Samsung Electronics Co., Ltd. patent applications on February 13th, 2025
Patent Applications by Samsung Electronics Co., Ltd. on February 13th, 2025
Samsung Electronics Co., Ltd.: 164 patent applications
Samsung Electronics Co., Ltd. has applied for patents in the areas of H01L23/00 (13), H01L23/528 (10), H01L23/498 (10), H01L25/065 (10), H04L5/00 (9) H01L25/0657 (4), H04B7/0626 (3), H04L5/0051 (3), H04W72/232 (2), H04W72/1273 (2)
With keywords such as: device, semiconductor, layer, data, including, based, configured, surface, substrate, and information in patent application abstracts.
Patent Applications by Samsung Electronics Co., Ltd.
Inventor(s): Daesik YOON of Suwon-si (KR) for samsung electronics co., ltd., Jungwon MIN of Suwon-si (KR) for samsung electronics co., ltd., Yonghwan PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A47B97/00
CPC Code(s): A47B97/001
Abstract: a display apparatus may include: a display, a wall mount on which the display is mounted; and a wall mount fixture to which the wall mount is fixed. the wall mount fixture may include: an extension bracket to which the wall mount is fixed; a first bracket including a mounting plate mounted into a mounting groove formed on a wall and a protrusion protruding to an outside of the mounting groove on the mounting plate; a second bracket including a receiving portion configured to receive the protrusion and a fixing plate provided in front of the receiving portion to be fixed to the protrusion and to fix the extension bracket; and a support screw configured to be fastened to a lower portion of the protrusion and to support the protrusion inside the mounting groove.
Inventor(s): Seongwook JO of Suwon-si (KR) for samsung electronics co., ltd., Hyoujoo KWON of Suwon-si (KR) for samsung electronics co., ltd., Hyuncheol PARK of Suwon-si (KR) for samsung electronics co., ltd., Soohan YOO of Suwon-si (KR) for samsung electronics co., ltd., Seungwon LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunjun JUNG of Suwon-si (KR) for samsung electronics co., ltd., Shinhee CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): A61B5/01, A61B5/00
CPC Code(s): A61B5/01
Abstract: a wearable electronic device is provided. the wearable electronic device includes a housing including a first surface, and a second surface positioned to be opposite to the first surface and configured to come into contact with a part of a body when the wearable electronic device is worn, a temperature sensor disposed in an internal space of the housing and configured to measure a temperature of an object adjacent to the first surface, an inertial sensor disposed in the internal space, memory storing one or more computer programs, and one or more processors communicatively connected to the temperature sensor, the inertial sensor, and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors, cause the wearable electronic device to detect a motion of the wearable electronic device by using the inertial sensor, when a first condition corresponding to the detected motion is satisfied, activate the temperature sensor, identify the object on a basis of the detected motion, and measure the temperature of the identified object by using the activated temperature sensor.
20250051054. PACKAGE BOX ASSEMBLY_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Ohhee LEE of Suwon-si (KR) for samsung electronics co., ltd., Byounguk YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): B65D6/00, B65D25/10, B65D43/16, B65D65/40, B65D65/46
CPC Code(s): B65D13/04
Abstract: according to various embodiments, a package box assembly comprises: a first box including a first plate portion and a first accommodation portion formed through a first sidewall extending to a designated height along the edge of the first plate portion; a second box including a second plate portion and a second accommodation portion formed through a second sidewall extending to a designated height along the edge of the second plate portion, the second box configured to beat least partially accommodated in the first accommodation portion; a cover member including a cover configured to cover the rear surface of the package box assembly based on the first box and the second box being coupled; and an engagement structure comprising a hook configured to fix the cover member to the second box, wherein the engagement structure may comprise at least one engagement portion formed on at least a part of the cover member, and at least one engagement groove formed to accommodate the engagement portion at a corresponding position of the second box.
Inventor(s): Eunkyung Lee of Suwon-si (KR) for samsung electronics co., ltd., Yusuke MARUYAMA of Suwon-si (KR) for samsung electronics co., ltd., Yongsik Jung of Suwon-si (KR) for samsung electronics co., ltd., Halim Lee of Suwon-si (KR) for samsung electronics co., ltd., Sungho Nam of Suwon-si (KR) for samsung electronics co., ltd., Joonghyuk Kim of Suwon-si (KR) for samsung electronics co., ltd., Jiwhan Kim of Suwon-si (KR) for samsung electronics co., ltd., Kyeongsik Ju of Suwon-si (KR) for samsung electronics co., ltd., Youngmok Son of Suwon-si (KR) for samsung electronics co., ltd., Hwayoung Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F5/02, C07D487/04, C09K11/06, H10K85/30, H10K85/60
CPC Code(s): C07F5/027
Abstract: a condensed cyclic compound represented by formula 1, a light-emitting device including the same, and an electronic apparatus including the light-emitting device are disclosed:
Inventor(s): Eunkyung Lee of Suwon-si (KR) for samsung electronics co., ltd., Yusuke MARUYAMA of Suwon-si (KR) for samsung electronics co., ltd., Yongsik Jung of Suwon-si (KR) for samsung electronics co., ltd., Halim Lee of Suwon-si (KR) for samsung electronics co., ltd., Sungho Nam of Suwon-si (KR) for samsung electronics co., ltd., Joonghyuk Kim of Suwon-si (KR) for samsung electronics co., ltd., Jiwhan Kim of Suwon-si (KR) for samsung electronics co., ltd., Kyeongsik Ju of Suwon-si (KR) for samsung electronics co., ltd., Youngmok Son of Suwon-si (KR) for samsung electronics co., ltd., Hwayoung Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C07F5/02, C07D487/04, C09K11/06, H10K85/30, H10K85/60
CPC Code(s): C07F5/027
Abstract:
Inventor(s): Seungrim YANG of Suwon-si (KR) for samsung electronics co., ltd., Minho KIM of Suwon-si (KR) for samsung electronics co., ltd., Deuk Kyu MOON of Suwon-si (KR) for samsung electronics co., ltd., Nayoun WON of Suwon-si (KR) for samsung electronics co., ltd., Sue In CHAE of Suwon-si (KR) for samsung electronics co., ltd., Tae-Gon KIM of Suwon-si (KR) for samsung electronics co., ltd., Jun Ho LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C09K11/62, B82Y20/00, B82Y40/00, C01G9/08, C01G15/00, C09K11/54, H01L33/50, H10K59/38
CPC Code(s): C09K11/621
Abstract: a method of manufacturing a semiconductor nanoparticle, the semiconductor nanoparticle manufactured therefrom, and an electronic device including the semiconductor nanoparticle. the method of manufacturing the semiconductor nanoparticle includes combining a first semiconductor nanocrystal that includes silver, a group 13 element, and a chalcogen element, with a gallium precursor, a sulfur precursor, and a silver compound in a medium including an organic solvent; and heating the medium to a reaction temperature to obtain a crude solution including the semiconductor nanoparticles. the semiconductor nanoparticle includes silver, indium, gallium, and sulfur, and the size is greater than or equal to about 2 nm and less than or equal to about 50 nm.
Inventor(s): Soo Kyung KWON of Suwon-si (KR) for samsung electronics co., ltd., Seungrim YANG of Suwon-si (KR) for samsung electronics co., ltd., A Ra JO of Suwon-si (KR) for samsung electronics co., ltd., Seon-Yeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Nayoun WON of Suwon-si (KR) for samsung electronics co., ltd., Jun Ho LEE of Suwon-si (KR) for samsung electronics co., ltd., Mi Hye LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C09K11/62, B82Y20/00, B82Y40/00, C09K11/02, G02F1/13357, H10K59/38
CPC Code(s): C09K11/623
Abstract: a semiconductor nanoparticle, a method of manufacturing the semiconductor nanoparticle, and an electronic device including the nanoparticle are provided. the semiconductor nanoparticle includes silver, indium, gallium, and sulfur, wherein the semiconductor nanoparticle is configured to emit a green light, wherein the semiconductor nanoparticle has a relative mole value of zinc as defined by equation 1 that is greater than or equal to about 0.25 and less than or equal to about 0.9:
Inventor(s): Soo Kyung KWON of Suwon-si (KR) for samsung electronics co., ltd., Seungrim YANG of Suwon-si (KR) for samsung electronics co., ltd., A Ra JO of Suwon-si (KR) for samsung electronics co., ltd., Seon-Yeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Nayoun WON of Suwon-si (KR) for samsung electronics co., ltd., Jun Ho LEE of Suwon-si (KR) for samsung electronics co., ltd., Mi Hye LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C09K11/62, B82Y20/00, B82Y40/00, C09K11/02, G02F1/13357, H10K59/38
CPC Code(s): C09K11/623
Abstract:
Inventor(s): A Ra JO of Suwon-si (KR) for samsung electronics co., ltd., Soo Kyung KWON of Suwon-si (KR) for samsung electronics co., ltd., Seungrim YANG of Suwon-si (KR) for samsung electronics co., ltd., Seon-Yeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Tae-Gon KIM of Suwon-si (KR) for samsung electronics co., ltd., Jun Ho LEE of Suwon-si (KR) for samsung electronics co., ltd., Mi Hye LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C09K11/62, B82Y20/00, B82Y40/00, C09K11/58, H01L33/16, H01L33/26
CPC Code(s): C09K11/623
Abstract: a semiconductor nanoparticle including a first semiconductor nanocrystal including silver, indium, gallium, and sulfur, and a semiconductor nanoparticle including a second semiconductor nanocrystal including zinc, gallium, and sulfur, a method of manufacturing the same, and an electronic device including the same. the semiconductor nanoparticle is configured to emit a green light. the green light has a peak emission wavelength of about 500 nanometers to about 580 nanometers. in the semiconductor nanoparticle, a molar ratio of zinc to indium is about 0.1:1 to about 10:1.
Inventor(s): Woo Yong Shim of Suwon-si (KR) for samsung electronics co., ltd., Jung-kul Lee of Seoul (KR) for samsung electronics co., ltd., Jae-Young Kim of Suwon-si (KR) for samsung electronics co., ltd., Jinha Kim of Suwon-si (KR) for samsung electronics co., ltd., Singh BAKUL of Seoul (KR) for samsung electronics co., ltd., Seung Hoon Song of Suwon-si (KR) for samsung electronics co., ltd., Yu Kyung Jung of Suwon-si (KR) for samsung electronics co., ltd., Kugalur Karuppanan KARTHIKEYAN of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): C12N9/06, B82Y30/00, C01B32/914, C01G39/00
CPC Code(s): C12N9/0046
Abstract: an mxene or a derivative thereof, on which nitrous oxide reductase is immobilized, wherein the mxene has a formula of mxt, wherein m is a transition metal of groups 3, 4, 5, 6, or a combination thereof, of the periodic table of the elements, x is carbon, nitrogen, or a combination thereof, t is oxide, epoxide, hydroxide, c1-c5 alkoxide, fluoride, chloride, bromide, iodide, or a combination thereof, and n is 1, 2, or 3, and s is 0, 1, or 2.
Inventor(s): Kyunghwan SONG of Suwon-si (KR) for samsung electronics co., ltd., Youngchun KIM of Suwon-si (KR) for samsung electronics co., ltd., Inkyu KIM of Suwon-si (KR) for samsung electronics co., ltd., Kidoc SON of Suwon-si (KR) for samsung electronics co., ltd., Yurim SONG of Suwon-si (KR) for samsung electronics co., ltd., Hyuckki LEE of Suwon-si (KR) for samsung electronics co., ltd., Yongduk KWON of Suwon-si (KR) for samsung electronics co., ltd., Goeun KIM of Suwon-si (KR) for samsung electronics co., ltd., Jongbo KIM of Suwon-si (KR) for samsung electronics co., ltd., Byounggyu PARK of Suwon-si (KR) for samsung electronics co., ltd., Sungyoung HEO of Suwon-si (KR) for samsung electronics co., ltd., Hyunsuk CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): C25D11/02, H05K5/04
CPC Code(s): C25D11/02
Abstract: according to various embodiments of the present disclosure, a method for implementing a structural color comprises: forming an oxide layer on at least a part of the surface of a metal substrate; coloring the oxide layer with a specified color, and sealing same; and etching at least a part of the surface of the oxide layer, wherein the etching operation may comprise dipping the metal substrate in a mixture solution of phosphoric acid and sulfuric acid.
20250051993. WASHING MACHINE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Weon Jin SONG of Suwon-si (KR) for samsung electronics co., ltd., Song Yik LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyun Woo SONG of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): D06F39/02, B67D3/00, D06F39/08, D06F39/12
CPC Code(s): D06F39/028
Abstract: a washing machine including a detergent supply device to supply a detergent together with water to a tub. the detergent supply device includes a detergent housing installed within the main body and a detergent accommodation box movably installed within the detergent housing, and the detergent accommodation box is divided into automatic detergent accommodation parts to accommodate a detergent to be supplied automatically and manual detergent accommodation parts to accommodate a detergent to be supplied manually, and the detergent supply device supplies the detergents through an automatic detergent supply method and a manual detergent supply method.
Inventor(s): Yeonwoo JEONG of Suwon-si (KR) for samsung electronics co., ltd., Sunghyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Keonpyo KOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D23/06
CPC Code(s): F25D23/063
Abstract: a refrigerator may include a body including a first insulating panel having a first coupler and a second insulating panel having a second coupler, wherein the first coupler and second coupler are coupled together, a compartment inside the body, a door to open and close the compartment, and a cooling device to cool the compartment, wherein the first insulating panel, first coupler, second insulating panel, and second coupler are configured so that, to couple the first coupler and second coupler together, the first insulating panel and first coupler are movable in a first direction toward the second insulating panel and second coupler so that the first coupler and second coupler become engaged, and, after the first coupler and second coupler are engaged, the first insulating panel and first coupler are movable in a second direction perpendicular to the first direction so that the first coupler and second coupler become coupled.
Inventor(s): Seungjun HWANG of Suwon-si (KR) for samsung electronics co., ltd., Minsoo KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D29/00, F25D23/02
CPC Code(s): F25D29/00
Abstract: a refrigerator includes: a body comprising a storage chamber; a door coupled to the body; a camera located on the body; and at least one processor operatively coupled to a memory and configured to execute one or more instructions stored in the memory, in which the one or more instructions cause the refrigerator to: based on detecting opening of the door, control the camera to capture the image of at least a part of the inside of the body and the door, identify, based on the image, whether at least one of a first area of the inside of the body included in the image or a first line included in the door included in the image satisfies a predetermined condition, and based on identifying that the predetermined condition is satisfied, store the image as an optimal door bin image.
Inventor(s): Jeongsu HAN of Suwon-si (KR) for samsung electronics co., ltd., Gwangjin JUNG of Suwon-si (KR) for samsung electronics co., ltd., Taegyoon NOH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): F25D29/00, F25D23/12, G05D9/12
CPC Code(s): F25D29/005
Abstract: a refrigerator may comprise a main body including a storage compartment, a door rotatably connectable to the main body, a water container mounting part disposed in the door, a water container coupleable to and decoupleable from the water container mounting part, and an optical sensor disposed on one surface of a side of the water container mounting part configured to detect whether the water container is coupled to the water container mounting part or detect a water level of the water container. the water container may include a reflection mirror disposed to face the optical sensor and configured to guide light emitted from the optical sensor to a bottom side of the water container or light reflected from the bottom side and guide light reflected by water stored in the water container to the optical sensor.
20250052559. MEASURING PARALLELISM_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Minhwan Seo of Suwon-si (KR) for samsung electronics co., ltd., Jiyoung Chu of Suwon-si (KR) for samsung electronics co., ltd., Hyungjin Kim of Suwon-si (KR) for samsung electronics co., ltd., Sangwoo Bae of Suwon-si (KR) for samsung electronics co., ltd., Seungyeol Oh of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01B9/02015, G01B9/02001, G01B11/27, G02B27/28
CPC Code(s): G01B9/02016
Abstract: a parallelism measurement optical system module includes a polarization beam splitter, a mirror positioned on a first surface of the polarization beam splitter, a first quarter wave plate positioned on a second surface of the polarization beam splitter that is perpendicular to the first surface, and a second quarter wave plate positioned on a third surface of the polarization beam splitter that is perpendicular to the first surface and parallel to the second surface.
Inventor(s): Hyunsoon KIM of Suwon-si (KR) for samsung electronics co., ltd., Hwangnam KIM of Seoul-si (KR) for samsung electronics co., ltd., Jun KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungchull SUH of Suwon-si (KR) for samsung electronics co., ltd., Kyeonghyun YOO of Seoul-si (KR) for samsung electronics co., ltd., Dongjae LEE of Seoul-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01C21/14, G01P13/00, G06T7/277
CPC Code(s): G01C21/14
Abstract: there is provided a tag device including a first sensor, a second sensor, a pre-processor and a neural network processor. the pre-processor generates first position data of the tag device based on time information sensed by at least one of a third sensor included in each of the one or more anchor devices and the first sensor of the tag device, generates second position data based on first speed data of the tag device sensed by the second sensor and the first position data, and generates an image based on a path of movement of the tag device based on the second position data in an operation period, and the neural network processor classifies the image into one of a plurality of movements by using a trained neural network model.
Inventor(s): Jooyoun KANG of Suwon-si (KR) for samsung electronics co., ltd., Gideok KIM of Suwon-si (KR) for samsung electronics co., ltd., Kwangsoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Wookrae KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaeseok SON of Suwon-si (KR) for samsung electronics co., ltd., Eunjoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Soonhong Charles HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01N21/21, G01N21/95, G01N21/956
CPC Code(s): G01N21/211
Abstract: an optical measurement apparatus includes a first light emitter configured to emit a first light on a surface of a sample, a second light emitter configured to emit a second light on the surface of the sample on which the first light is focused, a physical property detector configured to obtain physical property information of the sample by detecting a change in an amount of light of the second light due to a photothermal effect of the first light on the surface of the sample, and at least one structure detector configured to obtain structural information of the sample by detecting a reflected light of at least one of the first light and the second light that is reflected from the surface of the sample.
Inventor(s): Youngsun CHOI of Suwon-si (KR) for samsung electronics co., ltd., Soonyang KWON of Suwon-si (KR) for samsung electronics co., ltd., Kwangrak KIM of Suwon-si (KR) for samsung electronics co., ltd., Jangryul PARK of Suwon-si (KR) for samsung electronics co., ltd., Jiwoong KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngjun LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01N21/956, G01J3/02, G01J3/06, G01J3/45, H01L21/66
CPC Code(s): G01N21/95607
Abstract: a method of manufacturing a semiconductor device using a semiconductor measurement apparatus includes extracting an interference pattern using a microsphere, and measuring a distance between a specimen and the microsphere, based on the interference pattern. a semiconductor measurement apparatus includes a light source configured to output at least one light, a scanner having a microsphere-objective lens, the scanner configured to allow the at least one light to be incident on a specimen, a spectrometer configured to obtain a spectrum of light reflected from the specimen; and a distance measurement apparatus configured to calculate a microsphere-to-specimen distance by analyzing a change in the spectrum.
Inventor(s): Byung Hoon Ko of Suwon-si (KR) for samsung electronics co., ltd., Jin Woo Choi of Suwon-si (KR) for samsung electronics co., ltd., Seung Woo Noh of Suwon-si (KR) for samsung electronics co., ltd., Sang Yun Park of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G01S7/534, G01S15/32
CPC Code(s): G01S7/534
Abstract: an apparatus for distance measurement using ultrasonic waves may include: a memory configured to store an applied voltage profile that indicate voltages to be applied to a transducer at a plurality of different operational frequencies of transducer, a transducer including a transmitter configured to generate ultrasonic waves with a frequency modulated waveform, and a receiver configured to receive an echo signal reflected back from a measurement object; and a processor configured to control the transducer based on the applied voltage profile, and measure a distance to the measurement object based on the echo signal.
