Taiwan semiconductor manufacturing co., ltd. (20250096071). INTEGRATED CIRCUIT COOLING SYSTEMS AND METHODS
INTEGRATED CIRCUIT COOLING SYSTEMS AND METHODS
Organization Name
taiwan semiconductor manufacturing co., ltd.
Inventor(s)
INTEGRATED CIRCUIT COOLING SYSTEMS AND METHODS
This abstract first appeared for US patent application 20250096071 titled 'INTEGRATED CIRCUIT COOLING SYSTEMS AND METHODS
Original Abstract Submitted
provided are integrated circuit systems and methods for fabricating semiconductor packages. an integrated circuit system includes a circuit board having a top side and a bottom side and defining an opening from the top side to the bottom side; a bottom boiling plate having a recessed portion and having a projection with a terminal surface, wherein the recessed portion is located below the bottom side of the circuit board, wherein the projection extends through the opening, and wherein the terminal surface is located above the top side of the circuit board; a semiconductor substrate located over the top side of the circuit board and including semiconductor devices; and a top boiling plate located over the semiconductor substrate, wherein the bottom boiling plate and the top boiling plate are configured to dissipate heat away from the integrated circuit system.