MEDIATEK INC. patent applications on April 3rd, 2025
Patent Applications by MEDIATEK INC. on April 3rd, 2025
MEDIATEK INC.: 15 patent applications
MEDIATEK INC. has applied for patents in the areas of H01L23/00 (3), H04W76/20 (2), H04W16/28 (2), H04W74/0833 (2), H01L25/18 (2) H04W16/28 (2), G05F1/468 (1), G06F3/0656 (1), G06N3/063 (1), H01L23/3672 (1)
With keywords such as: signal, network, apparatus, information, according, processing, image, node, computing, and unit in patent application abstracts.
Patent Applications by MEDIATEK INC.
Inventor(s): Chih-Chien Huang of Hsinchu City TW for mediatek inc., Chuan-Chang Lee of Hsinchu City TW for mediatek inc.
IPC Code(s): G05F1/46, G06F1/3296
CPC Code(s): G05F1/468
Abstract: the present invention provides a circuitry including a regulator and a control circuit is disclosed. the regulator is configured to receive an input signal to generate an output voltage. the control circuit is configured to select one of a first reference voltage and a second reference voltage to serve as an output reference voltage according to an output signal of the regulator, and generate a control signal according to the output reference voltage to control a voltage level of the output voltage of the regulator.
Inventor(s): Po-Yuan JENG of Hsinchu City TW for mediatek inc., Hung-Chun LIU of Hsinchu City TW for mediatek inc., Yu-Chieh LIN of Hsinchu City TW for mediatek inc., Chien-Han SU of Hsinchu City TW for mediatek inc., Yung-Chih CHIU of Hsinchu City TW for mediatek inc., Lei CHEN of Hsinchu City TW for mediatek inc.
IPC Code(s): G06F3/06
CPC Code(s): G06F3/0656
Abstract: a computer vision processing system is provided. the system includes one or more target devices and a processing unit. the target devices are configured to run the executable code of an image processing pipeline. the processing unit is configured to receive a series of application programming interface (api) calls and create a raw graph accordingly, redraw the raw graph into a compilable graph by sequentially processing each node, and compile the compilable graph into the executable code of the image processing pipeline. the series of api calls includes at least one tiling api call to set at least one of the nodes and at least one of the data objects as tileable. each tileable node corresponds to multiple parallel processing nodes in multiple branches in the compilable graph, and each tileable data object corresponds to multiple tile data objects in the branches in the compilable graph.
Inventor(s): Chieh-Fang TENG of Hsinchu TW for mediatek inc., En-Jui CHANG of Hsinchu TW for mediatek inc., Chih Chung CHENG of Hsinchu TW for mediatek inc.
IPC Code(s): G06N3/063
CPC Code(s): G06N3/063
Abstract: a method can include determining which computing units in a computing-in-memory (cim) macro are to be turned off, the cim macro including an array of the computing units with x rows and y columns, the x rows of computing units being organized into n row-groups, each row-group including multiple rows of computing units, the y columns of computing units being organized into m column-groups, each column-group including multiple columns of computing units, based on the determination of which computing units in the cim macro are to be turned off, turning off at least one row-group or column-group of computing units, each row-group and column-group of computing units being separately controllable to be turned off, and performing a computation based on kernel weights and activations of a neural network stored in the active computing units in the cim macro that are not turned off.
20250112108. SEMICONDUCTOR PACKAGE STRUCTURE_simplified_abstract_(mediatek inc.)
Inventor(s): Tai-Hao PENG of Hsinchu City TW for mediatek inc., Yao-Tsung HUANG of Hsinchu City TW for mediatek inc.
IPC Code(s): H01L23/367, H01L23/00, H01L23/498
CPC Code(s): H01L23/3672
Abstract: a semiconductor package structure includes a package substrate and a semiconductor die. the package substrate includes a core structure, a heat sink, and a redistribution layer. the heat sink is embedded in the core structure. the redistribution layer includes a thermal via disposed over the heat sink. the semiconductor die is disposed over the package substrate and is thermally coupled to the heat sink through the thermal via.
20250112166. FLIP CHIP PACKAGE AND FABRICATION METHOD THEREOF_simplified_abstract_(mediatek inc.)
Inventor(s): Pei-Haw Tsao of Hsinchu City TW for mediatek inc., Te-Chi Wong of Hsinchu City TW for mediatek inc.
IPC Code(s): H01L23/538, H01L23/00, H01L23/14, H01L23/31, H01L25/00, H01L25/18, H10B80/00
CPC Code(s): H01L23/5386
Abstract: a flip-chip package includes a substrate having a bond pad in a die-mounting area of the substrate. a dram die is mounted on the die-mounting area of the substrate in a flip chip fashion. the dram die includes an input/output (i/o) pad on its active surface and the i/o pad is electrically coupled to the t bond pad through a connecting element. the bond pad has a diameter that is smaller than a diameter of the i/o pad. a soc die is mounted on the substrate in a flip chip fashion. the dram die and the soc die are mounted on the substrate in a side-by-side manner.