Inventor(s): Taedoo CHOUNG of Suwon-si (KR) for samsung electronics co., ltd., Soonik PARK of Suwon-si (KR) for samsung electronics co., ltd., Hunjo JUNG of Suwon-si (KR) for samsung electronics co., ltd., Heuisoo JEON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16
CPC Code(s): G06F1/1616
Abstract: a foldable electronic device is provided. the foldable electronic device includes a foldable housing including a first housing, a second housing, and a hinge device configured to connect the first housing and the second housing, and a flexible display disposed to be supported by the foldable housing and including a folding area, a first bending area positioned at one side of the folding area, and a second bending area positioned at the other side of the folding area, the flexible display being configured such that the folding area, the first bending area, and the second bending area are bent when the foldable electronic device is folded, wherein the flexible display includes a display panel, a support plate disposed below the display panel and including patterns for bending disposed in the folding area, the first bending area, and the second bending area, and a first reinforcement plate and a second reinforcement plate disposed between the foldable housing and the support plate, wherein the first reinforcement plate includes a first part having a first thickness and at least extending from the folding area to the first bending area, a second part having a second thickness greater than the first thickness and extending from the first part, and a first buffer member disposed on the first part, wherein the first part is bent together with the support plate by at least a part of a hinge device while the electronic device changes from an unfolded state to a folded state.
20250053194. FOLDABLE DEVICE INCLUDING DIGITIZER_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Myeongsil PARK of Suwon-si (KR) for samsung electronics co., ltd., Byungduk YANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16, G06F3/047
CPC Code(s): G06F1/1618
Abstract: an electronic device is provided. the electronic device includes a first housing, a second housing rotatably connected to the first housing, a display panel disposed across the first housing and the second housing, and a digitizer plate disposed below the display panel and including wires of a digitizer, wherein the digitizer plate includes a first plate area disposed in the first housing, a second plate area disposed in the second housing, and a pattern area provided between the first plate area and the second plate area and including a plurality of openings, wherein the first plate area and the second plate area of the digitizer plate includes a plurality of layers including a first layer and a second layer where the wires of the digitizer are provided, and at least one additional layer, and wherein the at least one additional layer in the first plate area and/or the second plate area is provided with an additional wire electrically connected to the wires of the digitizer provided on the first layer and/or the second layer.
Inventor(s): Wonsun LEE of Suwon-si (KR) for samsung electronics co., ltd., Gyejoon YOO of Suwon-si (KR) for samsung electronics co., ltd., Hosoon LEE of Suwon-si (KR) for samsung electronics co., ltd., Yena SHIN of Suwon-si (KR) for samsung electronics co., ltd., Junho LEE of Suwon-si (KR) for samsung electronics co., ltd., Jinsoo CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jinwan AN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16
CPC Code(s): G06F1/1641
Abstract: an electronic device includes a housing, a display module having a first region, a second region and a third region between the first region and the second region. the display module comprises a window including a first portion having a first thickness in the first region, a second portion having a second thickness in the second region, the second thickness being less than the first thickness, and a recessed portion in the third region. the display module comprises an adhesive member disposed on at least one surface of the window. the display module comprises a display panel attached to the window. the recessed portion has a first radius of curvature between the first region and the third region, a second radius of curvature between the second region and the third region, and a third radius of curvature at a point having a minimum thickness in the recessed portion.
Inventor(s): Seajung OH of Suwon-si (KR) for samsung electronics co., ltd., Sunghun SHIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16, G01P15/08, G01P15/18
CPC Code(s): G06F1/1681
Abstract: an electronic device includes: a deformable housing along at least one folding axis; a plurality of acceleration sensors respectively positioned at portions of the deformable housing; a controller operably coupled to the plurality of acceleration sensors, wherein the controller is configured to: receive, from the plurality of acceleration sensors, interrupt signals indicating that the electronic device is moved by acceleration of gravity applied to the electronic device; based on the received interrupt signals and based on acceleration measured by the plurality of acceleration sensors, receive data signals; and based on the received data signals, obtain, at least one of duration, a distance that the electronic device is moved in accordance with the acceleration of gravity, or an impulse applied to the electronic device based on movement of the electronic device, which corresponds to the acceleration of gravity.
Inventor(s): Jaehyun BAE of Suwon-si (KR) for samsung electronics co., ltd., Taejeong KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngmin MOON of Suwon-si (KR) for samsung electronics co., ltd., Byounggyu PARK of Suwon-si (KR) for samsung electronics co., ltd., Changsu LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/16
CPC Code(s): G06F1/1681
Abstract: an electronic device may include: a curved surface; a flexible display including a flat area and a bending area, the bending area configured to move along the curved surface; and a supporting structure including a plurality of bars spaced apart from each other on a rear side of the bending area of the flexible display, wherein a width of a center portion of at least one bar from among the plurality of bars is larger than a width of an end portion of the at least one bar.
Inventor(s): Sungeun JO of Suwon-si (KR) for samsung electronics co., ltd., Byungwoo BANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F1/20, H05K7/20
CPC Code(s): G06F1/20
Abstract: a system includes a main board and sub-board units connected thereto. each sub-board unit includes: a first sub-board connected to the main board and first chips arranged on a side of the first sub-board; a second sub-board connected to the main board and second chips arranged on a side of the second sub-board; and a cooling structure between the first sub-board and the second sub-board. the first sub-board and the second sub-board are arranged such that the side of the first sub-board and side of the second sub-board both face the cooling structure. a first region of the first sub-board defined by an outline of a first chip is directly opposite an identical second region of the second sub-board, and at least a portion of a second chip that corresponds to the first chip is outside the second region.
Inventor(s): Sunwoong HAM of Suwon-si (KR) for samsung electronics co., ltd., Nahye KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyerim KIM of Suwon-si (KR) for samsung electronics co., ltd., Jeesu PARK of Suwon-si (KR) for samsung electronics co., ltd., Wonkyu SUNG of Suwon-si (KR) for samsung electronics co., ltd., Daekwang JUNG of Suwon-si (KR) for samsung electronics co., ltd., Yunsu CHO of Suwon-si (KR) for samsung electronics co., ltd., Doyoung CHOI of Suwon-si (KR) for samsung electronics co., ltd., Inje HWANG of Suwon-si (KR) for samsung electronics co., ltd., Jihea PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/01, G06F3/041, G08B6/00
CPC Code(s): G06F3/016
Abstract: an example electronic device includes a housing, a display, communication circuitry, a first actuator configured to provide vibration feedback in response to receiving an incoming call event through the communication circuitry, a sensor configured to receive a user touch input with respect to a side surface of the housing, a second actuator configured to provide vibration feedback in response to receiving the user touch input, and a processor. the processor is configured to control the first actuator to provide first vibration feedback in response to the incoming call event; receive a designated user touch input with respect to the side surface of the housing while providing the first vibration feedback; and, in response to receiving the designated user touch input, control the first actuator to cease providing the first vibration feedback and control the second actuator to provide second vibration feedback.
Inventor(s): Seoyoung LEE of Suwon-si (KR) for samsung electronics co., ltd., Minwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Kwangtai KIM of Suwon-si (KR) for samsung electronics co., ltd., Donghyun YEOM of Suwon-si (KR) for samsung electronics co., ltd., Seungryeol KIM of Suwon-si (KR) for samsung electronics co., ltd., Juseok LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/041, G06F3/0488
CPC Code(s): G06F3/04166
Abstract: an electronic device is provided. the electronic device includes a touch screen, memory storing one or more computer programs, one or more processors communicatively coupled to the touch screen and the memory, wherein the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to display a screen based on a first refresh rate through the touch screen, while displaying the screen based on the first refresh rate, receive a signal indicating a reception of a touch input from the touch screen, before identifying a function to be executed based on the touch input, in response to the signal, control the touch screen to change a refresh rate of the touch screen from the first refresh rate to a second refresh rate higher than the first refresh rate, while the screen is displayed based on the second refresh rate, identify the function based on a recognition of the touch input, based on identifying the function corresponding to a predefined function, control the touch screen to change the refresh rate of the touch screen that is the second refresh rate, and based on identifying the function different from the predefined function, control the touch screen to maintain the refresh rate of the touch screen that is the second refresh rate.
Inventor(s): Jong-hyuk KIM of Seoul (KR) for samsung electronics co., ltd., Seung-hyun MOON of Seongnam-si (KR) for samsung electronics co., ltd., Dae-hyun JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/04847, G06F3/0482, G06F3/04842, G06F3/0488, G06F3/16, H03M11/10, H04N21/422
CPC Code(s): G06F3/04847
Abstract: a display apparatus includes a display, a single physical button and a processor configured to control the display to display a guide user interface (ui), a selection ui and a plurality of menu items, based on a user input received via the single physical button being identified as a short click input, move the selection ui from one menu item among the plurality of menu items to another menu item among the plurality of menu items, based on the user input being identified as a long press input, select the one menu item and execute a control function corresponding to the selected one menu item, and based on an execution of the control function, control the display to display a setting ui indicating a current setting value of the control function.
20250053302. MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sehwan Park of Suwon-si (KR) for samsung electronics co., ltd., Jinyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Jisang Lee of Suwon-si (KR) for samsung electronics co., ltd., Joonsuc Jang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0613
Abstract: an example memory device includes a memory cell array, a page buffer including buffer units corresponding to a plurality of memory cells of a page, a control logic configured to control a first read operation such that first hard decision data based on a normal read level and first soft decision data based on an offset level with respect to a first page are stored in the page buffer. the control logic is configured to perform a control operation of outputting the first hard decision data to a memory controller after a second read operation with respect to a second page has started in response to a first command that requests read of the second page from the memory controller and outputting the first soft decision data to the memory controller while the second read operation is being performed in response to a second command from the memory controller.
Inventor(s): Dohyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Eui-young Chung of Suwon-si (KR) for samsung electronics co., ltd., Seong Jun Yun of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo Choi of Suwon-si (KR) for samsung electronics co., ltd., Yeri Heo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0614
Abstract: a memory system and an electronic system including the same are provided. the memory system includes a memory device configured to receive data, and a hot page logic configured to receive an address for the data, determine that the address is for a hot page based on an input frequency and an input order of the address, and create hot page information including the address that was determined as associated with the hot page such that a page migration operation of the data is performed.
20250053312. NONVOLATILE MEMORY_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sangsoo Park of Suwon-si (KR) for samsung electronics co., ltd., Jinyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Sehwan Park of Suwon-si (KR) for samsung electronics co., ltd., Jisang Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06, G06F11/10
CPC Code(s): G06F3/0619
Abstract: a nonvolatile memory device includes a memory block, a page buffer circuit and a control circuit. the page buffer circuit is connected to the cell strings through bit-lines. the control circuit controls a read operation by: latching a first sensing data and a second sensing data in the page buffer circuit by performing a first read operation on a selected word-line designated by an access address based on a read voltage set; latching a third sensing data in the page buffer circuit by performing a second read operation on an aggressor word-line adjacent to the selected word-line, based on at least one adjacent read voltage; selecting one of the first sensing data and the second sensing data as a hard decision data based on a program state of the third sensing data; and generating a soft decision data by using the first sensing data and the second sensing data.
Inventor(s): Jeonil LEE of Suwon-si (KR) for samsung electronics co., ltd., Jinwoo HAN of Suwon-si (KR) for samsung electronics co., ltd., Seryeun YANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0638
Abstract: there is provided a memory device including a processing-in-memory (pim) dynamic random access memory (dram) die(s) and pim-high bandwidth memory (hbm) devices. the memory device includes a core peripheral circuit structure including a bank core circuit including a row decoder and a sense amplifier of each of a plurality of banks, and a cell array structure disposed on the core peripheral circuit structure. the bank core circuit includes a plurality of sub core circuits correspondingly connected to the plurality of sub cell blocks, respectively. each of the plurality of sub core circuits includes a sense amplifier segmented to be connected to a corresponding sub cell block, and a processing element connected to the segmented sense amplifier and configured to perform a logical operation on an operand that is data loaded into the segmented sense amplifier.
Inventor(s): Yeonjin Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0659
Abstract: a memory device configured to connect to a plurality of hosts through an interconnect device and to communicate with the plurality of hosts by a compute express link (cxl) protocol includes a command scheduler, a memory, and a priority scheduler. the command scheduler schedules commands included in requests from the plurality of hosts. the memory generates internal data by performing memory operations corresponding to the scheduled commands. the priority scheduler designates a first host from the plurality of hosts as a priority host based on attribute information of each of the plurality of hosts and generates an output data by rearranging the internal data such that a data requested by the first host is output with priority.
Inventor(s): SANG-HWA JIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0659
Abstract: a storage device includes a nonvolatile memory device and a storage controller configured to control the nonvolatile memory device under control of a plurality of hosts. the storage controller includes a plurality of physical functions, respectively corresponding to the plurality of hosts, and a real-time manager configured to control the plurality of physical functions based on real-time information of a real-time command when the real-time command is issued from at least one host among the plurality of hosts.
Inventor(s): Kihyun Park of Suwon-si (KR) for samsung electronics co., ltd., Inhae Kang of Suwon-si (KR) for samsung electronics co., ltd., Hyunseok Kim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06F11/07
CPC Code(s): G06F11/0757
Abstract: provided are a storage system including a host and a storage device and a method of operating the storage system. the method includes, when a response time of the storage device is greater than a threshold time, stopping, by the storage system, a previous mode and entering a recovery mode, when a state of a connection between the host device and the storage device is a link down state, resetting, by the storage system, the connection between the host device and the storage device, transmitting, by the host device, a recovery signal to the storage device, and performing, by the storage device, storage recovery.
Inventor(s): Sean Christopher KOCOL of Vista CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F11/16, G06F11/20
CPC Code(s): G06F11/1662
Abstract: a method for managing data storage in a data grouping includes generating a data storage configuration specifying the data grouping comprising a first configuration identifying a set of storage resources presently allocated to the data grouping, and a second configuration identifying a set of storage resources previously allocated to the data grouping; storing, in a tracking list, one or more identifiers of storage resources in the first configuration that are eligible to transition to the second configuration; and performing one or more update operations on the first configuration using the tracking list.
Inventor(s): Samantika Subramaniam Sury of Westford MA (US) for samsung electronics co., ltd.
IPC Code(s): G06F12/0817, G06F12/0831
CPC Code(s): G06F12/0817
Abstract: a cache-coherent computer system node includes a network-on-chip, a number of computing elements in communication with the network-on-chip, a coherence directory including a number of addresses for cache of the computing elements, a number of coherence states of the addresses, and a number of tracking vectors of the addresses, and a coherence directory controller configured to send a probe to the computing elements during a free cycle of the network-on-chip. the probe is configured to inquire whether an address of the addresses stored in the coherence directory is in the cache of the computing elements, and the coherence directory is configured clean the coherence directory to remove the address in response to an acknowledgement indicating that the address is not in the cache.
Inventor(s): Michael Wasef of San Jose CA (US) for samsung electronics co., ltd., Brian Luu of Fremont CA (US) for samsung electronics co., ltd., Edmund Au of Cupertino CA (US) for samsung electronics co., ltd., Andrew Chang of Los Altos CA (US) for samsung electronics co., ltd.
IPC Code(s): G06F30/333
CPC Code(s): G06F30/333
Abstract: provided is a method for data processing, the method including receiving, by a first circuit, row data of a page, receiving, by the first circuit, first column data and second column data from the row data, and sending, by the first circuit, the first column data and the second column data to a first output port of the first circuit.
Inventor(s): Jae-gil Lee of Suwon-si (KR) for samsung electronics co., ltd., Susik Yoon of Suwon-si (KR) for samsung electronics co., ltd., Byung Suk Lee of Suwon-si (KR) for samsung electronics co., ltd., Youngjun Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/0455
CPC Code(s): G06N3/0455
Abstract: a method comprises obtaining original data representing one or more characteristics of a target object; selecting an artificial intelligence generation model from among a plurality of artificial intelligence generation models based on the original data; generating reconstructed data based on the original data using the selected artificial intelligence generation model; calculating an anomaly score by comparing the original data and the reconstructed data; and outputting detection result data indicating whether the target object is abnormal based on the anomaly score.
Inventor(s): Sunbum HAN of Suwon-si (KR) for samsung electronics co., ltd., Haengkang KIM of Suwon-si (KR) for samsung electronics co., ltd., Daesung LIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N3/0464
CPC Code(s): G06N3/0464
Abstract: a method of performing a convolution operation is provided. the method includes obtaining a lightweight convolutional neural network with a reduced bit width of weights, and inputting input data to the convolutional neural network and performing neural network computations to obtain output data. the neural network computations includes determining a shift distance based on a value of input feature data, performing a shift operation to reduce a bit width of the input feature data based on the shift distance, performing a convolution operation on the input feature data with the reduced bit width and the weights with the reduced bit width, wherein the convolution operation includes a shift operation of restoring the bit width, and obtaining output feature data with the restored bit width.
Inventor(s): Jaeyoon KIM of San Diego CA (US) for samsung electronics co., ltd., Joon Hee CHOI of Campbell CA (US) for samsung electronics co., ltd., Chiho CHOI of San Jose CA (US) for samsung electronics co., ltd., Srikanth MALLA of Sunnyvale CA (US) for samsung electronics co., ltd.
IPC Code(s): G06N3/063, G06F3/06
CPC Code(s): G06N3/063
Abstract: a system and method for in-storage machine learning operations. in some embodiments, a system includes a first persistent memory, and a control and inference circuit. the first persistent memory may be connected to the control and inference circuit by a wideband data connection, and the control and inference circuit may be configured to perform arithmetic operations.
Inventor(s): Ahmed ELKORDY of Los Angeles CA (US) for samsung electronics co., ltd., Behnam BABAGHOLAMI MOHAMADABADI of Escondido CA (US) for samsung electronics co., ltd., Mostafa EL-KHAMY of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): G06N3/082, G06N3/04
CPC Code(s): G06N3/082
Abstract: a system and a method are disclosed for hardware-aware pruning of conformer networks. in some embodiments, the method includes: training a neural network, the training including: performing a first pruning operation, on the neural network, after a first training epoch, and performing a second pruning operation, on the neural network, after a second training epoch and after the first pruning operation, wherein each of the pruning operations results in a respective pruning fraction, the respective pruning fraction being a function of an index of a training epoch preceding the pruning operation.
Inventor(s): Mehul Kumar of Suwon-si (KR) for samsung electronics co., ltd., Aditya Sahdev of Suwon-si (KR) for samsung electronics co., ltd., James Russell Geraci of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N10/60, G06N10/40
CPC Code(s): G06N10/60
Abstract: an electronic apparatus, including: an input interface; and at least one processor configured to: receive bit-format input data using the input interface, convert input bits included in the input data to obtain input qubits, encode the input qubits to obtain encoded qubits, estimate quantum amplitude values of a predetermined number of the input qubits using a quantum neural network (qnn) based on the encoded qubits, determine a probability value corresponding to the data based on the estimated quantum amplitude values, and authenticate the input data by comparing the determined probability value with a predetermined authentication radius value
Inventor(s): Subhash Kumar SINGH of Bangalore (IN) for samsung electronics co., ltd., Sukhdeep SINGH of Bangalore (IN) for samsung electronics co., ltd., Naman GUPTA of Bangalore (IN) for samsung electronics co., ltd., Peter Moonki HONG of Suwon-si (KR) for samsung electronics co., ltd., Seungil YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N20/00
CPC Code(s): G06N20/00
Abstract: a method for sharing data between machine learning (ml) applications with a network training platform. the method includes: receiving a request to register a first ml application with the network training platform, wherein the request comprises first one or more parameters related to the first ml application; identifying at least one second ml application registered with the network training platform based on the first one or more parameters; identifying second one or more parameters related to the at least one second ml application; comparing the first one or more parameters with the second one or more parameters related to the at least one second ml application; and sharing, with the first ml application, predicted data corresponding to the at least one second ml application based on the comparing.
