8/2432
CPC Code(s): H01M8/2483
Abstract: disclosed is solid oxide cell that includes a unit cell including a solid oxide electrolyte including a first solid oxide electrolyte layer and a second solid oxide electrolyte layer, and a fuel electrode and an air electrode, and a frame having a first manifold surrounding a side of the unit cell and through which air supplied to the first solid oxide electrolyte layer flows.
20250079501. ALL-SOLID-STATE BATTERY_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Myung Jin Jung of Suwon-si, Gyeonggi-do (KR) for samsung electro-mechanics co., ltd., Namgyu Kim of Suwon-si, Gyeonggi-do (KR) for samsung electro-mechanics co., ltd., Jieun Wang of Suwon-si, Gyeonggi-do (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01M10/0562, H01M10/0585, H01M50/593
CPC Code(s): H01M10/0562
Abstract: an all-solid-state battery includes a solid electrolyte layer and a first electrode layer and a second electrode layer disposed in a stacking direction with the solid electrolyte layer interposed therebetween, and having different polarities. each of the first electrode layer and the second electrode layer includes a central portion and an outer portion located outside the central portion. the central portions of the first electrode layer and the second electrode layer overlap each other and overlap the solid electrolyte layer in the stacking direction. the outer portions of the first electrode layer and the second electrode layer overlap the solid electrolyte layer in the stacking direction, and have corner portions located on opposite sides to each other along a diagonal direction in different electrode layers.
Inventor(s): Kyunglock Kim of Suwon-si, Gyeonggi-do (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01M10/0562, H01M4/04
CPC Code(s): H01M10/0562
Abstract: an all-solid-state battery according to present disclosure includes a cell stack including a solid electrolyte layer, and a positive electrode layer and a negative electrode layer with the solid electrolyte layer disposed therebetween, and an outermost layer on one surface or both surfaces of the cell stack in a stacking direction, wherein the outermost layer includes an epoxy resin and glass particles and the glass particles include a boron (b) oxide, a silicon (si) oxide, and an aluminum (al) oxide.
Inventor(s): Jaewoong Choi of Suwon-si (KR) for samsung electro-mechanics co., ltd., Haekyo Seo of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H01Q17/00, H01Q1/22, H01Q1/52
CPC Code(s): H01Q17/001
Abstract: an antenna substrate according to an embodiment of the present disclosure includes an antenna including an antenna pattern configured to transmit or receive an rf signal, and a directionality adjustment pattern including a plurality of metal layers having a preset area and disposed to be spaced apart from one another, the directionality adjustment pattern being disposed on one surface of the antenna, through which the rf signal emitted from the antenna pattern propagates, and provided such that at least one of the plurality of metal layers has a larger height than each of the remaining metal layers.
20250080820. IMAGING DEVICE_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Yong Joo JO of Suwon-si (KR) for samsung electro-mechanics co., ltd., Tae Yeon LIM of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H04N23/55, H04N23/698
CPC Code(s): H04N23/55
Abstract: an imaging device includes a first lens assembly including a plurality of first lens modules and a single first image sensor, and a second lens assembly including a plurality of second lens modules and a single second image sensor, wherein the first lens assembly and the second lens assembly are arranged to be adjacent to each other, wherein a field of view of each first lens module of the plurality of first lens modules is wider than a field of view of each second lens module of the plurality of second lens modules, and wherein f35t/f35w≥2 is satisfied, where f35t is a 35 mm equivalent focal length of the second lens module and f35w is a 35 mm equivalent focal length of the first lens module.
Inventor(s): Jae Hyuk HUH of Suwon-si (KR) for samsung electro-mechanics co., ltd., You Jin JEONG of Suwon-si (KR) for samsung electro-mechanics co., ltd., So Mi YANG of Suwon-si (KR) for samsung electro-mechanics co., ltd., Sot Eum SEO of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H04N23/55, G02B9/10, G02B13/00
CPC Code(s): H04N23/55
Abstract: an imaging lens system includes an optical path folding member including a forwardmost reflective surface disposed closest to an object side, a rearmost reflective surface disposed closest to an imaging plane, and a rear reflective surface disposed to form an acute angle with the rearmost reflective surface and configured to reflect light reflected by the rearmost reflective surface to the imaging plane, and a first lens group disposed on an object side of the forwardmost reflective surface or an image side of the forwardmost reflective surface, wherein an angle between a first virtual plane including the forwardmost reflective surface and a second virtual plane including the rearmost reflective surface is 15 to 27 degrees.
20250081332. PRINTED CIRCUIT BOARD_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Joo Yul KO of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H05K1/02, H05K1/18
CPC Code(s): H05K1/0296
Abstract: a printed circuit board includes a first wiring portion including a plurality of first wirings, a first integrated circuit chip connected to one side of the first wiring portion, the first integrated circuit chip configured to convert n signals into one signal, where n is a natural number, a second integrated circuit chip connected to an opposite side of the first wiring portion, the second integrated circuit chip configured to convert one signal into n signals, a second-first wiring portion connected to the first integrated circuit chip, the second-first wiring portion including a plurality of second-first wirings, and a second-second wiring portion connected to the second integrated circuit chip, the second-second wiring portion including a plurality of second-second wirings. x and y1 satisfy y1/n<x, in which x is the number of the plurality of first wirings and y1 is the number of the plurality of second-first wirings.
