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Category:H01L23/40
Subcategories
This category has the following 51 subcategories, out of 51 total.
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Pages in category "H01L23/40"
The following 81 pages are in this category, out of 81 total.
1
- 17809128. Cooling Cover and Packaged Semiconductor Device Including the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 17821871. HEAT SPREADER APPARATUS WITH MAGNETIC ATTACHMENTS ON PRINTED WIRING BOARD ASSEMBLIES, RELATED METHODS AND ELECTRONIC SYSTEMS simplified abstract (Micron Technology, Inc.)
- 18375716. THERMALLY ENHANCED FLIP CHIP BALL GRID ARRAY PACKAGE WITH IMPROVED HEAT DISSIPATION (STMicroelectronics International N.V.)
- 18399871. ELECTRONIC CONTROL UNIT, MANUFACTURING METHOD THEREOF, AND ELECTRIC COMPRESSOR simplified abstract (Robert Bosch GmbH)
- 18403763. SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18404538. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18467979. INTEGRATED CIRCUIT COOLING SYSTEMS AND METHODS (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18492251. COMPUTER HOUSING simplified abstract (Apple Inc.)
- 18514126. Chamfered Die of Semiconductor Package and Method for Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18557785. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (Mitsubishi Electric Corporation)
- 18573116. LIQUID METAL CONNECTION DEVICE AND METHOD simplified abstract (Intel Corporation)
- 18647287. SEMICONDUCTOR DEVICE AND POWER CONVERTER simplified abstract (FUJI ELECTRIC CO., LTD.)
- 18648466. SEMICONDUCTOR PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18674903. PACKAGE SYSTEM AND MANUFACTURING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18677352. JET IMPINGEMENT COOLING FOR HIGH POWER SEMICONDUCTOR DEVICES simplified abstract (SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC)
- 18689584. Heat Sink Fixing Structure and Heat Dissipation Apparatus (ZTE CORPORATION)
- 18745045. Heatsink techniques for optical and electrical modules simplified abstract (Ciena Corporation)
- 18757145. DESKTOP ELECTRONIC DEVICE simplified abstract (Apple Inc.)
- 18823279. COOLER AND SEMICONDUCTOR MODULE (ROHM CO., LTD.)
- 18834335. SEMICONDUCTOR DEVICE (Hitachi Astemo, Ltd.)
- 18893576. METHODS AND APPARATUS TO IMPROVE THERMAL DISSIPATION AND MECHANICAL LOADING OF INTEGRATED CIRCUIT PACKAGES (Intel Corporation)
- 18955905. METHOD OF FABRICATING PACKAGE STRUCTURE HAVING HOLLOW CYLINDERS (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18974937. SEMICONDUCTOR DEVICE (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18975142. ELECTRONIC APPARATUS (Kioxia Corporation)
- 18976369. PACKAGE STRUCTURE (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 19000789. System, Device and Methods of Manufacture (Taiwan Semiconductor Manufacturing Company, Ltd.)
A
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- Dell products l.p. (20240266249). FASTENING SYSTEM FOR COUPLING A COMPUTING MODULE TO A PRINTED CIRCUIT BOARD simplified abstract
- Dell Products L.P. patent applications on August 8th, 2024
- Delphi technologies ip limited (20240105547). SYSTEMS AND METHODS FOR AN INTERLOCKING FEATURE ON A POWER MODULE simplified abstract
I
- Intel corporation (20240260233). DIMM COOLING ASSEMBLIES
- Intel corporation (20240260233). DIMM COOLING ASSEMBLIES simplified abstract
- Intel corporation (20240297119). LIQUID METAL CONNECTION DEVICE AND METHOD simplified abstract
- Intel corporation (20240355758). METHODS AND APPARATUS TO REDUCE STRESS BETWEEN SOCKETS AND ASSOCIATED INTEGRATED CIRCUIT PACKAGES HAVING GLASS CORES simplified abstract
- Intel corporation (20240413054). INTEGRATED CIRCUIT PACKAGES WITH FLUID SPACERS TO IMPROVE PIN LOAD DISTRIBUTION
- Intel corporation (20250014967). METHODS AND APPARATUS TO IMPROVE THERMAL DISSIPATION AND MECHANICAL LOADING OF INTEGRATED CIRCUIT PACKAGES
- Intel Corporation patent applications on August 1st, 2024
- Intel Corporation patent applications on December 12th, 2024
- Intel Corporation patent applications on January 9th, 2025
- Intel Corporation patent applications on October 24th, 2024
- Intel Corporation patent applications on September 5th, 2024
M
- Micron Technology, Inc. patent applications on February 29th, 2024
- Mitsubishi electric corporation (20240282664). SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi electric corporation (20240347420). HEATSINK AND SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi Electric Corporation patent applications on August 22nd, 2024
- Mitsubishi Electric Corporation patent applications on October 17th, 2024
R
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- Samsung electronics co., ltd. (20250022772). SEMICONDUCTOR PACKAGE COMPRISING STIFFENER AND SCREW
- Samsung Electronics Co., Ltd. patent applications on January 16th, 2025
- Siemens aktiengesellschaft (20250112118). SEMICONDUCTOR ASSEMBLY COMPRISING A FIRST SEMICONDUCTOR ELEMENT AND A FIRST CONNECTION ELEMENT
- Siemens Aktiengesellschaft patent applications on April 3rd, 2025
- Stmicroelectronics international n.v. (20250112110). THERMALLY ENHANCED FLIP CHIP BALL GRID ARRAY PACKAGE WITH IMPROVED HEAT DISSIPATION
- STMicroelectronics International N.V. patent applications on April 3rd, 2025
T
- Taiwan semiconductor manufacturing co., ltd. (20240312859). PACKAGE SYSTEM AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20250087615). METHOD OF FABRICATING PACKAGE STRUCTURE HAVING HOLLOW CYLINDERS
- Taiwan semiconductor manufacturing co., ltd. (20250096071). INTEGRATED CIRCUIT COOLING SYSTEMS AND METHODS
- Taiwan semiconductor manufacturing co., ltd. (20250105090). SEMICONDUCTOR DEVICE
- Taiwan semiconductor manufacturing co., ltd. (20250105191). PACKAGE STRUCTURE
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 13th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 20th, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on March 27th, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications on September 19th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240136251). SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240282659). SEMICONDUCTOR PACKAGE simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20250140610). System, Device and Methods of Manufacture
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 25th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on August 22nd, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on March 14th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on May 1st, 2025
- Tesla, inc. (20240312863). ELECTRONIC ASSEMBLIES AND METHODS OF MANUFACTURING THE SAME simplified abstract
- Tesla, Inc. patent applications on October 31st, 2024
- Tesla, Inc. patent applications on September 19th, 2024