Inventor(s): Sandeep Kumar JAISAWAL of Bangalore (IN) for samsung electronics co., ltd., Sukhdeep SINGH of Bangalore (IN) for samsung electronics co., ltd., Joseph THALIATH of Bangalore (IN) for samsung electronics co., ltd., Seungil YOON of Suwon-si (KR) for samsung electronics co., ltd., Peter Moonki HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06N20/00
CPC Code(s): G06N20/00
Abstract: methods for optimizing training of a data driven model in a wireless network by data driven model validation controller running in electronic device. the method may include obtaining and selecting a candidate data driven model from a plurality of candidate data driven models. the method may include determining whether the selected candidate data driven model meets a predefined prediction. the method may include deploying the selected candidate data driven model to a target deployment environment upon determining that the selected candidate data driven model meets the prediction. the method may include sending the selected candidate data driven model to a data driven model optimizer running in the electronic device for tuning a hyper-parameter and the data driven technique running in the data driven model upon determining that the selected candidate data driven model does not meet the prediction.
Inventor(s): Jaeyoung Moon of Suwon-si (KR) for samsung electronics co., ltd., Nahyup Kang of Suwon-si (KR) for samsung electronics co., ltd., Minjung Son of Suwon-si (KR) for samsung electronics co., ltd., Hyeonseung Yu of Suwon-si (KR) for samsung electronics co., ltd., Inwoo Ha of Suwon-si (KR) for samsung electronics co., ltd., Seokpyo Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T3/40, G06T3/18, G06T5/50, G06T7/20, G06T15/00
CPC Code(s): G06T3/40
Abstract: a supersampling method includes generating a current rendered image frame by performing jittered sampling on a three-dimensional (3d) scene, based on sub-pixels of low-resolution pixels for the current rendered image frame; generating a current warped image frame by warping a previous output image frame, based on a motion vector map corresponding to a difference between the current rendered image frame and a previous rendered image frame; generating a current shifted image frame by shifting pixels of the current warped image frame, based on a change in sampling positions based on the jittered sampling; and generating a current output image frame, based on the current rendered image frame and the current shifted image frame.
Inventor(s): Yongsup Park of Suwon-si (KR) for samsung electronics co., ltd., Sangwook Baek of Suwon-si (KR) for samsung electronics co., ltd., Sangmi Lee of Suwon-si (KR) for samsung electronics co., ltd., Youjin Lee of Suwon-si (KR) for samsung electronics co., ltd., Taeyoung Jang of Suwon-si (KR) for samsung electronics co., ltd., Gyehyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Beomseok Kim of Suwon-si (KR) for samsung electronics co., ltd., Youngo Park of Suwon-si (KR) for samsung electronics co., ltd., Kwangpyo Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T5/60, G06T3/4046
CPC Code(s): G06T5/60
Abstract: provided is an image processing method including upscaling an input image to generate an upscaled image, obtaining a first feature map and a second feature map by inputting the upscaled image to a convolutional neural network and performing a convolution operation on the upscaled image with one or more kernels included in the convolutional neural network, obtaining a gain map by inputting the first feature map to a first convolutional layer, obtaining an offset map by inputting the second feature map to a second convolutional layer, and generating an output image, based on the upscaled image, the gain map, and the offset map, wherein the convolutional neural network is configured to be trained to reduce a difference between a hue of the input image and a hue of the output image.
20250054117. DEMOIRÉ USING MULTIPLE CAMERAS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Gil Shapira of Tel-Aviv (IL) for samsung electronics co., ltd., Ishay Goldin of Tel-Aviv (IL) for samsung electronics co., ltd., Niv Zehngut of Tel-Aviv (IL) for samsung electronics co., ltd., David Tal of Tel-Aviv (IL) for samsung electronics co., ltd.
IPC Code(s): G06T5/00, G06T5/50, G06T7/10, G06V10/24
CPC Code(s): G06T5/80
Abstract: systems and methods for image processing (e.g., image correction) are described. embodiments of the present disclosure include image processing techniques that reduce or remove moir� patterns by leveraging low resolution images (e.g., images captured using low resolution sensors, such as an ultra-wide camera). for instance, an image including a moir� pattern may be corrected based on a second image having a low resolution. in one example, a device may capture a high resolution image that includes a moir� pattern. the device may also capture a low resolution image that is aligned with the high resolution image and used to correct (e.g., remove) the moir� pattern. in some embodiments, the systems and techniques described herein may be implemented in real-time on a user device (e.g., that includes a high resolution image sensor and a low resolution image sensor) for efficient and effective correction of moir� patterns in image/video capture applications.
Inventor(s): Myoungwoo NAM of Suwon-si (KR) for samsung electronics co., ltd., Dongil SON of Suwon-si (KR) for samsung electronics co., ltd., Bona LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G06T19/00, G02B27/00, G02B27/01, G06F3/01
CPC Code(s): G06T19/006
Abstract: an example head-wearable electronic device may, while displaying images of physical environment, identify that first eye gaze information corresponds to a visual object in the images, which corresponds to an external electronic device in the physical environment. the head-wearable electronic device may display, based on identifying that the first eye gaze information corresponds to the visual object, a user interface (ui) object associated with the visual object and transmit to the external electronic device, a signal to request a communication link with the external electronic device. the head-wearable electronic device may display, based on information received through communication circuitry, screen images associated with the external electronic device, superimposed on images of physical environment.
Inventor(s): Jihye KIM of Suwon-si (KR) for samsung electronics co., ltd., Sungjin LIM of Suwon-si (KR) for samsung electronics co., ltd., Kyeongjin LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G3/20
CPC Code(s): G09G3/2096
Abstract: disclosed is a display device including a display panel; a first storage storing first driving data for a plurality of panel types, a second storage storing driving information of the display panel, a third storage storing third driving data to drive the display panel, a timing controller that drives the display panel based on the third driving data stored in the third storage, and a main controller that updates the third driving data stored in the third storage based on second driving data corresponding to the driving information of the display panel stored in the second storage among the first driving data for the plurality of panel types stored in the first storage.
Inventor(s): Jeongryeol SEO of Suwon-si (KR) for samsung electronics co., ltd., Sangwon Kim of Suwon-si (KR) for samsung electronics co., ltd., Youngkook KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G5/00, G06F3/14, H04L67/104
CPC Code(s): G09G5/003
Abstract: an electronic apparatus communicating with a display apparatus including a plurality of display modules is provided. the electronic apparatus includes an ethernet switch; and a processor connected to the ethernet switch and including a virtual ethernet port to which an internet protocol (ip) address is pre-allocated, wherein the processor is configured to: configure a network with an external electronic apparatus based on the ip address, and based on a signal for setting a screen of a display module, among the plurality of display modules, connected to a port of the ethernet switch being received from the external electronic apparatus through the network, control the ethernet switch to transmit the signal for setting the screen to the display module.
Inventor(s): Yongsoo CHOI of Suwon-si (KR) for samsung electronics co., ltd., Jeonghyeon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G09G5/00
CPC Code(s): G09G5/006
Abstract: a display apparatus may include: a communication interface; a display; one or more processors connected with the communication interface and the display and configured to control the display apparatus; and a memory configured to store instructions which, when executed by the one or more processors, cause the display apparatus to: based on a cable being connected to the communication interface, identify a communication standard supported by the cable based on a voltage applied to a first pin in the communication interface; set identification information for the display based on the communication standard supported by the cable; and displaying an image on the display based on the identification information.
Inventor(s): Yanhong LI of Suzhou (CN) for samsung electronics co., ltd.
IPC Code(s): G10K11/178, G10L21/0216, G10L21/0224, H04R1/08
CPC Code(s): G10K11/17823
Abstract: a method of suppressing wind noise of microphone and an electronic device are disclosed. the method comprises: receiving a plurality of audio signals from a plurality of microphones; detecting presences of wind noise and voice in the plurality of audio signals; determining one of the plurality of audio signals as a reference signal based on a result of detecting the presences of wind noise and voice, the plurality of audio signals including the one of the plurality of audio signals and remaining audio signals; performing compensation operation on each of the remaining audio signals, based on the determined reference signal; and obtaining modified audio signals based on the remaining audio signals on which the compensation operation is performed.
Inventor(s): Hwayeong Lee of Suwon-si (KR) for samsung electronics co., ltd., Seulji Song of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C11/22
CPC Code(s): G11C11/2275
Abstract: a memory device including a ferroelectric cell capacitor, and an operating method thereof. for example, an operating method of a memory device, according to some embodiments, may include pre-charging a bit line to a pre-charge voltage, the bit line connected to a ferroelectric cell capacitor to be written to, writing data into the ferroelectric cell capacitor by adjusting a level of a voltage applied to a bit line and a word line corresponding to the ferroelectric cell capacitor, and deactivating the word line, wherein a voltage applied to a plate line connected to the ferroelectric cell capacitor is maintained at a ground voltage during the writing of the data into the ferroelectric cell capacitor.
Inventor(s): Yeongmuk Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C29/42, G11C7/10, G11C17/16, G11C29/12, G11C29/20
CPC Code(s): G11C29/42
Abstract: a one-time programmable (otp) memory device includes an otp cell array, an error correction code (ecc) decoder, a double error fuse address register set and a double error fuse counter. the otp cell array includes otp cell rows, each of the otp cell rows includes otp fuse sets and each of the otp fuse sets includes otp memory cells. the ecc decoder performs an ecc decoding operation on first otp fuse sets and activates a double error detection flag in response to a double bit error being detected in a second subset. the double error fuse address register set stores fuse address information of the second subset and the double error detection flag. the double error fuse counter stores a double error counting signal by counting the double error detection flag based on the latch clock signal.
Inventor(s): Sehwan Park of Suwon-si (KR) for samsung electronics co., ltd., Jinyoung Kim of Suwon-si (KR) for samsung electronics co., ltd., Jisang Lee of Suwon-si (KR) for samsung electronics co., ltd., Hyojung Jang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): G11C29/52, G11C7/10, G11C7/22
CPC Code(s): G11C29/52
Abstract: a memory device includes a memory cell array, a control logic which controls a read operation to read hard decision data and soft decision data from each page, and a page buffer which includes a first latch related to sensing of the hard decision data and a second latch related to sensing of the soft decision data. the control logic controls performing a first sensing operation of storing a value determined based on a first offset level, in the second latch, at a first sensing timing, and a second sensing operation of storing a value determined based on a second offset level, in the second latch, at a second sensing timing, and performs a control operation to provide a set signal set to the second latch in the first sensing operation, and provide a reset signal rst to the second latch in the second sensing operation.
Inventor(s): Hoonjae KIM of Suwon-si (KR) for samsung electronics co., ltd., Wonchung LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01H13/06, H01H13/14, H04M1/23
CPC Code(s): H01H13/06
Abstract: an electronic device is provided. the electronic device includes a housing including an opening formed on one surface thereof and a first support member which is spaced apart from the one surface in a first direction and a position of at least part of the first support member corresponding to the opening, and a key assembly disposed between the opening and the first support member, wherein the key assembly includes a second support member disposed on the first support member, a printed circuit board which is disposed on the second support member, and including a switch, a waterproof bracket including a plate including a first surface which is oriented in the first direction, the first surface facing the switch, and a second surface facing in a second direction opposite to the first direction, the second surface corresponding to the opening, and a protrusion protruding from the second surface of the plate in the second direction, and a cover member inserted into the opening and coupled to the waterproof bracket, wherein the protrusion includes a hook having a first size protruding in a direction perpendicular to the first direction, wherein the cover member includes a hanging hole formed, in at least a portion of a side surface thereof, to have a second size larger than the first size so that the hook is insertable into the hanging hole, and wherein a relative position of the hook inside of the hanging hole is variable.
Inventor(s): Yirop Kim of Suwon-si (KR) for samsung electronics co., ltd., Seungbin Lim of Suwon-si (KR) for samsung electronics co., ltd., Songyun Kang of Suwon-si (KR) for samsung electronics co., ltd., Kyungsun Kim of Suwon-si (KR) for samsung electronics co., ltd., Kuihyun Yoon of Suwon-si (KR) for samsung electronics co., ltd., Jihwan Kim of Suwon-si (KR) for samsung electronics co., ltd., Heewon Min of Suwon-si (KR) for samsung electronics co., ltd., Insoo Lee of Suwon-si (KR) for samsung electronics co., ltd., Junho Lee of Suwon-si (KR) for samsung electronics co., ltd., Seunghee Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32
CPC Code(s): H01J37/32449
Abstract: an apparatus for processing a substrate may include a process chamber, a substrate-supporting module, an upper electrode module and a valve module. the process chamber may have a substrate-processing region configured to process the substrate using process gases. the substrate-supporting module may be arranged in a lower region of the process chamber to support the substrate. the upper electrode module may be arranged in an upper region of the process chamber. the valve module may be provided to the upper electrode module to control a supplying of the process gases into the substrate-processing region.
Inventor(s): Wookhyeon Kwon of Suwon-si (KR) for samsung electronics co., ltd., Minnhoo Choi of Suwon-si (KR) for samsung electronics co., ltd., Songyun Kang of Suwon-si (KR) for samsung electronics co., ltd., Yongwoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Jaehyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Hansol Kim of Suwon-si (KR) for samsung electronics co., ltd., Chulwoo Park of Suwon-si (KR) for samsung electronics co., ltd., Jaehyun Soh of Suwon-si (KR) for samsung electronics co., ltd., Dongkyu Shin of Suwon-si (KR) for samsung electronics co., ltd., Deukho Lee of Suwon-si (KR) for samsung electronics co., ltd., Hoontaek Lee of Suwon-si (KR) for samsung electronics co., ltd., Junghyun Cho of Suwon-si (KR) for samsung electronics co., ltd., Yangyeon Chu of Suwon-si (KR) for samsung electronics co., ltd., Kaan Uzun of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01J37/32
CPC Code(s): H01J37/32642
Abstract: a system is described for protecting the edge region of a substrate during a plasma process. the system includes an outer ring with a plurality of outer uneven portions and an inner ring also with a plurality of inner uneven portions. the outer ring covers the edge region of the substrate. the inner ring may rotate around the center point of the outer ring. when the inner ring is rotated, each of the inner uneven portions and each the outer uneven portions may slide by each other to overlap and to form openings. changes of the opening ratios in the gaps (or the overlap ratios of the inner and outer uneven portions) may change a thickness of a plasma sheath. thus, the plasma sheath in an edge region of the substrate may be readily controlled.
Inventor(s): Yuseon HEO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/48, C23C18/16, C23C18/31, C23C18/48, C23C28/02, C25D5/00, C25D5/02, C25D7/12, G03F7/16, G03F7/30, H01L23/00, H01L23/498, H01L25/065, H01L25/10, H10B80/00
CPC Code(s): H01L21/4857
Abstract: a method of forming a plating pattern includes forming a first plating layer on a substrate, forming a photosensitive material layer on the first plating layer, patterning the photosensitive material layer to have a trench exposing a portion of the first plating layer, forming a superhydrophobic film on a surface of the photosensitive material layer, forming a second plating layer in the trench by immersing the photosensitive material layer and the first plating layer in a plating solution, and simultaneously removing the superhydrophobic film and the photosensitive material layer.
Inventor(s): Hyeyeong Jo of Suwon-si (KR) for samsung electronics co., ltd., Jaejeong Kim of Seoul (KR) for samsung electronics co., ltd., Soowoong Park of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/48, G03F7/00, G03F7/30, H01L21/56, H01L23/00
CPC Code(s): H01L21/4857
Abstract: according to aspects of the inventive concepts, there is provided a method of manufacturing a semiconductor package, the method including forming a conductive layer on a first redistribution substrate, forming, on the conductive layer, a resist film having an opening, wherein the opening extends through the resist film to expose an organic residue, and wherein an oxide film is provided between the conductive layer and the organic residue, removing the organic residue by adding an alcohol solution into the opening, removing the oxide film by adding an acid solution into the opening, and forming a conductive post in the opening, wherein the oxide film is provided on the conductive layer, and the oxide film and the conductive layer include a same metal material.
Inventor(s): Kyungwook HWANG of Suwon-si (KR) for samsung electronics co., ltd., Jaewook JEONG of Ansan-si (KR) for samsung electronics co., ltd., Jonghyun JEONG of Ansan-si (KR) for samsung electronics co., ltd., Minchul YU of Suwon-si (KR) for samsung electronics co., ltd., Sanghoon SONG of Suwon-si (KR) for samsung electronics co., ltd., Dongho KIM of Suwon-si (KR) for samsung electronics co., ltd., Joonyong PARK of Suwon-si (KR) for samsung electronics co., ltd., Youngtek OH of Suwon-si (KR) for samsung electronics co., ltd., Junsik HWANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L21/78, H01L21/306, H01L21/67, H01L33/00, H01L33/22
CPC Code(s): H01L21/7813
Abstract: provided are a semiconductor chip, a method of preparing a semiconductor chip, and an apparatus for manufacturing a semiconductor chip. the method includes separating a semiconductor chip from a laminate, the laminate including a substrate, a lift-off layer on the substrate, and a semiconductor layer on the lift-off layer. the method further includes removing the lift-off layer with an etchant by applying a magnetic field while contacting the laminate and the etchant, to thereby prepare a semiconductor chip.
Inventor(s): Haram Ko of Suwon-si (KR) for samsung electronics co., ltd., Young Ha Kim of Suwon-si (KR) for samsung electronics co., ltd., Hyunjae Kang of Suwon-si (KR) for samsung electronics co., ltd., Jinman Kim of Suwon-si (KR) for samsung electronics co., ltd., Jonggu Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/14, H01L23/00, H01L23/528
CPC Code(s): H01L23/147
Abstract: an integrated circuit device includes a first semiconductor substrate having a frontside surface and a backside surface, a front-end-of-line (feol) structure on the frontside surface of the first semiconductor substrate, the feol structure including a plurality of fin-type active regions, a back-end-of-line (beol) structure on the feol structure, a second beol structure on the backside surface of the first semiconductor substrate, and a second semiconductor substrate spaced apart from the first semiconductor substrate in the vertical direction with the feol structure and the first beol structure therebetween, wherein a young's modulus of a first crystal orientation extending parallel to the frontside surface of the first semiconductor substrate is different from a young's modulus of a second crystal orientation that overlaps the first crystal orientation in the vertical direction and extends parallel to the first crystal orientation in the second semiconductor substrate.
Inventor(s): Jaehyun LIM of Suwon-si (KR) for samsung electronics co., ltd., Youngjun Yoon of Suwon-si (KR) for samsung electronics co., ltd., Yechung Chung of Suwon-si (KR) for samsung electronics co., ltd., Inho Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/31, H01L23/00, H01L23/498, H01L23/64, H01L25/18
CPC Code(s): H01L23/3121
Abstract: an embodiment provides a semiconductor package including: a substrate having a first surface and a second surface disposed in an opposite direction to the first surface; a semiconductor chip disposed on at least one surface of the substrate; an electronic device disposed on the second surface of the substrate; a first molding layer disposed on the first surface of the substrate; and a second molding layer disposed on the second surface of the substrate, wherein the second molding layer has an open hole that exposes at least a portion of the electronic device to the outside, and a material of the second molding layer is located on an inner surface of the open hole.
