PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF

Organization Name

SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor(s)

PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF

This abstract first appeared for US patent application 18596804 titled 'PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF

Original Abstract Submitted

A package substrate and a fabricating method thereof are provided, in which a core board body is provided, a first organic conductive layer and a second metal layer are sequentially formed on a first metal layer of the core board body, and portions of the first organic conductive layer and the first metal layer are removed respectively according to a pattern of the second metal layer, such that the second metal layer, or the second metal layer, the first organic conductive layer and the first metal layer are served as a first circuit layer. Therefore, the design of the organic conductive layer can facilitate the control of the side etching amount of the metal circuit during etching, enabling the production of circuit layer with fine line width/fine line pitch.