20250112197. WIREBOND MULTICHIP PACKAGE_simplified_abstract_(mediatek inc.)
Inventor(s): Yu-Liang Hsiao of Hsinchu City TW for mediatek inc., Ming-Hsien Chou of Hsinchu City TW for mediatek inc.
IPC Code(s): H01L23/00, H01L23/31, H01L23/538, H01L25/18, H10B80/00
CPC Code(s): H01L24/48
Abstract: a semiconductor package includes a carrier substrate comprising a first surface and a second surface opposite to the first surface. a first electronic component and a second electronic component are mounted on the first surface of the carrier substrate in a side-by-side manner. the first electronic component is provided with first data (dq) pads along a first side directly facing the second electronic component. the second electronic component is provided with second data (dq) pads along a second side in proximity to the first electronic component. the first dq pads are directly connects to the second dq pads through first bond wires.
Inventor(s): Kuo-Hao Chen of Hsinchu City TW for mediatek inc., Toru Matsuura of San Jose CA US for mediatek inc.
IPC Code(s): H04B1/44, H04B17/14
CPC Code(s): H04B1/44
Abstract: an electronic device and a method for estimating scattering parameters of a two-port network are provided. the electronic device includes a two-port network, a directional coupler, an input calibration kit placed in front of the two-port network, an output calibration kit placed behind the two-port network, and a control switch connected between the directional coupler and the two-port network. the directional coupler transmits a desired signal and receives a forward signal and a reverse signal from the two-port network. when the control switch is turned off, input calculation results are calculated according to the forward signal and the reverse signal by controlling the input calibration kit. when the control switch is turned on, output calculation results are calculated according to the forward signal and the reverse signal by controlling the output calibration kit. the scattering parameters are estimated according to the input calculation results and the output calculation results.
20250112714. DIGITAL SIGNAL PROCESSING SYSTEM AND METHOD THEREOF_simplified_abstract_(mediatek inc.)
Inventor(s): Yang-Ting YEH of Hsinchu City TW for mediatek inc., Ping-Tsai TSAI of Hsinchu City TW for mediatek inc.
IPC Code(s): H04B17/309, H04B17/20
CPC Code(s): H04B17/309
Abstract: a digital signal processing system is provided. the system includes a signal-receiver unit, a signal-generation unit, a tracking unit, and a period-adjustment unit. the signal-receiver unit is configured to receive a transmission signal sequence that includes the first transmission signal and the second transmission signal. the signal-generation unit is configured to generate a processing signal sequence that includes the first processing signal and the second processing signal next to the first processing signal. the tracking unit is configured to keep track of the first arrival time of the first transmission signal. the period-adjustment unit is configured to adjust the duration of the second period based on the first arrival time and the first ideal interval with a specified duration in the first period of the first processing signal, and cause the signal-generation unit to generate the second processing signal with the second period.
Inventor(s): Chien-Chun CHENG of Hsinchu City TW for mediatek inc.
IPC Code(s): H04B17/327, H04L5/00, H04W74/0833
CPC Code(s): H04B17/327
Abstract: various solutions for using on-demand reference signal (rs) or system information block (sib) for network energy saving with respect to user equipment and network apparatus in mobile communications are described. an apparatus may determine whether to trigger an on-demand rs/sib or sib request according to a trigger condition. the apparatus may transmit the on-demand rs/sib or sib request to a network node in an event that the trigger condition is satisfied. the apparatus may receive a response of the on-demand rs/sib or sib request from the network node. the apparatus may perform an on-demand rs/sib or sib measurement according to the response.
20250112732. FRAME NUMBER OFFSET FOR POSITIONING OF A REMOTE UE_simplified_abstract_(mediatek inc.)
Inventor(s): Nathan Edward TENNY of San Jose CA US for mediatek inc., Xuelong WANG of Beijing CN for mediatek inc., Tao CHEN of Beijing CN for mediatek inc., Chiao-Yao CHUANG of Hsinchu City TW for mediatek inc.
IPC Code(s): H04L1/1607, H04W56/00, H04W72/25, H04W76/20, H04W92/18
CPC Code(s): H04L1/1642
Abstract: a method can include receiving a system frame number (sfn) from a base station by a first relay ue, determining a timeline of the sfn based on one or more synchronization signals by the first relay ue, determining a timeline of a direct frame number (dfn) based on a reference time source by the first relay ue, computing an sfn-dfn offset based on the difference between the timeline of the sfn and the timeline of the dfn by the first relay ue, and transmitting the sfn-dfn offset and the dfn to a receiving ue on a sidelink interface.
Inventor(s): Tzu-Der CHUANG of Hsinchu City TW for mediatek inc., Ching-Yeh CHEN of Hsinchu City TW for mediatek inc., Chih-Wei HSU of Hsinchu City TW for mediatek inc.