20250054846. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jaesun Kim of Suwon-si (KR) for samsung electronics co., ltd., Kwangsoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Yiseul Han of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/31, H01L23/538, H01L25/065, H10B80/00
CPC Code(s): H01L23/49811
Abstract: provided is a semiconductor package having a multi-chip package structure including a lower semiconductor chip and an upper semiconductor chip. the upper semiconductor chip includes a plurality of upper semiconductor chips, and one of the plurality of upper semiconductor chips is integrally connected to an adjacent one of the plurality of upper semiconductor chips with a scribe lane therebetween on a same plane.
Inventor(s): Bongsoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Chobi Kim of Suwon-si (KR) for samsung electronics co., ltd., Pyunghwa Han of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/31
CPC Code(s): H01L23/49827
Abstract: a semiconductor package includes a first substrate, a first semiconductor device disposed on the first substrate, a dummy substrate disposed on the first substrate, spaced apart from a side surface of the first semiconductor device, and surrounding the first semiconductor device, a core module disposed in the dummy substrate, and an encapsulant surrounding the first semiconductor device and in contact with the dummy substrate, wherein the core module includes a core wiring and a module substrate, the core module is disposed on the first substrate, and a side surface of the core module is surrounded by and spaced apart from an inner side surface of the dummy substrate, and the encapsulant is disposed between the dummy substrate and the side surface of the core module.
Inventor(s): Chulho Jung of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/498, H01L23/00, H01L23/31, H01L23/48, H01L25/065
CPC Code(s): H01L23/49833
Abstract: a combination-type semiconductor package includes a wiring plate such as a package substrate, a redistribution structure, and an interposer or a combination thereof. a package element is mounted on the wiring plate, a delamination-preventing layer covers the package element, and a package molding layer encapsulates the package element and the delamination-preventing layer on the wiring plate. the delamination-preventing layer prevents delamination between the package element and the package molding layer.
Inventor(s): Keun Wook SHIN of Suwon-si (KR) for samsung electronics co., ltd., Sangwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Chang Seok LEE of Suwon-si (KR) for samsung electronics co., ltd., Joonseok KIM of Suwon-si (KR) for samsung electronics co., ltd., Joonyun KIM of Suwon-si (KR) for samsung electronics co., ltd., Giyoung JO of Suwon-si (KR) for samsung electronics co., ltd., Luhing HU of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/532, H01L23/528
CPC Code(s): H01L23/5329
Abstract: disclosed are an interconnect structure including a substrate, a metal layer on the substrate, and a passivation layer including a topological compound and in contact with the metal layer.
Inventor(s): Woonchun Kim of Suwon-si (KR) for samsung electronics co., ltd., Seungwan Shin of Hwaseong-si (KR) for samsung electronics co., ltd., Gun Lee of Yongin-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/538, H01L21/48, H01L21/768, H01L23/31, H01L23/48, H01L23/498, H01L23/522, H01L23/528, H01L23/532, H01L25/10
CPC Code(s): H01L23/5386
Abstract: a semiconductor package includes; a first redistribution structure including first redistribution conductors, a semiconductor chip on the first redistribution structure and including connection pads electrically connecting the first redistribution conductors, a connection conductor on the first redistribution structure, laterally spaced apart from the semiconductor chip, and electrically connected to the first redistribution conductors, an encapsulant on the first redistribution structure and sealing the semiconductor chip and at least a portion of the connection conductor, a barrier layer extending along an upper surface of the encapsulant, and a second redistribution conductor on the barrier layer and penetrating the barrier layer to contact the connection conductor.
20250054878. WARPAGE CONTROL_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Sujie Kang of Suwon-si (KR) for samsung electronics co., ltd., Minsoo Han of Suwon-si (KR) for samsung electronics co., ltd., Minwoo Rhee of Suwon-si (KR) for samsung electronics co., ltd., Kyoungwhan Oh of Suwon-si (KR) for samsung electronics co., ltd., Kyeongbin Lim of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L21/66
CPC Code(s): H01L23/562
Abstract: a warpage control method includes measuring displacement in a vertical direction perpendicular to a front surface of a wafer and dividing the front surface of the wafer into a first stress region with a negative displacement value and a second stress region with a positive displacement value, to thereby derive a warpage model, defining a portion of a region, overlapping the first stress region, on the front surface of the wafer as a first compensation region based on the warpage model and defining a region, other than the first compensation region, on the front surface of the wafer as a second compensation region based on the warpage model, to thereby derive a stress compensation film pattern model, and forming a mask pattern in a region on a back surface of the wafer.
20250054889. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jinhee HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L25/065
CPC Code(s): H01L24/08
Abstract: a semiconductor package includes a package substrate having a plurality of substrate pads, a first semiconductor chip stacked on the package substrate and having a plurality of first chip pads and first option pads along a first horizontal direction, a plurality of first sub-chip pads along a second horizontal direction, and a plurality of first wirings electrically connecting the first chip pads and the first sub-chip pads, a second semiconductor chip stacked on the first semiconductor chip to cover the first sub-chip pads, and having a plurality of second chip pads and second option pads along the first horizontal direction, a plurality of second sub-chip pads along the second horizontal direction, and a plurality of second wirings electrically connecting the second chip pads and the second sub-chip pads, and a plurality of connection lines electrically connecting the package substrate and the first and second semiconductor chips.
Inventor(s): Ju Bin SEO of Seongnam-si (KR) for samsung electronics co., ltd., Seok Ho KIM of Hwaseong-si (KR) for samsung electronics co., ltd., Kwang Jin MOON of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L21/66, H01L23/498, H01L25/065
CPC Code(s): H01L24/08
Abstract: a semiconductor package that include first and second semiconductor chips bonded together, wherein the first semiconductor chip includes a first semiconductor substrate, a first semiconductor element layer and a first wiring structure sequentially stacked on a first surface of the first semiconductor substrate, first connecting pads and first test pads on the first wiring structure, and first front-side bonding pads, which are connected to the first connecting pads, wherein the second semiconductor chip includes a second semiconductor substrate, a second semiconductor element layer and a second wiring structure sequentially stacked on a third surface of the second semiconductor substrate, and first back-side bonding pads bonded to the first front-side bonding pads on the fourth surface of the second semiconductor substrate, and wherein the first test pads are not electrically connected to the second semiconductor chip.
20250054896. SEMICONDUCTOR PACKAGE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Jooyoung OH of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L23/00, H01L23/31, H01L23/498
CPC Code(s): H01L24/29
Abstract: a semiconductor package includes a package substrate including upper pads disposed at an upper portion of the package substrate, a solder resist layer disposed on the package substrate, the solder resist layer having a plurality of openings exposing the upper pads, a first adhesive layer disposed in at least a portion of an opening of the plurality of openings, a semiconductor chip disposed on the first adhesive layer, a second adhesive layer disposed between the first adhesive layer and the semiconductor chip, and a conductive member electrically connecting at least one of the upper pads and the semiconductor chip to each other.
20250054913. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): HYUNSOO CHUNG of Suwon-si (KR) for samsung electronics co., ltd., KWANG-SOO KIM of Suwon-si (KR) for samsung electronics co., ltd., WON-YOUNG KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31
CPC Code(s): H01L25/0657
Abstract: a semiconductor device includes first to third semiconductor chips consecutively stacked. the first semiconductor chip comprises a first semiconductor substrate. a circuit layer is on a top surface of the first semiconductor substrate. first pads are on a top surface of the circuit layer. the first pads are electrically connected to the circuit layer. the second semiconductor chip comprises a second semiconductor substrate. passive devices are in the second semiconductor substrate. second pads are on a bottom surface of the second semiconductor substrate. the second pads are electrically connected to the passive devices. third pads are on a top surface of the second semiconductor substrate. the third semiconductor chip comprises fourth pads on a bottom surface of the third semiconductor chip. the first pads and the second pads are directly connected to each other. the third pads and the fourth pads are directly connected to each other.
Inventor(s): Hyunsoo Chung of Hwaseong-si (KR) for samsung electronics co., ltd., Young Lyong Kim of Anyang-si (KR) for samsung electronics co., ltd., Inhyo Hwang of Asan-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/00, H01L23/31, H01L23/498, H01L25/00
CPC Code(s): H01L25/0657
Abstract: a semiconductor package includes a first semiconductor chip on a substrate, a buried solder ball on the substrate and spaced apart from the first semiconductor chip, a first molding layer on the substrate and encapsulating and exposing the first semiconductor chip and the buried solder ball, a second semiconductor chip on the first molding layer and vertically overlapping the buried solder ball and a portion of the first semiconductor chip, and a second molding layer on the first molding layer and covering the second semiconductor chip. the second semiconductor chip is supported on the first semiconductor chip through a dummy solder ball between the first and second semiconductor chips. the second semiconductor chip is connected to the buried solder ball through a signal solder ball between the buried solder ball and the second semiconductor chip.
Inventor(s): Jimin CHOI of Seoul (KR) for samsung electronics co., ltd., Jeonil LEE of Suwon-si (KR) for samsung electronics co., ltd., Jongmin LEE of Hwaseong-si (KR) for samsung electronics co., ltd., Juik LEE of Anyang-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/367, H01L23/42, H01L23/48
CPC Code(s): H01L25/0657
Abstract: a thermal pad of a semiconductor chip, a semiconductor chip including the thermal pad, and a method of manufacturing the semiconductor chip, the thermal pad including a thermal core in a trench at a lower surface of a semiconductor substrate, the thermal core being configured to receive heat generated from a through silicon via (tsv) vertically extending through the semiconductor substrate; a thermal head connected to the thermal core and protruding from the lower surface of the semiconductor substrate, the thermal head being configured to dissipate the heat in the thermal core; a first insulation layer between an inner surface of the trench and the thermal core; and a second insulation layer between the first insulation layer and the thermal core.
Inventor(s): EUNSEOK SONG of Hwaseong-si (KR) for samsung electronics co., ltd., KYUNG SUK OH of Seongnam-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L25/065, H01L23/31, H01L23/522, H01L23/538
CPC Code(s): H01L25/0657
Abstract: a semiconductor package includes a substrate, an interposer on the substrate, a semiconductor chip stack on the interposer, a silicon capacitor layer on the interposer, a first semiconductor chip on the silicon capacitor layer, and a molding layer at least partially surrounding side surfaces of the semiconductor chip stack, the silicon capacitor layer and the first semiconductor chip. the semiconductor chip stack and the first semiconductor chip are laterally spaced apart from each other. a top surface of the first semiconductor chip is coplanar with a top surface of the molding layer and a top surface of the semiconductor chip stack.
Inventor(s): Kukhwan KIM of Suwon-si (KR) for samsung electronics co., ltd., Jaehyung HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H02J50/00, H02J50/10
CPC Code(s): H02J50/005
Abstract: according to an embodiment, an electronic device for charging a wearable device includes a housing including a guide hole, and an elastic structure configured to supply power to the wearable device. the elastic structure includes a first portion at least partially disposed in the guide hole, a second portion rotatably coupled with the housing, and a third portion connecting the first portion and the second portion. the third portion is deformed by a rotation of the second portion such that the third portion is configured to change a distance between a rotation axis of the second portion and one position of the third portion.
Inventor(s): Solhee In of Suwon-si (KR) for samsung electronics co., ltd., Jaesup Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03H11/28, H02M7/217
CPC Code(s): H03H11/28
Abstract: provided is an electronic device including a matching circuit having different matching impedance values according to connection states of the plurality of switches, and configured to output a matching power signal by impedance matching an input power signal, a power conversion circuit configured to convert the matching power signal into an output power signal, and a controller configured to set the matching impedance value of the matching circuit by transmitting a switching signal for adjusting the connection states of the plurality of switches to the plurality of switches, wherein the controller is further configured to receive the output power signal from the power conversion circuit while changing the matching impedance value, select an optimal matching impedance value based on a plurality of output power signals that are received, and set the optimal matching impedance value as the matching impedance value.
Inventor(s): Moon-Chul Choi of Suwon-si (KR) for samsung electronics co., ltd., Sung-Yong Cho of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03K19/00, G11C7/10, H04L25/03
CPC Code(s): H03K19/0005
Abstract: an integrated circuit device may include a transmission driver and an equalizer. the transmission driver may be configured to, in response to a transmission control data, transmit an output signal to an outside through a signal line in a transmission operation that outputs the output signal to the outside, and provide termination resistance in a reception operation that receives an input signal from the outside through the signal line. the equalizer may be configured to, in response to an equalizer control data, amplify high-frequency components of the output signal in the transmission operation, and to provide termination resistance in the reception operation.
Inventor(s): JONGMI LEE of Suwon-si (KR) for samsung electronics co., ltd., JAEHOON LEE of Suwon-si (KR) for samsung electronics co., ltd., SEONGEUN CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03M1/46, H03M1/12, H03M1/30
CPC Code(s): H03M1/462
Abstract: an analog-to-digital converter adc includes a first successive approximation register analog-to-digital converter (sar adc) configured to convert an in-phase input signal to digital data using a first integrator, a second successive approximation register analog-to-digital converter (sar adc) configured to convert a quadrature input signal to digital data using a second integrator, and first to fourth sampling capacitors configured to transmit an output of the first integrator to an input terminal of the second integrator, and transmit an output of the second integrator to an input terminal of the first integrator when the first integrator and the second integrator integrate the sampled in-phase input signal and the quadrature input signal, respectively. the first and second sar adcs and the first to fourth sampling capacitors are driven according to an operation sequence of a sampling stage, a conversion stage, and an integration stage.
Inventor(s): JONGMI LEE of Suwon-si (KR) for samsung electronics co., ltd., SEONGEUN CHO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H03M3/00
CPC Code(s): H03M3/458
Abstract: disclosed is a loop filter, comprising, a first single-amplifier biquad (sab) integrator configured to apply an integration operation to an in-phase (i) input signal; a second sab integrator configured to apply an integration operation to a quadrature (q) input signal; a first cross-coupled path between an output terminal of the first sab integrator and an input side of the second sab integrator and configured to apply a first gain to an output voltage of the first sab integrator; and a second cross-coupled path between an output terminal of the second sab integrator and an input side of the first sab integrator and configured to apply a negative of the first gain to an output voltage of the second sab integrator.
Inventor(s): Yohan MOON of Suwon-si (KR) for samsung electronics co., ltd., Hyoseok NA of Suwon-si (KR) for samsung electronics co., ltd., Dongil YANG of Suwon-si (KR) for samsung electronics co., ltd., Jonghun YOO of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04B1/00, H03F3/24
CPC Code(s): H04B1/0064
Abstract: an electronic device according to various embodiments comprises a first power supply circuit, a second power supply circuit, a switch, a first radio frequency front end (fem), a second fem, a third fem, a fourth fem, and a processor, wherein, in order to transmit a signal using a third pa in the third fem or a fourth pa in the fourth fem operating on the basis of a second voltage provided from the second power supply circuit, on the basis of transmitting a signal using a first pa in the first fem operating on the basis of a first voltage provided from the first power supply circuit, the processor can electrically connect the third pa and the fourth pa through the second power supply circuit and the switch. various other embodiments may be possible.
Inventor(s): Hamid SABER of San Diego CA (US) for samsung electronics co., ltd., Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04L25/02, H04W24/02
CPC Code(s): H04B7/0626
Abstract: an apparatus may include a receiver configured to receive a reference signal using a channel, and receive restriction information relating to the channel, a processing circuit configured to determine channel information based on the reference signal, and generate, using a machine learning model, a representation based on the channel information and the restriction information, a transmitter configured to transmit the representation.
20250055535. SL CSI-RS SIGNALING_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Emad Nader Farag of Flanders NJ (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04W72/25
CPC Code(s): H04B7/0626
Abstract: methods and apparatuses for sidelink (sl) channel state information (csi)-reference signal (rs) signaling. a method of operating a user equipment (ue) includes receiving configuration information for a sl slot, the sl slot including a first part of the sl slot and a second part of the sl slot. the first part includes one or more sl channels. the second part includes one or more sl csi-rs resources. the method further includes receiving a first sl channel from the one or more sl channels; determining, based on the first sl channel, a first sl csi-rs resource from the one or more sl csi-rs resources; and receiving the first sl csi-rs resource.
Inventor(s): Zhe CHEN of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04B7/06, H04B17/318, H04L1/1607
CPC Code(s): H04B7/0626
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. the present disclosure provides a method performed by a ue in a wireless communication system, the method including: receiving a channel state information (csi) report configuration, wherein the csi report configuration includes information of a first resource; and determining and/or reporting a csi parameter based on the first resource, wherein: when the first resource is periodic or semi-persistent, the first resource corresponds to a plurality of measurement occasion groups, the csi parameter is determined based on each of the plurality of measurement occasion groups; or when the first resource is aperiodic, the first resource includes a plurality of resource groups in a plurality of time units, the csi parameter is determined based on each of the plurality of resource groups.
Inventor(s): Shailesh CHAUDHARI of San Diego CA (US) for samsung electronics co., ltd., Hyuk Joon KWON of San Diego CA (US) for samsung electronics co., ltd., Karl CHAHINE of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04B7/06
CPC Code(s): H04B7/06952
Abstract: a system and a method are disclosed for performing beam tracking using a gnn. a method of beam prediction by a ue includes receiving an input feature vector; comparing the input feature vector to a lookup table of rated predicted beams; selecting a corresponding predicted beam having a highest rating from the lookup table; and receiving, from a base station, a signal using the selected predicted beam.
Inventor(s): Seongmok LIM of Gyeonggi-do (KR) for samsung electronics co., ltd., Kyoungmin PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Ameha Tsegaye ABEBE of Gyeonggi-do (KR) for samsung electronics co., ltd., Youngrok JANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyoungju JI of Gyeonggi-do (KR) for samsung electronics co., ltd., Kyungjun CHOI of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04B17/318, H04B7/06
CPC Code(s): H04B17/328
Abstract: the disclosure relates to a 5g or 6g communication system for supporting higher data transfer rates. the disclosure relates to the operation of a terminal and abase station in a wireless communication system and, more specifically to, an uplink reference signal transmission and reception method in a wireless communication system and an apparatus capable of performing the same. the disclosure provides an apparatus and a method capable of effectively providing services in a mobile communication system. a method performed a terminal includes receiving at least one reference signal transmitted from a base station, generating, based on the received at least one reference signal, a beam report to support simultaneous multi-panel transmission, and transmitting the beam report to the base station.
Inventor(s): Sangkyu BAEK of Gyeonggi-do (KR) for samsung electronics co., ltd., Jaehyuk JANG of Gyeonggi-do (KR) for samsung electronics co., ltd., Anil AGIWAL of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04L1/1812, H04L1/1829, H04W76/28
CPC Code(s): H04L1/1812
Abstract: a method performed by user equipment in a wireless communication system, provided in the present disclosure, may comprise the steps of: identifying that drx has been configured; receiving a physical downlink control channel (pdcch) at an active time of the drx, the pdcch including information for requesting one-shot harq feedback, on the basis of a request for the one-shot harq feedback, performing harq feedback corresponding to an identifier (id) of a first harq process; and starting a drx harq round trip time (rtt) timer associated with the first harq process.
Inventor(s): Miao ZHOU of Beijing (CN) for samsung electronics co., ltd., Feifei SUN of Beijing (CN) for samsung electronics co., ltd., Min WU of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04W92/18
CPC Code(s): H04L5/0026
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system for supporting a higher data transmission rate. a method performed by a first node in a communication system is provided. the method includes obtaining first information, wherein the first information includes information on channel state information reference signal (csi-rs) resources and transmitting csi-rs based on the first information, wherein, in case that the information on the csi-rs resources indicates that multiplexing type between the csi-rs resources is time division multiplexing, an adjacent symbol before a first symbol of time division multiplexed csi-rs resources is a duplication of the first symbol of the time division multiplexed csi-rs resources, and wherein, in case that all csi-rs resources are used by the first node and the first node uses a same beam for transmission on the csi-rs resources, the adjacent symbol before the first symbol of the csi-rs resources is not a duplication of other symbols.
