Tesla, inc. (20240312863). ELECTRONIC ASSEMBLIES AND METHODS OF MANUFACTURING THE SAME simplified abstract

ELECTRONIC ASSEMBLIES AND METHODS OF MANUFACTURING THE SAME

Organization Name

tesla, inc.

Inventor(s)

Yong guo Li of Gilroy CA (US)

Rishabh Bhandari of San Carlos CA (US)

Aydin Nabovati of Toronto (CA)

Vijaykumar Krithivasan of Mountain View CA (US)

William Chang of Mountain View CA (US)

ELECTRONIC ASSEMBLIES AND METHODS OF MANUFACTURING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 20240312863 titled 'ELECTRONIC ASSEMBLIES AND METHODS OF MANUFACTURING THE SAME

Simplified Explanation

The patent application discloses wafer assemblies and methods that can accommodate electronic modules of different heights on a wafer. The assembly includes a cooling system, a wafer, two electronic modules, and a height adjustment structure to compensate for height differences.

• A cooling system is included in the wafer assembly.
• The assembly accommodates electronic modules of different heights.
• Thermal interface materials are used between the electronic modules and the cooling system.
• A height adjustment structure compensates for height differences between modules.
• Various wafer assemblies and methods of manufacture are disclosed.

Key Features and Innovation

• Wafer assembly can accommodate electronic modules of different heights.
• Cooling system included in the assembly.
• Thermal interface materials used for efficient heat transfer.
• Height adjustment structure compensates for height differences between modules.
• Various wafer assemblies and methods of manufacture disclosed.

Potential Applications

The technology can be applied in the manufacturing of electronic devices, such as computers, servers, and other electronic systems that require efficient cooling and thermal management.

Problems Solved

The technology addresses the challenge of accommodating electronic modules of different heights on a wafer while ensuring efficient cooling and thermal management.

Benefits

• Improved thermal management for electronic modules.
• Accommodation of modules of different heights on a wafer.
• Enhanced efficiency in cooling systems.

Commercial Applications

The technology can be utilized in the production of electronic devices, data centers, and other systems that require effective cooling solutions. This innovation can lead to more efficient and reliable electronic systems in various industries.

Questions about Wafer Assemblies

How does the height adjustment structure compensate for height differences between electronic modules?

The height adjustment structure in the wafer assembly is designed to physically adjust the position of the modules to align them properly, ensuring efficient heat transfer and cooling.

What are the advantages of using thermal interface materials in the wafer assembly?

Thermal interface materials help improve heat transfer between the electronic modules and the cooling system, enhancing the overall thermal management efficiency of the assembly.

Original Abstract Submitted

wafer assemblies and related methods of manufacture are disclosed. such assemblies and methods can account for different heights of electronic modules positioned on a wafer. in an embodiment, a wafer assembly includes a cooling system, a wafer, a first electronic module, a second electronic module, and a height adjustment structure. a first thermal interface material (tim) can be disposed between the first electronic module and a first portion of the cooling system. a second tim can be disposed between the second electronic module and a second portion of the cooling system. the height adjustment structure can compensate for a height difference between the first electronic module and the second electronic module. other wafer assemblies and methods of manufacture are disclosed.