Samsung electronics co., ltd. (20250022772). SEMICONDUCTOR PACKAGE COMPRISING STIFFENER AND SCREW
SEMICONDUCTOR PACKAGE COMPRISING STIFFENER AND SCREW
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SEMICONDUCTOR PACKAGE COMPRISING STIFFENER AND SCREW
This abstract first appeared for US patent application 20250022772 titled 'SEMICONDUCTOR PACKAGE COMPRISING STIFFENER AND SCREW
Original Abstract Submitted
a semiconductor package includes a package substrate. a chip structure is on the package substrate. a stiffener covers the chip structure and the package substrate. screws fix the stiffener to the package substrate. the stiffener includes a main portion that covers an upper surface of the chip structure. a vertical portion that covers lateral side surfaces of the chip structure. the vertical portion extends from an end of the main portion. an edge portion extending laterally from the vertical portion and covering the upper surface of the package substrate. the screws penetrate the edge portion and the package substrate and couple the edge portion to the package substrate.