20250055634. PORT-TO-RESOURCE MAPPING_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Gilwon Lee of McKinney TX (US) for samsung electronics co., ltd., Md. Saifur Rahman of Plano TX (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04B7/06
CPC Code(s): H04L5/0051
Abstract: apparatuses and methods for port and resource mapping rules. a method performed by a user equipment (ue) includes receiving information about a channel state information (csi) report associated with k>1 csi reference signal (csi-rs) resources each with 2nncsi-rs ports. here, nand nare numbers of csi-rs antenna ports of each csi-rs resource in first and second dimensions, respectively, for each of dual-polarized antenna groups. the method further includes measuring the k csi-rs resources and determining and transmitting the csi report including a precoding matrix indicator (pmi) associated with 2nnpmi ports. here, 2nn=2knn. nand nare numbers of pmi antenna ports in the first and second dimensions, respectively, for each of the dual-polarized antenna groups and (n,n) correspond to either (kn,n) or (n,kn), determined based on a port-mapping method between pmi and csi-rs port indexes with a csi-rs resource index.
Inventor(s): Youngrok JANG of Suwon-si (KR) for samsung electronics co., ltd., Ameha Tsegaye ABEBE of Suwon-si (KR) for samsung electronics co., ltd., Seongmok LIM of Suwon-si (KR) for samsung electronics co., ltd., Hyoungju JI of Suwon-si (KR) for samsung electronics co., ltd., Kyungjun CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04B7/06
CPC Code(s): H04L5/0051
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. according to various embodiments, a method performed by a user equipment (ue) in a wireless communication system, the method comprising: receiving, from a base station, information configuring a channel state information-reference signal (csi-rs) resource with more than 32 antenna ports, wherein the csi-rs resource is an aggregation of a plurality of csi-rs resources; and receiving, from the base station, a csi-rs on the csi-rs resource, wherein each of the plurality of csi-rs resources has an equal number of antenna ports, and wherein a number of the plurality of csi-rs resources is one of two, three, or four.
Inventor(s): Sungjin PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Cheolkyu SHIN of Gyeonggi-do (KR) for samsung electronics co., ltd., Kyoungmin PARK of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04L5/00, H04W72/0446, H04W72/25
CPC Code(s): H04L5/0051
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a first ue in a wireless communication system is provided. the method includes receiving, from a second ue, first sci on a pscch, the first sci including an sci format field for a second sci, in case that the sci format field includes a first value corresponding to an sci format for an sl prs for a shared sl prs resource pool, receiving, from the second ue, the second sci corresponding to the sci format on a pssch, and receiving, from the second ue, the sl prs on the pssch based on the second sci.
Inventor(s): Marian Rudolf of Longueuil (CA) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd., Emad Nader Farag of Flanders NJ (US) for samsung electronics co., ltd.
IPC Code(s): H04L5/14, H04W72/0453, H04W72/1268, H04W72/1273, H04W72/231, H04W76/20
CPC Code(s): H04L5/14
Abstract: methods and apparatuses for transmissions and receptions in full-duplex systems. a method of operating a user equipment (ue) includes receiving a first candidate subband full-duplex (sbfd) configuration associated with a first transmission configuration indicator (tci) state configuration on a cell; receiving a second candidate sbfd configuration associated with a second tci state configuration on the cell; and identifying a tci state code point. the method further includes selecting (i) the first candidate sbfd configuration when a value of the tci state code point is associated with the first tci state configuration or (ii) the second candidate sbfd configuration when the value of the tci state code point is associated with the second tci state configuration and receiving or transmitting a channel or signal based on the selected sbfd configuration.
Inventor(s): Mohamed Mokhtar Gaber Moursi AWADIN of San Diego CA (US) for samsung electronics co., ltd., Jung Hyun BAE of San Diego CA (US) for samsung electronics co., ltd.
IPC Code(s): H04L5/14, H04L5/00, H04W72/231
CPC Code(s): H04L5/14
Abstract: a system and a method are disclosed for determining a quasi co-located (qcl) source reference signal (rs) to receive a target signal or channel. the method includes receiving antenna indicator information indicating one or more first antenna configurations and one or more second antenna configurations from a base station; identifying a first set of symbols at which the one or more first antenna configurations are applied and a second set of symbols at which the one or more second antenna configurations are applied; and receiving the target signal or channel using a version of the qcl source rs at a time instance based on whether the time instance occurs in the first set of symbols or the second set of symbols.
Inventor(s): Ashutosh KAUSHIK of Bangalore (IN) for samsung electronics co., ltd., Deepanshu Gautam of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04L41/0233, H04B7/185
CPC Code(s): H04L41/0233
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a system and a method are provided for ntn management. a method performed by an mns producer in a wireless communication system is provided. the method includes receiving, from an mns consumer, a request for creating an moi of an amf ioc, wherein the amf ioc includes a first attribute for a satellite coverage information; and transmitting, to the mns consumer, a response of a creation of the moi.
Inventor(s): Kisuk KWEON of Suwon-si (KR) for samsung electronics co., ltd., Sangsoo JEONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04L67/141, H04L67/146, H04W76/10
CPC Code(s): H04L67/141
Abstract: the present disclosure relates to: a communication technique for merging an iot technology with a 5g communication system for supporting a higher data transmission rate than a 4g system; and a system therefor. the present disclosure can be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, healthcare, digital education, retail businesses, security- and safety-related services, and the like) on the basis of a 5g communication technology and an iot-related technology. an embodiment of the present disclosure proposes a method for determining the recovery order of a pfcp session by allowing a priority to be included when allocating a group id for group transmission of pfcp session contexts.
Inventor(s): Hyerim BAE of Suwon-si (KR) for samsung electronics co., ltd., Jihea PARK of Suwon-si (KR) for samsung electronics co., ltd., Huijong SHIN of Suwon-si (KR) for samsung electronics co., ltd., Seho CHANG of Suwon-si (KR) for samsung electronics co., ltd., Jinwook CHUN of Suwon-si (KR) for samsung electronics co., ltd., Wonsun CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/02
CPC Code(s): H04M1/0243
Abstract: at least one processor, comprising processing circuitry, of an electronic device according to an example embodiment is, individually and/or collectively, configured to execute one or more applications on a cover display in a folded state of the electronic device; control the electronic device to display, in response to switching of the electronic device from the folded state to a half-folded state of the electronic device based on rotation of the first housing, a list of the one or more applications executed on the cover display on a first displaying region of a flexible display; and control the electronic device to display, in response to switching of the electronic device from the half-folded state to an unfolded state based on rotation of a third housing, a screen associated with at least one of the one or more applications on the flexible display.
Inventor(s): Jinik KIM of Suwon-si (KR) for samsung electronics co., ltd., Namjoon PARK of Suwon-si (KR) for samsung electronics co., ltd., Seoyoung JIN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04M1/72403, G06F3/01, H04M1/72454
CPC Code(s): H04M1/72403
Abstract: an electronic device including a display, a gyro-sensor, an acceleration sensor, a communication module, memory storing one or more computer programs, and one or more processors communicatively coupled to the display and the memory is provided. the one or more computer programs include computer-executable instructions that, when executed by the one or more processors individually or collectively, cause the electronic device to identify whether an automatic screen rotation function is activated, request an external electronic device to provide direction data of the external electronic device related to a degree of rotation of the external electronic device with regard to a designated axis through the communication module, thereby acquiring the direction data, identify a direction of the electronic device related to the degree of rotation of the electronic device with regard to a designated axis, based on values measured by the gyro sensor and the acceleration sensor, determine a user's posture, based on direction data of the electronic device and direction data of the external electronic device, and determine a screen direction mode to be displayed on the display of the electronic device, based on the user's posture.
Inventor(s): Sun-il LEE of Seoul (KR) for samsung electronics co., ltd., Jung-hye MIN of Yongin-si (KR) for samsung electronics co., ltd., Na-rae CHOI of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/122, H04N19/136, H04N19/157, H04N19/159, H04N19/176
CPC Code(s): H04N19/122
Abstract: provided is a method of decoding motion information characterized in that information for determining motion-related information includes spatial information and time information, wherein the spatial information indicates a direction of spatial prediction candidates used for sub-units from among spatial prediction candidates located on a left side and an upper side of a current prediction unit, and the time information indicates a reference prediction unit of a previous picture used for prediction of the current prediction unit. further, an encoding apparatus or a decoding apparatus capable of performing the above described encoding or decoding method may be provided.
Inventor(s): Seung Eon KIM of Suwon-si (KR) for samsung electronics co., ltd., Yeongwoong Kim of Suwon-si (KR) for samsung electronics co., ltd., Hui Yong Kim of Daejeon (KR) for samsung electronics co., ltd., Won Hee Lee of Suwon-si (KR) for samsung electronics co., ltd., Suyong Bahk of Yongin-si (KR) for samsung electronics co., ltd., Young Hun Sung of Suwon-si (KR) for samsung electronics co., ltd., Dokwan Oh of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/42, H04N19/105, H04N19/124, H04N19/13, H04N19/139, H04N19/31, H04N19/61, H04N19/80, H04N19/85
CPC Code(s): H04N19/42
Abstract: there is provided a method for neural network-based video encoding. the method includes estimating a motion vector between an input image and a reference image based on a temporal layer of the input image, transforming the motion vector into a latent representation, scaling the latent representation of the motion vector based on the temporal layer of the input image and obtaining a temporal context of the input image based on the scaled latent representation of the motion vector and the reference image.
Inventor(s): Seungsoo JEONG of Suwon-si (KR) for samsung electronics co., ltd., Minwoo PARK of Suwon-si (KR) for samsung electronics co., ltd., Kiho CHOI of Suwon-si (KR) for samsung electronics co., ltd., Anish TAMSE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04N19/513, H04N19/109, H04N19/139, H04N19/176, H04N19/70, H04N19/91
CPC Code(s): H04N19/513
Abstract: provided is a video decoding method including: generating a merge candidate list including neighboring blocks referred to to predict a motion vector of a current block in a skip mode or a merge mode; when a merge motion vector difference is used according to merge difference mode information indicating whether the merge motion vector difference and a motion vector determined from the merge candidate list are used, determining a base motion vector from a candidate determined among the merge candidate list based on merge candidate information; determining the motion vector of the current block by using the base motion vector and a merge motion vector difference of the current block, the merge motion vector difference being determined by using a distance index and direction index of the merge motion vector difference of the current block; and reconstructing the current block by using the motion vector of the current block.
Inventor(s): Sai Hemanth KASARANENI of Noida (IN) for samsung electronics co., ltd., Nitin JAIN of Noida (IN) for samsung electronics co., ltd., Gunit ANAND of Noida (IN) for samsung electronics co., ltd., Chhavi YADAV of Noida (IN) for samsung electronics co., ltd., Baljeet KUMAR of Noida (IN) for samsung electronics co., ltd.
IPC Code(s): H04N23/90, G06T7/246, G06V10/40, G06V10/70, G06V20/50, H04N23/50, H04N23/62, H04N23/68
CPC Code(s): H04N23/90
Abstract: a method for seamless video capture during flex-state transition in a foldable device includes identifying, by one or more sensors of the foldable device, an initiation of a flex movement of the foldable device based on a plurality of frames of a video being captured by a source camera from among one or more cameras of the foldable device; extracting, based on the identifying of the initiation of the flex movement, a semantic scene from the plurality of frames to determine one or more regions of interest (rois) in the semantic scene; determining an optical flow for each of the one or more rois; determining a flex trajectory of the foldable device; determining a target camera from among the one or more cameras; determining a transition period to switch to the target camera; and switching capturing of the plurality of frames from the source camera to the target camera.
Inventor(s): Xin PAN of Xi'An (CN) for samsung electronics co., ltd., Dong XU of Xi'An (CN) for samsung electronics co., ltd., Shaoying ZHAO of Xi'An (CN) for samsung electronics co., ltd., Yajun ZHI of Xi'An (CN) for samsung electronics co., ltd.
IPC Code(s): H04R3/12, G06F3/16, H04R1/10
CPC Code(s): H04R3/12
Abstract: the present disclosure provides methods, apparatuses, and computer-readable mediums for audio sharing. in some embodiments, a method of audio sharing method to be performed by a first user device includes advertising an audio sharing message including a predetermined set identification, based on an indication from a user to share an audio content. the method further includes receiving, from a second audio playing device, an audio sharing confirmation message indicating that the second audio playing device has switched from an original set identification to the predetermined set identification. the method further includes establishing a third short-range wireless connection with the second audio playing device. the method further includes sending an audio data packet of the audio content to the first audio playing device, using the first short-range wireless connection, and the second audio playing device, using the third short-range wireless connection.
Inventor(s): Sunghee HWANG of Suwon-si (KR) for samsung electronics co., ltd., Sangchul KO of Suwon-si (KR) for samsung electronics co., ltd., Kyungae KIM of Suwon-si (KR) for samsung electronics co., ltd., Jungkyu KIM of Suwon-si (KR) for samsung electronics co., ltd., Woohyun NAM of Suwon-si (KR) for samsung electronics co., ltd., Yoonjae SON of Suwon-si (KR) for samsung electronics co., ltd., Kyunggeun LEE of Suwon-si (KR) for samsung electronics co., ltd., Tammy LEE of Suwon-si (KR) for samsung electronics co., ltd., Hyunkwon CHUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04S7/00
CPC Code(s): H04S7/301
Abstract: disclosed are an audio processing apparatus and method including obtaining at least one substream and additional information by parsing a bitstream, obtaining at least one audio signal of at least one channel group (cg) by decompressing the at least one substream, and obtaining a multi-channel audio signal by de-mixing the at least one audio signal of the at least one cg, based on the additional information. the additional information includes a weight index offset identified based on an energy value of a height channel of the multi-channel audio signal and an energy value of a surround channel of the multi-channel audio signal.
Inventor(s): Samuel Albert of Robbinsville NJ (US) for samsung electronics co., ltd., Xiaochuan Ma of Hillsborough NJ (US) for samsung electronics co., ltd., Daoud Burghal of San Jose CA (US) for samsung electronics co., ltd., Hao Chen of Allen TX (US) for samsung electronics co., ltd., Russell Douglas Ford of Campbell CA (US) for samsung electronics co., ltd., Yan Xin of Princeton NJ (US) for samsung electronics co., ltd., Jianzhong Zhang of Dallas TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W4/021, H04W84/12
CPC Code(s): H04W4/021
Abstract: a method includes selecting a subset of access points from among multiple candidate access points associated with a building. the method also includes receiving wi-fi signal strength data from the subset of access points. the method further includes using a machine learning (ml) localization algorithm to determine a proximity of a device within the building based on the received wi-fi signal strength data.
Inventor(s): Md. Imtiaz HOSSAIN of Dhaka (BD) for samsung electronics co., ltd., Md. Zahid Hasan POLIN of Dhaka (BD) for samsung electronics co., ltd., Towsif Alam CHOWDHURY of Dhaka (BD) for samsung electronics co., ltd., Shafquat MAHBUB of Dhaka (BD) for samsung electronics co., ltd.
IPC Code(s): H04W4/10, H04W4/021, H04W4/08
CPC Code(s): H04W4/10
Abstract: an example method for providing a mission critical push to talk (mcptt) service may include receiving a message created from any one user among users of an mcptt group, analyzing the message, and setting a floor priority of the users of the mcptt group, based on a result of analyzing the message. the analyzing of the message includes classifying a type of the message. the classifying of the type of the message includes identifying whether the message is an interrogative type message or an imperative type message.
Inventor(s): Yanze FU of Beijing (CN) for samsung electronics co., ltd., Runsen TANG of Beijing (CN) for samsung electronics co., ltd., Haijie QIU of Beijing (CN) for samsung electronics co., ltd., Yiran JIN of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W24/02, H04W8/22, H04W16/28, H04W36/08, H04W36/24, H04W64/00
CPC Code(s): H04W24/02
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. embodiments of the present disclosure provide a method performed by a user equipment (ue) in a wireless communication system, the method comprising: transmitting, to a serving node, assistance information for a configuration of measurement configuration information related to radio resource management (rrm); and receiving, from the serving node, the measurement configuration information.
Inventor(s): Eric YIP of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W24/02, H04W72/20, H04W72/51
CPC Code(s): H04W24/02
Abstract: disclosed is a method and apparatus for providing a media service. a method performed by a network includes identifying an ai model corresponding to a service, negotiating a split inference configuration with a ue, performing a split inference with the ue, based on the ai model and the split inference configuration, and providing the service based on a result of the split inference.
Inventor(s): Changsung LEE of Suwon-si (KR) for samsung electronics co., ltd., Suhwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Sooeun SONG of Suwon-si (KR) for samsung electronics co., ltd., Jaehong YI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W28/02
CPC Code(s): H04W28/0236
Abstract: a fifth-generation (5g) or sixth-generation (6g) communication system for supporting higher data rates after fourth-generation (4g) communication system such as long-term evolution (lte) is provided. in the communication system, a centralized unit (cu) is provided. the cu transmits, to a distributed unit (du), a message requesting information for determination of quality of experience (qoe) bottleneck, receives, from the du, a message including the information for determination of qoe bottleneck, determines a qoe bottleneck factor based on the received information for determination of qoe bottleneck, wherein the qoe bottleneck factor is associated with a traffic state in a radio access network (ran) or a core network, and performs qoe control based on the determined qoe bottleneck factor.
Inventor(s): Hyunjeong KANG of Suwon-si (KR) for samsung electronics co., ltd., Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W28/02, H04W88/04
CPC Code(s): H04W28/0268
Abstract: the present disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. in addition, the present disclosure provides a method performed by a relay terminal in a wireless communication system, comprising the steps of: receiving, from a first terminal, an assistance message including first quality of service (qos) information for a data service between the first terminal and a second terminal; acquiring second qos information related to the relay terminal and the first terminal on the basis of the first qos information; transmitting the second qos information to the first terminal; acquiring first sidelink radio bearer configuration information on the basis of the second qos information; transmitting, to the first terminal, a radio resource control (rrc) reconfiguration sidelink message including the first sidelink radio bearer configuration information; and receiving an rrc reconfiguration complete sidelink message from the first terminal.
Inventor(s): Jaehyeon BAE of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyunkoo YANG of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W28/04, H04L1/00, H04W28/24
CPC Code(s): H04W28/04
Abstract: the disclosure relates to a 5g or 6g communication system for supporting higher data rate. a method performed by an smf in a communication system includes receiving, from a pcf, a pcc rule including a protocol descriptor that indicates support of a pdu set-based fec, transmitting, to a upf, packet handling information including detection rule information for distinguishing an fec source packet and an fec repair packet in the pdu set-based fec, and transmitting, to an amf, a qos profile including a qos rule updated based on the pcc rule.
Inventor(s): Kisuk KWEON of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W28/06, H04W68/02, H04W76/30
CPC Code(s): H04W28/06
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. in accordance with an aspect of the disclosure, a method of a session management function (smf) in a communication system is provided. the method includes receiving, from a user plane function (upf), a data notification associated with downlink data for a protocol data unit (pdu) session, identifying whether the pdu session is in a suspend mode, in case that the pdu session is in the suspend mode, transmitting, to an access and mobility management function (amf), a namf_mt_enableuereachability request message, and receiving, from the amf, a namf_mt_enableuereachability response message based on the namf_mt_enableuereachability request message.
