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Category:H01L23/14
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This category has the following 21 subcategories, out of 21 total.
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Pages in category "H01L23/14"
The following 116 pages are in this category, out of 116 total.
1
- 17412641. SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17462458. CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING LAYERS AND FABRICATING METHOD THEREOF simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 17591144. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 17816261. SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17878647. Semiconductor Device Packages and Methods of Forming the Same simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 17937519. PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER simplified abstract (Intel Corporation)
- 17957637. POROUS POLYMER DIELECTRIC LAYER ON CORE simplified abstract (Intel Corporation)
- 18047033. PACKAGE SUBSTRATE WITH DUAL DAMASCENE BASED SELF-ALIGNED VIAS simplified abstract (Intel Corporation)
- 18169573. SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18204241. METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18216909. INTEGRATED CIRCUIT STRUCTURES HAVING ALTERNATIVE CARRIERS FOR DUAL-SIDED DEVICES (Intel Corporation)
- 18252963. Integrated Electronic Component simplified abstract (Nippon Telegraph and Telephone Corporation)
- 18274056. ELECTRONIC ELEMENT MOUNTING SUBSTRATE simplified abstract (KYOCERA CORPORATION)
- 18344147. CROSSTALK NOISE REDUCTION BY HIGH PERMEABILITY INSULATOR (International Business Machines Corporation)
- 18381061. INTERPOSERS FOR MICROELECTRONIC DEVICES simplified abstract (Micron Technology, Inc.)
- 18435822. APPARATUSES INCLUDING REDISTRIBUTION LAYERS AND EMBEDDED INTERCONNECT STRUCTURES simplified abstract (Micron Technology, Inc.)
- 18524454. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
- 18528856. ELECTRONIC APPARATUS simplified abstract (DENSO CORPORATION)
- 18533441. ELECTRONIC DEVICE simplified abstract (DENSO CORPORATION)
- 18570145. POWER SEMICONDUCTOR DEVICE simplified abstract (Hitachi Astemo, Ltd.)
- 18591580. SEMICONDUCTOR MODULE ARRANGEMENT simplified abstract (Infineon Technologies AG)
- 18591755. METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE INCLUDING AN EMBEDDED SEMICONDUCTOR DIE simplified abstract (Infineon Technologies Austria AG)
- 18604588. SEMICONDUCTOR MODULE HAVING A SUBSTRATE WITH AN INSULATING CERAMIC LAYER AND A METHOD FOR FABRICATING THEREOF simplified abstract (Infineon Technologies Austria AG)
- 18604613. SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)
- 18610934. POWER ELECTRONIC ASSEMBLY AND METHOD OF PRODUCING THE SAME simplified abstract (Infineon Technologies AG)
- 18622823. POWER SEMICONDUCTOR DEVICE, METHOD FOR PREPARING POWER SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS simplified abstract (Huawei Technologies Co., Ltd.)
- 18624328. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
- 18626579. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
- 18641480. SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME simplified abstract (Resonac Corporation)
- 18663697. METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCAPSULANT simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
- 18671330. SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
- 18675658. INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE simplified abstract (ROHM CO., LTD.)
- 18678813. HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD simplified abstract (Intel Corporation)
- 18706307. MOUNTING STRUCTURE (NIPPON TELEGRAPH AND TELEPHONE CORPORATION)
- 18748127. ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
- 18753139. METHOD FOR FORMING CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING LAYERS simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)
- 18762040. SEMICONDUCTOR PACKAGE HAVING INCREASED RELIABILITY (Samsung Electronics Co., Ltd.)
- 18887508. ELECTRONIC DEVICE, QUANTUM COMPUTER, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE (Fujitsu Limited)
- 18944087. SILICON NITRIDE SINTERED BODY, WEAR-RESISTANT MEMBER, SUBSTRATE FOR SEMICONDUCTOR DEVICES, AND METHOD FOR PRODUCING SILICON NITRIDE SINTERED BODY (KABUSHIKI KAISHA TOSHIBA)
- 18945109. METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES (Intel Corporation)
- 18964045. SEMICONDUCTOR MODULE (Murata Manufacturing Co., Ltd.)