20250081337. PRINTED CIRCUIT BOARD_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Young Kuk KO of Suwon-si (KR) for samsung electro-mechanics co., ltd., Sang Hoon KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd., Ji Ho YOON of Suwon-si (KR) for samsung electro-mechanics co., ltd., Gyu Mook KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd., Tae Hun KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H05K1/02, H05K1/11, H05K1/18
CPC Code(s): H05K1/0298
Abstract: a printed circuit board includes: a first insulating layer; a cavity unit including a first cavity penetrating through a portion of the first insulating layer from an upper surface thereof in a thickness direction, and a second cavity penetrating through another portion of the first insulating layer from the first cavity; a first wiring layer disposed at an upper side of the first insulating layer; a second wiring layer disposed at a lower side of the first insulating layer; and a third wiring layer at least partially buried in the first insulating layer and disposed on a level between the first and second wiring layers in the thickness direction. the third wiring layer includes pads in which at least a portion of each of upper surfaces thereof is exposed from the first insulating layer through the cavity unit, and the first cavity has a wider cross-section than the second cavity.
Inventor(s): Sang Ho JEONG of Suwon-si (KR) for samsung electro-mechanics co., ltd., Jong Eun PARK of Suwon-si (KR) for samsung electro-mechanics co., ltd., Chang Hwa PARK of Suwon-si (KR) for samsung electro-mechanics co., ltd., Hyun Hu LEE of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H05K1/02, H05K1/11, H05K3/40, H05K3/46
CPC Code(s): H05K1/0298
Abstract: a printed circuit board includes: a first insulating layer; a first wiring layer embedded in the first insulating layer on one side thereof; a glass layer disposed on the other side, opposite to the one side of the first insulating layer; a second wiring layer disposed on the glass layer; and a first via layer connecting the first wiring layer and the second wiring layer to each other, and including a first via portion penetrating the glass layer and a second via portion penetrating the first insulating layer. in a cross-sectional view of the printed circuit board, at least one of the first via portion and the second via portion has a width becoming substantially narrower toward the first wiring layer.
20250081340. PRINTED CIRCUIT BOARD_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): In Gun KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H05K1/03, H05K1/05, H05K1/11
CPC Code(s): H05K1/0306
Abstract: a printed circuit board includes a glass layer having a first region having first transmittance and a second region having second transmittance, different from the first transmittance, and a first wiring layer disposed on the glass layer.
20250081343. PRINTED CIRCUIT BOARD_simplified_abstract_(samsung electro-mechanics co., ltd.)
Inventor(s): Chi Hyeon JEONG of Suwon-si (KR) for samsung electro-mechanics co., ltd., Seok Hwan KIM of Suwon-si (KR) for samsung electro-mechanics co., ltd., Dong Hyeon LEE of Suwon-si (KR) for samsung electro-mechanics co., ltd., Hyun Sang KWAK of Suwon-si (KR) for samsung electro-mechanics co., ltd.
IPC Code(s): H05K1/11
CPC Code(s): H05K1/115
Abstract: the present disclosure relates to a printed circuit board including: an insulating layer, a through-hole penetrating the insulating layer from an upper surface to a lower surface of the insulating layer and having an inclined wall surface; a metal ball disposed within the through-hole and in contact with the inclined wall surface; and a metal via filling the through-hole and surrounding the metal ball.
SAMSUNG ELECTRO-MECHANICS CO., LTD. patent applications on March 6th, 2025
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- C25B1/042
- C25B11/054
- C25B11/067
- C25B11/077
- H01M8/1213
- CPC C25B1/042
- Samsung electro-mechanics co., ltd.
- G02B13/00
- G02B9/62
- CPC G02B13/0045
- G02B3/00
- G03B17/17
- CPC G02B13/0065
- H01F27/22
- H01F27/32
- CPC H01F27/22
- H01F27/28
- H01F27/29
- CPC H01F27/2804
- CPC H01F27/292
- H01G4/012
- H01G4/30
- CPC H01G4/012
- H01G4/008
- H01G4/12
- H01G4/232
- C04B35/468
- CPC H01G4/1227
- H01G4/252
- CPC H01G4/232
- CPC H01G4/2325
- H01M4/86
- C25B9/23
- C25B11/031
- C25B11/037
- C25B11/047
- C25B13/07
- H01M4/90
- H01M8/12
- H01M8/1253
- H01M8/126
- CPC H01M4/8626
- H01M8/2483
- C25B9/77
- C25B13/02
- H01M8/1246
- H01M8/2432
- CPC H01M8/2483
- H01M10/0562
- H01M10/0585
- H01M50/593
- CPC H01M10/0562
- H01M4/04
- H01Q17/00
- H01Q1/22
- H01Q1/52
- CPC H01Q17/001
- H04N23/55
- H04N23/698
- CPC H04N23/55
- G02B9/10
- H05K1/02
- H05K1/18
- CPC H05K1/0296
- H05K1/11
- CPC H05K1/0298
- H05K3/40
- H05K3/46
- H05K1/03
- H05K1/05
- CPC H05K1/0306
- CPC H05K1/115