Inventor(s): Shouvik GUHA of Bangalore (IN) for samsung electronics co., ltd., Shanthossh NAGARAJAN of Bangalore (IN) for samsung electronics co., ltd., Rajendrababu BANDARU of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W36/08, H04W36/30
CPC Code(s): H04W36/0058
Abstract: a method and a user equipment (ue) for power management by the ue connected to a network are provided. the method includes determining, by the ue, a mobility state of the ue based on satisfaction of at least one of a plurality of predefined conditions, determining, by the ue, a list of priority cells among a plurality of available cells, wherein each priority cell in the list of priority cells is associated with a priority value based on a plurality of predefined priority conditions, and switching, by the ue, the ue to a restricted mobility mode based on the determined mobility state and the priority value associated with each priority cell in the list of the priority cells, wherein switching the ue to the restricted mobility mode includes connecting the ue in one of a first sub-mode, wherein the ue refrains from transmitting a measurement report (mr) and performing cell reselection, for a predetermined time period, if the ue is in an idle state, or a second sub-mode, wherein the ue transmits the mr for a predefined number of times, if the ue is in a connected state and if the ue is configured with infinite mr configuration, wherein the infinite mr configuration corresponds to a number of mr transmitted by the ue until the ue receives a response to the mr from the network.
Inventor(s): Jungsuk BAIK of Suwon-si (KR) for samsung electronics co., ltd., Sooeun SONG of Suwon-si (KR) for samsung electronics co., ltd., Suhwook KIM of Suwon-si (KR) for samsung electronics co., ltd., Changsung LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/00, H04W24/02, H04W72/1268
CPC Code(s): H04W36/0058
Abstract: the disclosure relates to a 5g or 6g communication system for supporting higher data transfer rates. a method performed by a first base station in a communication system is provided. the method includes receiving a measurement report from a terminal, transferring, to a second base station, a handover request message including information for transferring an artificial intelligence (ai) model, determining a first ai model for transferring the ai model of the terminal based on a response message for a handover request and ai information of the terminal previously received from the terminal, the handover request including response information to the information for transferring the ai model received from the second base station, and transferring, to the terminal, the determined first ai model and a message for performing handover.
Inventor(s): Youngkyo BAEK of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W36/26, H04W36/00, H04W36/08
CPC Code(s): H04W36/26
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method of a session management function (smf) entity in a wireless communication system includes: receiving, from a target base station, a first message for a handover; identifying whether the first message includes a first indication indicating a protocol data unit (pdu) set-based handling support of the target base station; and transmitting, to the target base station, at least one pdu set quality of service (qos) parameter based on the first indication.
Inventor(s): Hong WANG of Beijing (CN) for samsung electronics co., ltd., Weiwei WANG of Beijing (CN) for samsung electronics co., ltd., Lixiang XU of Beijing (CN) for samsung electronics co., ltd.
IPC Code(s): H04W36/30, H04L5/00, H04W36/32
CPC Code(s): H04W36/30
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method performed by a second node in a communication system is provided. the method includes transmitting, to a third node, a first message including first indication information for indicating whether the second node supports handling of a packet data unit (pdu) set of an extended reality (xr) service and receiving, from the third node, a second message, wherein if the first indication information indicates that the second node supports the handling of the pdu set of the xr service, the second message includes xr service configuration information.
Inventor(s): Hyesung KIM of Suwon-si (KR) for samsung electronics co., ltd., Sangjun MOON of Suwon-si (KR) for samsung electronics co., ltd., Dongeun SUH of Suwon-si (KR) for samsung electronics co., ltd., Hoyeon LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W48/16, H04W12/06, H04W24/10
CPC Code(s): H04W48/16
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. a method for operating a sensing network function in a communication system supporting integrated sensing and communication (isac), according to an embodiment, may comprise receiving a first request message for a sensing service, transmitting a second request message for requesting sensing policy data based on the first request message, and receiving a response message corresponding to the second request message and including sensing service quality information.
Inventor(s): Mahmoud WATFA of Staines (GB) for samsung electronics co., ltd., Ashok Kumar NAYAK of Bangalore (IN) for samsung electronics co., ltd., Lalith KUMAR of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W48/18, H04M15/00, H04W12/06
CPC Code(s): H04W48/18
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. disclosed is a method of performing slice management in a telecommunication network, wherein if a current slice is to be replaced by a replacement slice via a replacement procedure, the telecommunication network verifies if the current slice is undergoing or scheduled to undergo an authentication procedure, and if so, the replacement procedure is halted and the authentication procedure is progressed.
Inventor(s): Sivasankar COMARAVELOU of Bangalore (IN) for samsung electronics co., ltd., Chetan Ramesh Ganig of Bangalore (IN) for samsung electronics co., ltd., Prasad Basavaraj Dandra of Bangalore (IN) for samsung electronics co., ltd., Shrinithi Andal Tensingh of Bangalore (IN) for samsung electronics co., ltd., Danish Ehsan Hashmi of Bangalore (IN) for samsung electronics co., ltd., Lalith Kumar of Bangalore (IN) for samsung electronics co., ltd., Utsav Sinha of Bangalore (IN) for samsung electronics co., ltd.
IPC Code(s): H04W48/18, H04W8/20, H04W60/04, H04W84/04
CPC Code(s): H04W48/18
Abstract: a method for optimizing selection of a standalone non-public network (snpn) by a user equipment (ue), includes: receiving, from a public land mobile network (plmn) or a snpn, snpn selection parameters associated with a plmn subscription list corresponding to one or more universal subscriber identity modules (usims), wherein the snpn selection parameters comprises a list of snpns, and a plurality of configuration parameters supported by the plmn for the one or more usims; and selecting at least one snpn from the list of snpns based on the plmn subscription list and storing snpn selection parameters along with a usim being associated with the snpn selection parameters.
Inventor(s): Seokwoo LEE of Suwon-si (KR) for samsung electronics co., ltd., Hokyung KANG of Suwon-si (KR) for samsung electronics co., ltd., Yundong KIM of Suwon-si (KR) for samsung electronics co., ltd., Bowoong SEO of Suwon-si (KR) for samsung electronics co., ltd., Hyunchul OH of Suwon-si (KR) for samsung electronics co., ltd., Hyunsuk CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W52/28, H04M1/02
CPC Code(s): H04W52/28
Abstract: an electronic device is provided. the electronic device includes: a foldable housing comprising a hinge structure, and a first and a second housing structures connected to the hinge structure; a flexible display, a wireless communication circuit disposed inside the foldable housing; a grip sensor disposed in the foldable housing; at least one sensor disposed inside the foldable housing; a processor disposed inside the first housing structure or the second housing structure and operatively connected to the flexible display, the wireless communication circuit, the grip sensor, and the at least one sensor; and a memory, operatively connected to the processor, storing instructions that cause the processor to: measure an angle between the first and the third surface and/or an angle between the second and the fourth surface; detect a distance between the foldable housing and an external object; and control transmission power of the wireless communication circuit.
20250056500. PAGING RECEPTION AND TRANSMISSION_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Anil Agiwal of Allen TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W68/02, H04W24/08, H04W52/02, H04W72/231
CPC Code(s): H04W68/02
Abstract: the user equipment (ue) includes a transceiver configured to receive information indicating a paging occasion, from a plurality of paging occasions, for receiving paging. the ue further includes a processor operably coupled to the transceiver. the processor is configured to determine the paging occasion for receiving paging based on the information. the transceiver is further configured to monitor the determined paging occasion for receiving paging.
20250056510. TRIGGERING ON-DEMAND SSB OR SIB1_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Hongbo Si of Allen TX (US) for samsung electronics co., ltd., Anil Agiwal of Allen TX (US) for samsung electronics co., ltd., Jeongho Jeon of San Jose CA (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/0446, H04W56/00
CPC Code(s): H04W72/0446
Abstract: methods and apparatuses for an operation for triggering on-demand synchronous signal/physical broadcast channel block (ssb) or a system information block 1 (sib1) in a wireless communication system. a method of a user equipment (ue) in a wireless communication system includes receiving a first physical downlink shared channel (pdsch) from a base station (bs) and determining, based on an indication in the first pdsch, that a set of synchronization signals and physical broadcast channel (ss/pbch) blocks is activated for transmission from the bs. the method further includes determining a time domain offset with respect to the first pdsch, determining that the set of ss/pbch blocks is to be transmitted after the time domain offset and receiving a ss/pbch block in the set of ss/pbch blocks.
Inventor(s): Youngrok JANG of Suwon-si (KR) for samsung electronics co., ltd., Seongmok LIM of Suwon-si (KR) for samsung electronics co., ltd., Hyoungju JI of Suwon-si (KR) for samsung electronics co., ltd., Kyungjun CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/1268, H04B7/06, H04L5/00, H04W72/0446, H04W72/231
CPC Code(s): H04W72/1268
Abstract: the disclosure relates to a 5generation (5g) or 6generation (6g) communication system for supporting higher data rates. a method performed by a user equipment (ue) in a wireless communication system is provided. the method includes receiving, from a base station, configuration information including first information one a first sounding reference signal (srs) resource set and a second srs resource set, second information associated with an physical uplink shared channel (pusch) repeat transmissions, and third information associated with slot configuration, receiving, from the base station, downlink control information (dci) scheduling a pusch, the dci including a csi request field triggering aperiodic channel state information (csi) reporting, and transmitting, to the base station, a first pusch associated with the first srs resource set and a second pusch associated with the second srs resource set, wherein the slot configuration configured based on the third information includes a slot for uplink transmission of the ue, and a subband non-overlapping full duplex (sbfd) slot including a subband for downlink reception of the ue and a subband for the uplink transmission of the ue, and wherein, in case that a number of resource element (re) allocated to a first repetition of repetitions of the first pusch is same with a number of re allocated to a first repetition of repetitions of the second pusch, the aperiodic csi reporting is multiplexed in the first repetition of the repetitions of the first pusch and the first repetition of the repetitions of the second pusch, respectively.
Inventor(s): Youngrok JANG of Suwon-si (KR) for samsung electronics co., ltd., Seongmok LIM of Suwon-si (KR) for samsung electronics co., ltd., Hyoungju JI of Suwon-si (KR) for samsung electronics co., ltd., Kyungjun CHOI of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/1273, H04B7/0413, H04W72/232
CPC Code(s): H04W72/1273
Abstract: the disclosure relates to a 5g or 6g communication system for supporting higher data transmission rates. the disclosure relates to the operation of a terminal and a base station in a wireless communication system. specifically, the disclosure relates to a method for transmission and reception using spatial multiplexing in a wireless communication system and an apparatus capable of performing the same. the disclosure provides an apparatus and a method that can effectively provide services in a mobile communication system.
Inventor(s): Seunghoon CHOI of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyunsuk RYU of Gyeonggi-do (KR) for samsung electronics co., ltd., Sungjin PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Jaewon LEE of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/1273, H04L5/16, H04W72/1268, H04W72/231
CPC Code(s): H04W72/1273
Abstract: the disclosure relates to a fifth generation (5g) or sixth generation (6g) communication system for supporting a higher data transmission rate. the disclosure provides a method performed by a user equipment (ue) in a communication system, comprising identifying a first physical downlink shared channel (pdsch) scheduled by first downlink control information (dci) associated with a first control resource set (coreset); identifying a second pdsch scheduled by second dci associated with a second coreset; identifying a physical uplink shared channel (pusch); identifying that the first pdsch, the second pdsch and the pusch are overlapped in time, wherein a first symbol of the pusch is between a first symbol of the first pdsch and a first symbol of the second pdsch; and receiving the first pdsch or the second pdsch, or transmitting the pusch.
20250056560. FREQUENCY SELECTIVE BEAM MANAGEMENT_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dalin Zhu of Allen TX (US) for samsung electronics co., ltd., Emad Nader Farag of Flanders NJ (US) for samsung electronics co., ltd., Eko Onggosanusi of Coppell TX (US) for samsung electronics co., ltd., Jianhua Mo of Allen TX (US) for samsung electronics co., ltd., Young Han Nam of Plano TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/232, H04L5/00, H04W72/0453
CPC Code(s): H04W72/232
Abstract: methods and apparatuses for frequency selective beam management. a method performed by a user equipment (ue) includes receiving first information related to a plurality of frequency subbands and receiving, in a first part of a downlink control information (dci), at least one first transmission configuration indication (tci) state and second information related to a second part of the dci. the method further includes determining, based on the first information, a first association between the plurality of frequency subbands and the at least one first tci state; for a first frequency subband from the plurality of frequency subbands, determining a first tci state based on the first association; and identifying, based on the determined first tci state, a spatial domain filter for transmitting or receiving ue-dedicated channels or signals for the first frequency subband.
Inventor(s): Carmela Cozzo of San Diego CA (US) for samsung electronics co., ltd., Aristides Papasakellariou of Houston TX (US) for samsung electronics co., ltd.
IPC Code(s): H04W72/232
CPC Code(s): H04W72/232
Abstract: apparatuses and methods for uplink (ul) control signaling for multiple serving cells. a method includes receiving first information for a first set of operation states for first one or more cells, second information for a second set of operation states for second one or more cells, and third information for a resource for transmission of a channel. an operation state from the first set of operation states or the second set of operation states is associated with sets of parameters for transmissions or receptions in at least one of time, frequency, and spatial domains. the method further includes determining one or more first operation states from the first set of operation states and one or more second operation states from the second set of operation states and transmitting the channel using the resource. the channel indicates the one or more first and second operation states.
Inventor(s): Sungjin PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Hyunsuk RYU of Gyeonggi-do (KR) for samsung electronics co., ltd., Kyoungmin PARK of Gyeonggi-do (KR) for samsung electronics co., ltd., Seunghoon CHOI of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H04W72/40, H04L5/00, H04W72/563
CPC Code(s): H04W72/40
Abstract: methods and devices are provided in a wireless communication system. a plurality of physical sidelink shared channels (psschs) is received, at a first user equipment (ue), from a second ue, on a first plurality of carriers. a plurality of physical sidelink feedback channels (psfchs) is transmitted, to the second ue, on a second plurality of carriers based on a first maximum number of simultaneous psfch transmissions in a slot. each psfch of the plurality of psfchs corresponds to a respective pssch of the plurality of psschs.
Inventor(s): Rubayet Shafin of Allen TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Yue Qi of Plano TX (US) for samsung electronics co., ltd., Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd., Elliot Jen of Taipei (TW) for samsung electronics co., ltd.
IPC Code(s): H04W74/0816, H04W52/02, H04W74/08
CPC Code(s): H04W74/0816
Abstract: a first access point (ap) device in a wireless network is provided. the first ap comprises a memory and a processor coupled to the memory. the processor is configured to cause transmitting, to a second ap, a first frame requesting target wake time (twt) based multi-ap coordination, the first frame including a set of twt parameters for the twt based multi-ap coordination. the processor is configured to cause receiving, from the second ap, a second frame indicating acceptance on a partial set of the twt parameters requested from the first ap. the processor is configured to cause establishing the tw based multi-ap coordination with the second ap based on the partial set of twt parameters.
Inventor(s): Anil AGIWAL of Suwon-si (KR) for samsung electronics co., ltd., Hyunjeong KANG of Suwon-si (KR) for samsung electronics co., ltd., Sangbum KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W74/0833, H04W24/10, H04W56/00, H04W72/0446, H04W74/08, H04W76/20
CPC Code(s): H04W74/0841
Abstract: the disclosure relates to a 5g or 6g communication system for supporting a higher data transmission rate. according to an embodiment, the method comprises initiating a small data transmission (sdt) procedure, in a radio resource control (rrc) inactive state, obtaining a report for a log connection failure or an sdt procedure failure, based on an expiry of an sdt timer, wherein the report for the log connection failure includes information indicating that the report is for sdt and in case that the ue enters an rrc connected state, and transmitting the report to a base station, based on a request for the report from the base station.
Inventor(s): Buseop JUNG of Suwon-si (KR) for samsung electronics co., ltd., Junsung KIM of Suwon-si (KR) for samsung electronics co., ltd., Soonho LEE of Suwon-si (KR) for samsung electronics co., ltd., Wonjun JANG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H04W76/14, H04W76/34, H04W84/12
CPC Code(s): H04W76/14
Abstract: an embodiment of the disclosure relates to a device and a method for wireless lan communication in an electronic device. the electronic device includes a communication circuit configured to support a wireless lan communication, at least one processor and a memory storing instructions which cause, when executed by the at least one processor, the electronic device to allow to be configured as a group client for direct communication with an external electronic device configured as a group owner, and in a state in which a first connection for the direct communication with the external electronic device has been established through a first communication protocol of the communication circuit and the external electronic device supports a cross connection, establish a second connection with the external electronic device for communication with an external network through a first ap to which the external electronic device is connected.
Inventor(s): Rubayet Shafin of Allen TX (US) for samsung electronics co., ltd., Boon Loong Ng of Plano TX (US) for samsung electronics co., ltd., Yue Qi of Plano TX (US) for samsung electronics co., ltd., Peshal Nayak of Plano TX (US) for samsung electronics co., ltd., Vishnu Vardhan Ratnam of Plano TX (US) for samsung electronics co., ltd., Elliot Jen of Taipei (TW) for samsung electronics co., ltd.
IPC Code(s): H04W76/15, H04W76/34
CPC Code(s): H04W76/15
Abstract: a first access point (ap) device in a wireless network is provided. the first ap comprises a memory and a processor coupled to the memory. the first ap establishes multi-ap coordination with a second ap, the multi-ap coordination including a set of agreements established between the first ap and the second ap. the first ap transmits a first frame that requests to terminate one or more agreements established between the first ap and the second ap.
Inventor(s): Hyunjoon CHOO of Suwon-si (KR) for samsung electronics co., ltd., Sanguk PARK of Suwon-si (KR) for samsung electronics co., ltd., Jungsu HA of Suwon-si (KR) for samsung electronics co., ltd., Geun KANG of Suwon-si (KR) for samsung electronics co., ltd., Jaeyong KO of Suwon-si (KR) for samsung electronics co., ltd., Youngkun KWON of Suwon-si (KR) for samsung electronics co., ltd., Chulyong JUNG of Suwon-si (KR) for samsung electronics co., ltd., Jonghun HA of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05B6/06, G01K1/16, G01K7/01
CPC Code(s): H05B6/06
Abstract: a sensor device according to an embodiment, mountable on a cooking vessel to measure a temperature of a food item in the cooking vessel heated by a heating device. the sensor device includes a heat transfer portion to receive heat from the heated cooking vessel while the sensor device is mounted to the cooking vessel, a thermoelectric element to generate a current and electrical energy based on the heat transferred from the heat transfer portion, a printed board assembly (pba) to which the current generated by the thermoelectric element is applied, an energy storage portion electrically connected to the pba to store the electrical energy received from the pba, a sensor body on which the pba and the energy storage portion are disposed, a probe mountable on the sensor body, the probe including a temperature sensor to measure the temperature of the food item in the cooking vessel.
Inventor(s): Dohyeong PARK of Suwon-si (KR) for samsung electronics co., ltd., Junghoon PARK of Suwon-si (KR) for samsung electronics co., ltd., Myungkyoon CHUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K1/11, H05K1/14, H05K3/02, H05K3/40
CPC Code(s): H05K1/116
Abstract: an electronic device is provided. the electronic device includes a housing forming an exterior of at least part of the electronic device, a battery disposed to an inner space of the electronic device formed by the housing, and a printed board assembly (pba) disposed between the battery and a side member of the housing in the inner space, the pba including a first printed circuit board (pcb), a second pcb, and an interposer pcb disposed between the first pcb and the second pcb to connect the first pcb and the second pcb, wherein the interposer pcb includes an insulating layer which includes a first face and a second face opposite to the first face, a first via group which penetrates the insulating layer to connect the first face and the second face, and includes a plurality of first vias formed spaced apart from each other, the plurality of first vias included in the first via group being used as a first transmission path through which a first signal passes, a first conductive pad which is disposed on the first face to cover first holes of the plurality of first vias, formed on the first face, and is electrically coupled to the plurality of first vias, and a first solder layer which is disposed on the first conductive pad, wherein the first conductive pad extends by a first width in a first direction along the first face of the insulating layer, and wherein the first solder layer extends by a second width smaller than the first width in the first direction.