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- Intel corporation (20240113006). PACKAGE ARCHITECTURE WITH DIE-TO-DIE COUPLING USING GLASS INTERPOSER simplified abstract
- Intel corporation (20240113009). POROUS POLYMER DIELECTRIC LAYER ON CORE simplified abstract
- Intel corporation (20240128181). PACKAGE SUBSTRATE WITH DUAL DAMASCENE BASED SELF-ALIGNED VIAS simplified abstract
- Intel corporation (20240321762). HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD simplified abstract
- Intel corporation (20240413237). WRAP-AROUND SOURCE/DRAIN METHOD OF MAKING CONTACTS FOR BACKSIDE METALS
- Intel corporation (20250006568). INTEGRATED CIRCUIT STRUCTURES HAVING ALTERNATIVE CARRIERS FOR DUAL-SIDED DEVICES
- Intel corporation (20250070056). METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Intel Corporation patent applications on April 18th, 2024
- Intel Corporation patent applications on April 4th, 2024
- Intel Corporation patent applications on December 12th, 2024
- Intel Corporation patent applications on February 27th, 2025
- Intel Corporation patent applications on January 23rd, 2025
- Intel Corporation patent applications on January 2nd, 2025
- Intel Corporation patent applications on September 26th, 2024
- International business machines corporation (20250006647). CROSSTALK NOISE REDUCTION BY HIGH PERMEABILITY INSULATOR
- International Business Machines Corporation patent applications on January 2nd, 2025
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M
- Micron technology, inc. (20240178189). APPARATUSES INCLUDING REDISTRIBUTION LAYERS AND EMBEDDED INTERCONNECT STRUCTURES simplified abstract
- Micron technology, inc. (20240203804). ENGINEERED SEMICONDUCTOR SUBSTRATE simplified abstract
- Micron Technology, Inc. patent applications on February 8th, 2024
- Micron Technology, Inc. patent applications on June 20th, 2024
- Micron Technology, Inc. patent applications on May 30th, 2024
- Microsoft technology licensing, llc (20240413029). EMBEDDING AN ELECTRONIC COMPONENT IN A CORE OF AN INTEGRATED CIRCUIT SUBSTRATE
- MICROSOFT TECHNOLOGY LICENSING, LLC patent applications on December 12th, 2024
- Microsoft Technology Licensing, LLC patent applications on February 29th, 2024
- Mitsubishi electric corporation (20240347403). SEMICONDUCTOR DEVICE simplified abstract
- Mitsubishi Electric Corporation patent applications on October 17th, 2024
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- Qualcomm incorporated (20250062203). SUBSTRATE(S) FOR AN INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A CORE LAYER AND AN ADJACENT INSULATION LAYER(S) WITH AN EMBEDDED METAL STRUCTURE(S) POSITIONED FROM THE CORE LAYER
- QUALCOMM Incorporated patent applications on February 20th, 2025
- QUALCOMM Incorporated patent applications on January 18th, 2024
S
- Samsung electronics co., ltd. (20240105662). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240128171). METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240213138). SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240249990). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE simplified abstract
- Samsung electronics co., ltd. (20240421061). SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
- Samsung electronics co., ltd. (20250014957). SEMICONDUCTOR PACKAGE HAVING INCREASED RELIABILITY
- Samsung electronics co., ltd. (20250079317). SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE
- Samsung Electronics Co., Ltd. patent applications on April 18th, 2024
- Samsung Electronics Co., Ltd. patent applications on December 19th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on December 19th, 2024
- Samsung Electronics Co., Ltd. patent applications on February 13th, 2025
- Samsung Electronics Co., Ltd. patent applications on January 9th, 2025
- Samsung Electronics Co., Ltd. patent applications on July 25th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on July 25th, 2024
- Samsung Electronics Co., Ltd. patent applications on June 27th, 2024
- SAMSUNG ELECTRONICS CO., LTD. patent applications on March 28th, 2024
- Samsung Electronics Co., Ltd. patent applications on March 6th, 2025
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- Taiwan semiconductor manufacturing co., ltd. (20240222247). SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK simplified abstract
- Taiwan semiconductor manufacturing co., ltd. (20240312851). SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME simplified abstract
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on February 1st, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd. patent applications on July 4th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. patent applications on September 19th, 2024
- Taiwan semiconductor manufacturing company, ltd. (20240105632). Method for Forming a Semiconductor Device Having TSV Formed Through a Silicon Interposer and a Second Silicon Substrate with Cavity Covering a Second Die simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240120207). SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240297131). METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCAPSULANT simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240347407). METHOD FOR FORMING CHIP PACKAGE STRUCTURE WITH MULTIPLE GAP-FILLING LAYERS simplified abstract
- Taiwan semiconductor manufacturing company, ltd. (20240379638). INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME simplified abstract
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on April 11th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on January 18th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on March 28th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on November 14th, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. patent applications on October 17th, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd. patent applications on September 5th, 2024
- Tokyo Electron Limited patent applications on February 6th, 2025