Inventor(s): Hyundo SONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/02
CPC Code(s): H05K5/0217
Abstract: an electronic device is provided. the electronic device includes a first housing that includes a first cover, a sliding plate fixed to the first cover, and a body frame configured to slidably support the sliding plate, a second housing surrounding at least a portion of the first cover and connected to the body frame and configured to slidably support the first housing, wherein the first housing and the second housing are configured to switch a state between an extended state and a reduced state, a display that is connected to the sliding plate and transformable, wherein the display comprises a flat portion that maintains a flat shape and a rolling portion of which a shape is transformed, and the rolling portion comprises an exposed area that is visually exposed to an outside and a non-exposed area that is not visually exposed to the outside when the first housing and the second housing are in the extended state, a lattice plate connected to the display, wherein a plurality of holes is formed through the lattice plate, a plurality of first support bars connected to an exposed area of the display, a plurality of second support bars connected to a non-exposed area of the display, a first welded part configured to connect the plurality of first support bars to the lattice plate, and an adhesive layer configured to connect the plurality of second support bars to the lattice plate.
Inventor(s): Ohhee LEE of Suwon-si (KR) for samsung electronics co., ltd., Byounguk YOON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/06, H05K5/02
CPC Code(s): H05K5/061
Abstract: an electronic device including at least one waterproof structure is provided. the electronic device includes a first housing, a decoration part at least partially spaced apart from the first housing, a waterproof structure at least partially disposed between the first housing and the decoration part, a second housing, and a housing bonding member extending along a periphery of the second housing and having a first surface on which the first housing and the decoration part are disposed and a second surface on which the second housing is disposed, wherein the waterproof structure includes a plate extending to correspond to at least a part of a periphery of the first housing, the plate including a protruding area and a flat surface area, the protruding area being disposed in a space defined between the first housing and the decoration part, the flat surface area extending to a first side and a second side of the protruding area, and a waterproof member disposed along the protruding area and configured to seal at least a part of the space defined between the first housing and the decoration part.
Inventor(s): Sunggun CHO of Gyeonggi-do (KR) for samsung electronics co., ltd.
IPC Code(s): H05K5/06, H04M1/02, H05K5/00, H05K5/02, H05K5/03
CPC Code(s): H05K5/062
Abstract: according to certain embodiments, an electronic device may include a first housing, a second housing including at least one through-hole and connected to the first housing through a hinge device, a display panel disposed to be supported by the first housing and the second housing, a bending part extending outward from the display panel and including a control circuit, a cover member disposed on at least a portion of the bending part so as to cover at least a part of the control circuit and including a conductive layer, a first waterproof member disposed between the display panel and the first housing so as to surround at least a portion of the bending part, a second waterproof member disposed between the bending part and the first housing, and a third waterproof member filled through the through-hole such that the first waterproof member is connected to the second waterproof member, wherein the cover member includes an exposed part in which at least a part of the conductive layer is exposed, and the exposed part is disposed to at least partially overlap the through-hole.
Inventor(s): Casey Glenn Thielen of Chandler AZ (US) for samsung electronics co., ltd., Eric Richard Borch of Fort Collins CO (US) for samsung electronics co., ltd.
IPC Code(s): H05K7/02
CPC Code(s): H05K7/026
Abstract: a computer supernode including two or more printed circuit boards that each include two or more compute nodes, two or more switches, and two or more connectors. the compute nodes are connected to each switch, and the switches are connected to each connector by a number of lanes. the computer supernode also includes two or more h-cables connecting the printed circuit boards together in an all-to-all configuration. each h-cable connects a connector of a printed circuit board to a connector in each of two or more other printed circuit boards.
20250056789. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dae-Jin Nam of Suwon-si (KR) for samsung electronics co., ltd., Sung-Hwan Jang of Suwon-si (KR) for samsung electronics co., ltd., Won Hee Choi of Suwon-si (KR) for samsung electronics co., ltd., Sung Uk Jang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/30
Abstract: the present disclosure relates to semiconductor memory devices. an example semiconductor memory device comprises a substrate, a structure including word lines and interlayer insulating films alternately stacked on the substrate, a channel region disposed between two adjacent word lines in a vertical direction, a first source/drain region disposed on a first side of the channel region, a second source/drain region disposed on a second side of the channel region, a bit line which extends in the vertical direction on the substrate and is connected to the first source/drain region, a capping insulating film disposed between the bit line and the word lines, and a data storage connected to the second source/drain region. at least a part of the first source/drain region protrudes from a sidewall of the capping insulating film toward the bit line.
20250056792. SEMICONDUCTOR MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Ju Ho Lee of Suwon-si (KR) for samsung electronics co., ltd., Yu Yeol Lee of Suwon-si (KR) for samsung electronics co., ltd., Seung Hyun Kim of Suwon-si (KR) for samsung electronics co., ltd., Seong Jae Byeon of Suwon-si (KR) for samsung electronics co., ltd., Sung Duk Hong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00
CPC Code(s): H10B12/315
Abstract: a semiconductor memory device is provided that includes a bit line on a substrate, a protruded insulating pattern on the bit line, and in a channel trench, first and second channel patterns that extend along sidewalls of the channel trench, and spaced apart from the first channel pattern in the first direction, a channel interfacial layer that extends along the sidewalls of the channel trench, and is in contact with the first channel pattern and the second channel pattern, a first word line between the first channel pattern and the second channel pattern, a second word line between the first channel pattern and the second channel pattern, and is spaced apart from the first word line in the first direction and a first capacitor and a second capacitor, which are electrically connected to the first channel pattern and the second channel pattern.
20250056794. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Dongkyun Lim of Suwon-si (KR) for samsung electronics co., ltd., Soobin Kim of Suwon-si (KR) for samsung electronics co., ltd., Seungyoung Seo of Suwon-si (KR) for samsung electronics co., ltd., Sunwoo Heo of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B12/00, H01L23/522, H01L23/528
CPC Code(s): H10B12/50
Abstract: a semiconductor device includes a substrate including a cell region and a peripheral circuit region, a peripheral circuit gate line on the peripheral circuit region of the substrate, an interlayer insulating layer surrounding the peripheral circuit gate line, a contact plug passing through the interlayer insulating layer to be connected to the substrate, a wiring pad on the contact plug, and a metal via being in contact with the wiring pad, wherein a first sidewall and a second sidewall of the contact plug form acute angles with an upper surface of the contact plug, and a first sidewall and a second sidewall of the wiring pad form acute angles with a lower surface of the wiring pad.
20250056795. MEMORY DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Changyoung Lee of Suwon-si (KR) for samsung electronics co., ltd., Hyun-Chul Yoon of Suwon-si (KR) for samsung electronics co., ltd., Yeongwoo Kang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B20/00, G11C29/04, H10B12/00, H10B20/25
CPC Code(s): H10B20/60
Abstract: the present disclosure relates to memory devices. an example memory device includes a memory cell region including a memory cell array is configured to store data, and an antifuse cell array including a plurality of antifuse bit lines, a plurality of antifuse word lines, and a plurality of program transistors that is electrically coupled to a first antifuse bit line among the plurality of antifuse bit lines and that are coupled in parallel with one another. the memory device includes a peripheral circuit region including an antifuse sense amplifier is configured to output one-time programmable (otp) data stored in the plurality of program transistors.
Inventor(s): Kumhyo Kang of Suwon-si (KR) for samsung electronics co., ltd., Hongsoo Kim of Suwon-si (KR) for samsung electronics co., ltd., Jeon Il Lee of Suwon-si (KR) for samsung electronics co., ltd., Hyun-Mook Choi of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H10B41/27, H10B41/41, H10B43/40
CPC Code(s): H10B43/27
Abstract: a semiconductor memory device, and a semiconductor package and an electronic system including the same are provided. the semiconductor memory device includes a substrate including a plurality of mat regions and a mat separation region between ones of the mat regions, a peripheral circuit structure on the substrate and including peripheral circuits, a cell array structure on the peripheral circuit structure, a first through-via extending into the substrate in the mat separation region, and a second through-via extending into the cell array structure on the mat separation region and electrically connected to the first through-via, wherein the second through-via overlaps the first through-via.
Inventor(s): Kanamori Kohji of Seongnam-si (KR) for samsung electronics co., ltd., Jeehoon Han of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/27, H01L23/528, H10B41/10, H10B41/27, H10B41/35, H10B41/48, H10B43/10, H10B43/35, H10B43/40
CPC Code(s): H10B43/27
Abstract: disclosed are three-dimensional semiconductor memory devices, methods of manufacturing the same, and electronic systems including the same. the device includes a peripheral circuit structure on a substrate, and a cell array structure including a stack structure that includes gate electrodes on the peripheral circuit structure, a first source conductive pattern on the stack structure, and vertical channel structures in vertical channel holes that penetrate the stack structure and the first source conductive pattern. the vertical channel structure includes a data storage pattern on a sidewall of the vertical channel hole, a vertical semiconductor pattern on the data storage pattern, and a second source conductive pattern on the vertical semiconductor pattern and surrounded by the data storage pattern. a thickness of the data storage pattern between the first source conductive pattern and the second source conductive pattern is greater than it is between the stack structure and the vertical semiconductor pattern.
Inventor(s): Junhyoung KIM of Suwon-si (KR) for samsung electronics co., ltd., Bumkyu KANG of Suwon-si (KR) for samsung electronics co., ltd., Junyong PARK of Suwon-si (KR) for samsung electronics co., ltd., Sukkang SUNG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/40, H01L23/522, H01L23/528, H01L25/065, H10B41/10, H10B41/27, H10B41/35, H10B41/40, H10B43/10, H10B43/27, H10B43/35, H10B80/00
CPC Code(s): H10B43/40
Abstract: a semiconductor device and a data storage system are provided. the semiconductor device includes a peripheral circuit structure; a stack structure vertically overlapping the peripheral circuit structure; and a separation structure penetrating through the stack structure. the stack structure includes a plurality of blocks spaced apart from each other by a first portion of the separation structure, each of the plurality of blocks includes insulating layers and conductive layers alternately stacked in a vertical direction, and the plurality of blocks include first blocks and a plurality of capacitor blocks disposed between first blocks adjacent to each other among the first blocks.
20250056807. SEMICONDUCTOR DEVICES_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Juseong Min of Suwon-si (KR) for samsung electronics co., ltd., Jaebok Baek of Suwon-si (KR) for samsung electronics co., ltd., Taekkyu Yoon of Suwon-si (KR) for samsung electronics co., ltd., Jeehoon Han of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/40, H10B41/27, H10B41/41, H10B43/27
CPC Code(s): H10B43/40
Abstract: a semiconductor device includes a substrate, active regions extending on the substrate in a first direction, the active regions spaced apart from each other in a second direction perpendicular to the first direction, and arranged in a third direction oblique to the first direction and second direction, and gate electrodes disposed on the active regions and including a first edge extending in the second direction, a second edge extending in the first direction, and a corner region defined by the first edge and the second edge, wherein the corner region includes a protrusion having a width narrowing in a direction away from a center of each of the gate electrodes in plan view.
Inventor(s): Giyong CHUNG of Seoul (KR) for samsung electronics co., ltd., Jaeryong SIM of Suwon-si (KR) for samsung electronics co., ltd., Kwangyoung JUNG of Hwaseong-si (KR) for samsung electronics co., ltd., Jeehoon HAN of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B43/50, H01L23/535, H10B41/27, H10B41/41, H10B41/50, H10B43/27, H10B43/40
CPC Code(s): H10B43/50
Abstract: a semiconductor device includes a memory cell region. the memory cell region includes a memory stack structure including a first stack structure and a second stack structure; a plurality of channel structures vertically penetrating through the memory stack structure and connected to the second substrate; at least one first dummy structure; and at least one second dummy structure. at least a portion of the first dummy structure does not overlap the second dummy structure in a vertical direction.
Inventor(s): Jeonil Lee of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B53/30
CPC Code(s): H10B53/30
Abstract: a memory device includes a substrate, a plurality of bit lines on the substrate and extending in a first horizontal direction and separated from each other in a second horizontal direction that intersects the first horizontal direction, a plurality of channel layers extending in a vertical direction that is perpendicular to an upper surface of the substrate on the plurality of bit lines, a plurality of word lines on one of the bit lines in the vertical direction and extending in the second horizontal direction and separated from each other in the first horizontal direction, an interlayer insulating layer between the plurality of channel layers, and a gate insulating layer between one of the channel layers and one of the word lines and on an upper surface of the interlayer insulating layer opposite the substrate.
Inventor(s): Seulji Song of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B63/10, G06N3/063, G11C11/418, G11C11/419, G11C13/00, H01L23/498, H01L23/528, H01L23/532, H01L27/02, H10B10/00, H10B80/00
CPC Code(s): H10B63/10
Abstract: a semiconductor chip includes a logic core layer that receives input data from an external host and calculates an inference value based on the input data, a redistribution wiring layer provided on the logic core layer, wherein the redistribution wiring layer includes a plurality of redistribution wirings, which transmit the input data, and an insulating layer, which covers the plurality of redistribution wirings, and a weight storage layer provided on the redistribution wiring layer, wherein the weight storage layer includes a plurality of memory cells, each of which store weights for calculating the inference value through amorphous materials, wherein the weights are transmitted to the logic core layer through the plurality of redistribution wirings according to the input data.
Inventor(s): Seulji Song of Suwon-si (KR) for samsung electronics co., ltd., Hodae Kim of Suwon-si (KR) for samsung electronics co., ltd., Woojun Jeong of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10B63/00, H10N70/00
CPC Code(s): H10B63/24
Abstract: a memory device includes a first conductive line, a second conductive line, and a memory cell disposed between the first and second conductive lines. the memory cell includes a lower electrode layer, a switching pattern, and an upper electrode layer. the switching pattern includes a main region including a pair of first side walls and a pair of second walls, and a corner region at four corners of the main region. the switching pattern includes a chalcogenide layer including a group vi chalcogen element, an element of group iv and an element of group v, and the concentration of the group iv element in the corner region is greater than that of the group iv element in the main region, or the concentration of the group v element in the corner region is greater than that of the group v element in the main region.
Inventor(s): Jaejoon OH of Seongnam-si (KR) for samsung electronics co., ltd., Jongseob KIM of Seoul (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/778, H01L21/285, H01L29/20, H01L29/205, H01L29/423, H01L29/66
CPC Code(s): H01L29/7786
Abstract: a high electron mobility transistor and a method of manufacturing the same are disclosed. the high electron mobility transistor includes a channel layer, a channel supplying layer causing generation of a two-dimensional electron gas (2deg) in the channel layer, a source electrode and a drain electrode provided on respective sides of the channel supplying layer, a depletion forming layer provided on the channel supplying layer to form a depletion region in the 2deg, a gate electrode provided on a portion of the depletion forming layer, and a current limiting layer provided to contact the gate electrode on another portion of the depletion forming layer. the current limiting layer limits a current flow from the gate electrode to the depletion forming layer according to a voltage applied to the gate electrode.
Inventor(s): Seo Woo Nam of Suwon-si (KR) for samsung electronics co., ltd., Heon Jong Shin of Suwon-si (KR) for samsung electronics co., ltd., Jae Ran Jang of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/417, H01L23/522, H01L23/528, H01L29/06, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H01L29/41733
Abstract: a semiconductor device comprises a back insulating pattern comprising a first region, and a second region and extending in a first direction, a plurality of sheet patterns disposed on the back insulating pattern, and extending in the first direction, a first source/drain pattern disposed on the first region of the back insulating pattern, and connected to the plurality of sheet patterns, a second source/drain pattern disposed on the second region of the back insulating pattern, and connected to the plurality of sheet patterns, a gate electrode extending in a second direction crossing the first direction, and surrounding the plurality of sheet patterns, a first back source/drain contact that extends into the first region of the back insulating pattern, and connected to the first source/drain pattern and a second back source/drain contact that extends into the second region of the back insulating pattern, and connected to the second source/drain pattern.
Inventor(s): Jong Min SHIN of Suwon-si (KR) for samsung electronics co., ltd., Heon Jong SHIN of Suwon-si (KR) for samsung electronics co., ltd., June Young PARK of Suwon-si (KR) for samsung electronics co., ltd., Jae Ran JANG of Suwon-si (KR) for samsung electronics co., ltd., Sang Hee LEE of Suwon-si (KR) for samsung electronics co., ltd., Kerm RIM of Suwon-si (KR) for samsung electronics co., ltd., Sung Gyu HAN of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/786, H01L21/8234, H01L23/48, H01L23/528, H01L27/088, H01L29/06, H01L29/08, H01L29/423, H01L29/66, H01L29/775
CPC Code(s): H01L29/78696
Abstract: a semiconductor device includes: a lower interlayer insulating layer; first and second active patterns on the lower interlayer insulating layer; a gate electrode on the first and second active patterns; a first source region on a first side of the gate electrode; a second source region on a second side of the gate electrode; a third source region on the first side of the gate electrode; a drain region on the second side of the gate electrode; a first contact adjacent to the gate electrode, and connected to the first and third source regions; a second contact adjacent to the gate electrode, and connected to the second source region; a third contact adjacent to the gate electrode, and connected to the drain region; a lower wiring layer inside the lower interlayer insulating layer; and a through via connecting the lower wiring layer with the first contact.
Inventor(s): Hyunjae LEE of Suwon-si (KR) for samsung electronics co., ltd., Seunggeol NAM of Suwon-si (KR) for samsung electronics co., ltd., Sijung YOO of Suwon-si (KR) for samsung electronics co., ltd., Dukhyun CHOE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/78, H01L21/28, H01L29/51, H10B51/30
CPC Code(s): H01L29/78391
Abstract: provided is a ferroelectric field effect transistor including a source region, a drain region, a channel provided between the source region and the drain region, a ferroelectric layer provided on the channel and including a ferroelectric material including an oxide of a first element, a gate-interposed layer provided on the ferroelectric layer and including a paraelectric material including an oxide of a second element different from the first element, and a gate electrode provided on the gate-interposed layer, wherein the gate-interposed layer includes a first interposed layer adjacent to the ferroelectric layer, and a second interposed layer adjacent to the gate electrode, the first interposed layer includes a mixture of the first element and the second element, and a ratio of the first element in the first interposed layer may be greater than a ratio of the first element in the ferroelectric layer.
20250056861. SEMICONDUCTOR DEVICE_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): SOOJIN JEONG of Suwon-si (KR) for samsung electronics co., ltd., MYUNG GIL KANG of Suwon-si (KR) for samsung electronics co., ltd., DONGWON KIM of Suwon-si (KR) for samsung electronics co., ltd., BEOMJIN PARK of Suwon-si (KR) for samsung electronics co., ltd., DONGSUK SHIN of Suwon-si (KR) for samsung electronics co., ltd., HYUN-KWAN YU of Suwon-si (KR) for samsung electronics co., ltd., WOOSUK CHOI of Suwon-si (KR) for samsung electronics co., ltd., SEUNGPYO HONG of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L29/66, H01L21/8238, H01L23/528, H01L27/092, H01L29/06, H01L29/08, H01L29/423, H01L29/775, H01L29/786
CPC Code(s): H01L29/66553
Abstract: a semiconductor device includes a substrate including an active pattern, a channel pattern on the active pattern, the channel pattern including a plurality of semiconductor patterns that are spaced apart from each other, a source/drain pattern electrically connected to the plurality of semiconductor patterns, an inner gate electrode between adjacent first and second semiconductor patterns of the plurality of semiconductor patterns, an inner gate insulating layer between the inner gate electrode and the first and second semiconductor patterns, an inner high-k dielectric layer between the inner gate electrode and the inner gate insulating layer, and an inner spacer between the inner gate insulating layer and the source/drain pattern. as the inner gate insulating layer includes an inner gate spacer, the inner gate electrode may stably fill the inner gate space. as a result, the electrical characteristics of the semiconductor device may be improved.
Inventor(s): Seunghyun SONG of Albany NY (US) for samsung electronics co., ltd., Seungyoung Lee of Albany NY (US) for samsung electronics co., ltd., Saehan Park of Albany NY (US) for samsung electronics co., ltd.
IPC Code(s): H01L27/092, H01L21/822, H01L21/8238, H01L27/06, H01L29/423, H10B10/00
CPC Code(s): H01L27/092
Abstract: a semiconductor device and a method of manufacturing the same are provided. the semiconductor device includes a cross-coupled gate circuit in a three-dimensional (3d) stack including a plurality of transistors, a first gate line of a first transistor among the plurality of transistors connected to a fourth gate line of a fourth transistor among the plurality of transistors, a second gate line of a second transistor among the plurality of transistors connected to a third gate line of a third transistor among the plurality of transistors, a first conductor connecting the first gate line and the fourth gate line, a second conductor connecting the second gate line and the third gate line. the first gate line and the second gate line are arranged above the third gate line and the fourth gate line, respectively.
Inventor(s): Duckseoung KANG of Suwon-si (KR) for samsung electronics co., ltd., Sangdeok KWON of Suwon-si (KR) for samsung electronics co., ltd., Gibum KIM of Suwon-si (KR) for samsung electronics co., ltd., Seungjae LEE of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/02, H01L27/06, H01L29/06, H01L29/78, H01L29/861
CPC Code(s): H01L27/0255
Abstract: an integrated circuit device includes: a substrate including a first surface and a second surface that is opposite to the first surface; and a diode structure including: an upper semiconductor layer disposed on the first surface of the substrate and including a first dopant of a first conductivity type; a lower semiconductor layer disposed on the second surface of the substrate and including a second dopant of a second conductivity type that is different from the first conductivity type; and a first well region provided in a portion of the substrate that is between the upper semiconductor layer and the lower semiconductor layer, wherein the first well region is in contact with the upper semiconductor layer or the lower semiconductor layer.
20250056909. IMAGE SENSORS_simplified_abstract_(samsung electronics co., ltd.)
Inventor(s): Bomi Kim of Yeongju-si (KR) for samsung electronics co., ltd., BumSuk Kim of Hwaseong-si (KR) for samsung electronics co., ltd., Jung-Saeng Kim of Seoul (KR) for samsung electronics co., ltd., Yun Ki Lee of Hwaseong-si (KR) for samsung electronics co., ltd., Taesub Jung of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L27/146, H04N25/40
CPC Code(s): H01L27/14621
Abstract: image sensors are provided. the image sensors may include a plurality of unit pixels and a color filter array on the plurality of unit pixels. the color filter array may include a color filter unit including four color filters that are arranged in a two-by-two array, and the color filter unit may include two yellow color filters, a cyan color filter, and one of a red color filter or a green color filter.
Inventor(s): Junhee CHOI of Suwon-si (KR) for samsung electronics co., ltd., Joosung KIM of Suwon-si (KR) for samsung electronics co., ltd., Dongchul SHIN of Suwon-si (KR) for samsung electronics co., ltd., Junghun PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H01L33/20, H01L27/15, H01L33/00, H01L33/06, H01L33/14, H01L33/32
CPC Code(s): H01L33/20
Abstract: provided is a nanorod light-emitting device including a support layer, a first-type semiconductor nanocore protruding from an upper surface of the support layer and including a semiconductor material doped as a first conductivity type, a mask layer on an upper surface of the support layer and extending to a first height of the first-type semiconductor nanocore in a vertical direction and adjacent to a surface of the first-type semiconductor nanocore, a light-emitting layer having a multi-quantum well structure adjacent to a portion of the first-type semiconductor nanocore above the first height in the vertical direction, and a second-type semiconductor layer adjacent to a surface of the light-emitting layer and including a semiconductor material doped as a second conductivity type.
Inventor(s): Joungmin CHO of Suwon-si (KR) for samsung electronics co., ltd., Kwangtai KIM of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K59/80, G02B5/30, G06F3/01, H04N23/90, H10K59/122
CPC Code(s): H10K59/8791
Abstract: a wearable device is provided. the wearable device includes a display panel which includes a plurality of light-emitting devices, a substrate on which the plurality of light-emitting devices is disposed, a pixel define layer (pdl) bank surrounding and partitioning each of the plurality of light-emitting devices to define a plurality of subpixel areas, and a cholesteric liquid crystal (clc) film disposed on the substrate and configured to convert light output from the plurality of light-emitting devices into circularly polarized light, wherein each of the plurality of light-emitting devices include an organic film layer, an upper electrode disposed on the organic film layer and the pdl bank, and a lower electrode disposed under the organic film layer and the pdl bank, and wherein the pdl bank includes a first surface perpendicular to the substrate, surrounding a portion of an outer peripheral surface of each of the plurality of light-emitting devices, and a second surface facing the clc film and parallel to the substrate.
Inventor(s): Seungjae LEE of Suwon-si (KR) for samsung electronics co., ltd., Byungku KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngkwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Changwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyungsun KIM of Suwon-si (KR) for samsung electronics co., ltd., Changju SHIN of Suwon-si (KR) for samsung electronics co., ltd., Eunsun YU of Suwon-si (KR) for samsung electronics co., ltd., Byoungki CHOI of Hwaseong-si (KR) for samsung electronics co., ltd., Kyuyoung HWANG of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/60, C07D405/14, C07D491/048, C09K11/06, H10K50/11, H10K50/15, H10K50/16, H10K50/17, H10K50/18, H10K85/30, H10K101/10
CPC Code(s): H10K85/6572
Abstract: a condensed-cyclic compound represented by formula 1a:
Inventor(s): Seungjae LEE of Suwon-si (KR) for samsung electronics co., ltd., Byungku KIM of Suwon-si (KR) for samsung electronics co., ltd., Youngkwon KIM of Suwon-si (KR) for samsung electronics co., ltd., Changwoo KIM of Suwon-si (KR) for samsung electronics co., ltd., Hyungsun KIM of Suwon-si (KR) for samsung electronics co., ltd., Changju SHIN of Suwon-si (KR) for samsung electronics co., ltd., Eunsun YU of Suwon-si (KR) for samsung electronics co., ltd., Byoungki CHOI of Hwaseong-si (KR) for samsung electronics co., ltd., Kyuyoung HWANG of Hwaseong-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10K85/60, C07D405/14, C07D491/048, C09K11/06, H10K50/11, H10K50/15, H10K50/16, H10K50/17, H10K50/18, H10K85/30, H10K101/10
CPC Code(s): H10K85/6572
Abstract:
Inventor(s): Jiho PARK of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10N50/10, H10B61/00, H10N50/80, H10N50/85
CPC Code(s): H10N50/10
Abstract: a semiconductor device includes a conductive pattern extending in a first direction, a magnetic tunnel junction pattern on the conductive pattern, and a capacitor on the magnetic tunnel junction pattern. the magnetic tunnel junction pattern is between the conductive pattern and the capacitor, and the magnetic tunnel junction pattern connects to the capacitor, and the conductive pattern is configured to apply spin-orbit torque to the magnetic tunnel junction pattern.
Inventor(s): Dae Yun KIM of Suwon-si (KR) for samsung electronics co., ltd., In Su JEON of Suwon-si (KR) for samsung electronics co., ltd., Hyeok Shin KWON of Suwon-si (KR) for samsung electronics co., ltd.
IPC Code(s): H10N60/80, G06N10/40, H10N60/12, H10N60/82
CPC Code(s): H10N60/805
Abstract: a superconducting device includes a frequency tunable device comprising a first conductive pad and a second conductive pad that are connected to each other by a josephson junction, a ferromagnetic structure disposed at a predetermined distance apart from the first and second conductive pads, a control line located below the ferromagnetic structure, and a control circuit configured to control a resonant frequency of the frequency tunable device by controlling current flowing through the control line.
Samsung Electronics Co., Ltd. patent applications on February 13th, 2025
- Samsung Electronics Co., Ltd.
- A47B97/00
- CPC A47B97/001
- Samsung electronics co., ltd.
- A61B5/01
- A61B5/00
- CPC A61B5/01
- B65D6/00
- B65D25/10
- B65D43/16
- B65D65/40
- B65D65/46
- CPC B65D13/04
- C07F5/02
- C07D487/04
- C09K11/06
- H10K85/30
- H10K85/60
- CPC C07F5/027
- C09K11/62
- B82Y20/00
- B82Y40/00
- C01G9/08
- C01G15/00
- C09K11/54
- H01L33/50
- H10K59/38
- CPC C09K11/621
- C09K11/02
- G02F1/13357
- CPC C09K11/623
- C09K11/58
- H01L33/16
- H01L33/26
- C12N9/06
- B82Y30/00
- C01B32/914
- C01G39/00
- CPC C12N9/0046
- C25D11/02
- H05K5/04
- CPC C25D11/02
- D06F39/02
- B67D3/00
- D06F39/08
- D06F39/12
- CPC D06F39/028
- F25D23/06
- CPC F25D23/063
- F25D29/00
- F25D23/02
- CPC F25D29/00
- F25D23/12
- G05D9/12
- CPC F25D29/005
- G01B9/02015
- G01B9/02001
- G01B11/27
- G02B27/28
- CPC G01B9/02016
- G01C21/14
- G01P13/00
- G06T7/277
- CPC G01C21/14
- G01N21/21
- G01N21/95
- G01N21/956
- CPC G01N21/211
- G01J3/02
- G01J3/06
- G01J3/45
- H01L21/66
- CPC G01N21/95607
- G01S7/534
- G01S15/32
- CPC G01S7/534
- G06F1/16
- CPC G06F1/1616
- G06F3/047
- CPC G06F1/1618
- CPC G06F1/1641
- G01P15/08
- G01P15/18
- CPC G06F1/1681
- G06F1/20
- H05K7/20
- CPC G06F1/20
- G06F3/01
- G06F3/041
- G08B6/00
- CPC G06F3/016
- G06F3/0488
- CPC G06F3/04166
- G06F3/04847
- G06F3/0482
- G06F3/04842
- G06F3/16
- H03M11/10
- H04N21/422
- CPC G06F3/04847
- G06F3/06
- CPC G06F3/0613
- CPC G06F3/0614
- G06F11/10
- CPC G06F3/0619
- CPC G06F3/0638
- CPC G06F3/0659
- G06F11/07
- CPC G06F11/0757
- G06F11/16
- G06F11/20
- CPC G06F11/1662
- G06F12/0817
- G06F12/0831
- CPC G06F12/0817
- G06F30/333
- CPC G06F30/333
- G06N3/0455
- CPC G06N3/0455
- G06N3/0464
- CPC G06N3/0464
- G06N3/063
- CPC G06N3/063
- G06N3/082
- G06N3/04
- CPC G06N3/082
- G06N10/60
- G06N10/40
- CPC G06N10/60
- G06N20/00
- CPC G06N20/00
- G06T3/40
- G06T3/18
- G06T5/50
- G06T7/20
- G06T15/00
- CPC G06T3/40
- G06T5/60
- G06T3/4046
- CPC G06T5/60
- G06T5/00
- G06T7/10
- G06V10/24
- CPC G06T5/80
- G06T19/00
- G02B27/00
- G02B27/01
- CPC G06T19/006
- G09G3/20
- CPC G09G3/2096
- G09G5/00
- G06F3/14
- H04L67/104
- CPC G09G5/003
- CPC G09G5/006
- G10K11/178
- G10L21/0216
- G10L21/0224
- H04R1/08
- CPC G10K11/17823
- G11C11/22
- CPC G11C11/2275
- G11C29/42
- G11C7/10
- G11C17/16
- G11C29/12
- G11C29/20
- CPC G11C29/42
- G11C29/52
- G11C7/22
- CPC G11C29/52
- H01H13/06
- H01H13/14
- H04M1/23
- CPC H01H13/06
- H01J37/32
- CPC H01J37/32449
- CPC H01J37/32642
- H01L21/48
- C23C18/16
- C23C18/31
- C23C18/48
- C23C28/02
- C25D5/00
- C25D5/02
- C25D7/12
- G03F7/16
- G03F7/30
- H01L23/00
- H01L23/498
- H01L25/065
- H01L25/10
- H10B80/00
- CPC H01L21/4857
- G03F7/00
- H01L21/56
- H01L21/78
- H01L21/306
- H01L21/67
- H01L33/00
- H01L33/22
- CPC H01L21/7813
- H01L23/14
- H01L23/528
- CPC H01L23/147
- H01L23/31
- H01L23/64
- H01L25/18
- CPC H01L23/3121
- H01L23/538
- CPC H01L23/49811
- CPC H01L23/49827
- H01L23/48
- CPC H01L23/49833
- H01L23/532
- CPC H01L23/5329
- H01L21/768
- H01L23/522
- CPC H01L23/5386
- CPC H01L23/562
- CPC H01L24/08
- CPC H01L24/29
- CPC H01L25/0657
- H01L25/00
- H01L23/367
- H01L23/42
- H02J50/00
- H02J50/10
- CPC H02J50/005
- H03H11/28
- H02M7/217
- CPC H03H11/28
- H03K19/00
- H04L25/03
- CPC H03K19/0005
- H03M1/46
- H03M1/12
- H03M1/30
- CPC H03M1/462
- H03M3/00
- CPC H03M3/458
- H04B1/00
- H03F3/24
- CPC H04B1/0064
- H04B7/06
- H04L25/02
- H04W24/02
- CPC H04B7/0626
- H04W72/25
- H04B17/318
- H04L1/1607
- CPC H04B7/06952
- CPC H04B17/328
- H04L1/1812
- H04L1/1829
- H04W76/28
- CPC H04L1/1812
- H04L5/00
- H04W92/18
- CPC H04L5/0026
- CPC H04L5/0051
- H04W72/0446
- H04L5/14
- H04W72/0453
- H04W72/1268
- H04W72/1273
- H04W72/231
- H04W76/20
- CPC H04L5/14
- H04L41/0233
- H04B7/185
- CPC H04L41/0233
- H04L67/141
- H04L67/146
- H04W76/10
- CPC H04L67/141
- H04M1/02
- CPC H04M1/0243
- H04M1/72403
- H04M1/72454
- CPC H04M1/72403
- H04N19/122
- H04N19/136
- H04N19/157
- H04N19/159
- H04N19/176
- CPC H04N19/122
- H04N19/42
- H04N19/105
- H04N19/124
- H04N19/13
- H04N19/139
- H04N19/31
- H04N19/61
- H04N19/80
- H04N19/85
- CPC H04N19/42
- H04N19/513
- H04N19/109
- H04N19/70
- H04N19/91
- CPC H04N19/513
- H04N23/90
- G06T7/246
- G06V10/40
- G06V10/70
- G06V20/50
- H04N23/50
- H04N23/62
- H04N23/68
- CPC H04N23/90
- H04R3/12
- H04R1/10
- CPC H04R3/12
- H04S7/00
- CPC H04S7/301
- H04W4/021
- H04W84/12
- CPC H04W4/021
- H04W4/10
- H04W4/08
- CPC H04W4/10
- H04W8/22
- H04W16/28
- H04W36/08
- H04W36/24
- H04W64/00
- CPC H04W24/02
- H04W72/20
- H04W72/51
- H04W28/02
- CPC H04W28/0236
- H04W88/04
- CPC H04W28/0268
- H04W28/04
- H04L1/00
- H04W28/24
- CPC H04W28/04
- H04W28/06
- H04W68/02
- H04W76/30
- CPC H04W28/06
- H04W36/00
- H04W36/30
- CPC H04W36/0058
- H04W36/26
- CPC H04W36/26
- H04W36/32
- CPC H04W36/30
- H04W48/16
- H04W12/06
- H04W24/10
- CPC H04W48/16
- H04W48/18
- H04M15/00
- CPC H04W48/18
- H04W8/20
- H04W60/04
- H04W84/04
- H04W52/28
- CPC H04W52/28
- H04W24/08
- H04W52/02
- CPC H04W68/02
- H04W56/00
- CPC H04W72/0446
- CPC H04W72/1268
- H04B7/0413
- H04W72/232
- CPC H04W72/1273
- H04L5/16
- CPC H04W72/232
- H04W72/40
- H04W72/563
- CPC H04W72/40
- H04W74/0816
- H04W74/08
- CPC H04W74/0816
- H04W74/0833
- CPC H04W74/0841
- H04W76/14
- H04W76/34
- CPC H04W76/14
- H04W76/15
- CPC H04W76/15
- H05B6/06
- G01K1/16
- G01K7/01
- CPC H05B6/06
- H05K1/11
- H05K1/14
- H05K3/02
- H05K3/40
- CPC H05K1/116
- H05K5/02
- CPC H05K5/0217
- H05K5/06
- CPC H05K5/061
- H05K5/00
- H05K5/03
- CPC H05K5/062
- H05K7/02
- CPC H05K7/026
- H10B12/00
- CPC H10B12/30
- CPC H10B12/315
- CPC H10B12/50
- H10B20/00
- G11C29/04
- H10B20/25
- CPC H10B20/60
- H10B43/27
- H10B41/27
- H10B41/41
- H10B43/40
- CPC H10B43/27
- H10B41/10
- H10B41/35
- H10B41/48
- H10B43/10
- H10B43/35
- H10B41/40
- CPC H10B43/40
- H10B43/50
- H01L23/535
- H10B41/50
- CPC H10B43/50
- H10B53/30
- CPC H10B53/30
- H10B63/10
- G11C11/418
- G11C11/419
- G11C13/00
- H01L27/02
- H10B10/00
- CPC H10B63/10
- H10B63/00
- H10N70/00
- CPC H10B63/24
- H01L29/778
- H01L21/285
- H01L29/20
- H01L29/205
- H01L29/423
- H01L29/66
- CPC H01L29/7786
- H01L29/417
- H01L29/06
- H01L29/775
- H01L29/786
- CPC H01L29/41733
- H01L21/8234
- H01L27/088
- H01L29/08
- CPC H01L29/78696
- H01L29/78
- H01L21/28
- H01L29/51
- H10B51/30
- CPC H01L29/78391
- H01L21/8238
- H01L27/092
- CPC H01L29/66553
- H01L21/822
- H01L27/06
- CPC H01L27/092
- H01L29/861
- CPC H01L27/0255
- H01L27/146
- H04N25/40
- CPC H01L27/14621
- H01L33/20
- H01L27/15
- H01L33/06
- H01L33/14
- H01L33/32
- CPC H01L33/20
- H10K59/80
- G02B5/30
- H10K59/122
- CPC H10K59/8791
- C07D405/14
- C07D491/048
- H10K50/11
- H10K50/15
- H10K50/16
- H10K50/17
- H10K50/18
- H10K101/10
- CPC H10K85/6572
- H10N50/10
- H10B61/00
- H10N50/80
- H10N50/85
- CPC H10N50/10
- H10N60/80
- H10N60/12
- H10N60/82
- CPC H10N60/805