IPC Code(s): H04N19/119, H04N19/105, H04N19/139, H04N19/176, H04N19/70
CPC Code(s): H04N19/119
Abstract: a method and apparatus for video coding are disclosed for the encoder side and the decoder side. according to the method for the decoder side, encoded data associated with a current block is received. a pseudo gpm in a target gpm group for the current block is determined. the current block is divided into one or more subblocks. assigned mvs (motion vectors) of each subblock are determined according to the pseudo gpm. a cost for each gpm in the target gpm group is determined according to decoded data. a selected gpm is determined based on a mode syntax and a reordered target gpm group corresponding to the target gpm group reordered according to the costs, wherein the pseudo gpm is allowed to be different from the selected gpm. the encoded data is decoded using information comprising the selected gpm.
20250113108. IMAGE ADJUSTMENT METHOD AND IMAGE SENSING SYSTEM_simplified_abstract_(mediatek inc.)
Inventor(s): Jan-Wei Wang of Hsinchu City TW for mediatek inc., Huei-Han Jhuang of Hsinchu City TW for mediatek inc., Po-Yu Huang of Hsinchu City TW for mediatek inc., Ying-Jui Chen of Hsinchu City TW for mediatek inc., Chi-Cheng Ju of Hsinchu City TW for mediatek inc.
IPC Code(s): H04N23/76, G06T5/00, G06T7/11, G06T7/246, G06T7/73, H04N23/68, H04N23/745
CPC Code(s): H04N23/76
Abstract: an image adjustment method, applied to an image sensing system comprising an image sensor, comprising: (a) sensing a target image by the image sensor; (b) dividing the target image to a plurality of image regions; (c) acquiring location information of at least one first target feature in the image regions; (d) computing brightness information of each of the image regions; (e) generating adjustment curves according to the brightness information and according to required brightness values of each of the image regions; and (f) adjusting brightness values of the image regions according to the adjustment curves. the step (d) adjusts the brightness information according to the location information or the step (e) adjusts the adjustment curves according to the location information.
Inventor(s): Yi-Ru Chen of Hsinchu City TW for mediatek inc., Cheng-Rung Tsai of Hsinchu City TW for mediatek inc.
IPC Code(s): H04W16/28, H04B7/06, H04W72/231, H04W76/20
CPC Code(s): H04W16/28
Abstract: various solutions for beam management with respect to user equipment and network node in mobile communications are described. an apparatus may measure at least one reference signal from a network node. the apparatus may transmit a beam report to the network node. the beam report may indicate at least one beam which has been synchronized by the apparatus. the beam report may comprise a reporting order to determine at least one codepoint of a transmission configuration indicator (tci) field.
Inventor(s): Yi-Ru Chen of Hsinchu City TW for mediatek inc., Cheng-Rung Tsai of Hsinchu City TW for mediatek inc.
IPC Code(s): H04W16/28, H04W24/10, H04W72/232
CPC Code(s): H04W16/28
Abstract: various solutions for response of beam reporting with respect to user equipment and network node in mobile communications are described. an apparatus may transmit a report indicating at least one beam to a network node. the apparatus may receive a downlink control information (dci) indicating an indicator from the network node within an effective duration corresponding to the report. the apparatus may determine whether the report is received or confirmed by the network node according to the indicator. the apparatus may perform a beam switching or a beam synchronization based on the at least one beam indicated in the report if the report is received or confirmed by the network node.
Inventor(s): Chien-Chun CHENG of Hsinchu City TW for mediatek inc., Wei-De WU of Hsinchu City TW for mediatek inc., Yi-Ju LIAO of Hsinchu City TW for mediatek inc., Cheng-Hsun LI of Hsinchu City TW for mediatek inc.
IPC Code(s): H04W52/02, H04W74/0833
CPC Code(s): H04W52/0216
Abstract: various solutions for wake-up signal (wus) transmission based on timing information with respect to user equipment and network apparatus in mobile communications are described. an apparatus may receive a system information and a timing information for waking up a non-anchor cell from an anchor cell. the apparatus may transmit a wus based on the system information and the timing information to wake up the non-anchor cell. the anchor cell comprises a cell where the apparatus is capable of receiving the system information and the timing information and performing a timing and frequency synchronization. the non-anchor cell comprises a cell where the apparatus cannot receive the system information and the timing information.
- MEDIATEK INC.
- G05F1/46
- G06F1/3296
- CPC G05F1/468
- Mediatek inc.
- G06F3/06
- CPC G06F3/0656
- G06N3/063
- CPC G06N3/063
- H01L23/367
- H01L23/00
- H01L23/498
- CPC H01L23/3672
- H01L23/538
- H01L23/14
- H01L23/31
- H01L25/00
- H01L25/18
- H10B80/00
- CPC H01L23/5386
- CPC H01L24/48
- H04B1/44
- H04B17/14
- CPC H04B1/44
- H04B17/309
- H04B17/20
- CPC H04B17/309
- H04B17/327
- H04L5/00
- H04W74/0833
- CPC H04B17/327
- H04L1/1607
- H04W56/00
- H04W72/25
- H04W76/20
- H04W92/18
- CPC H04L1/1642
- H04N19/119
- H04N19/105
- H04N19/139
- H04N19/176
- H04N19/70
- CPC H04N19/119
- H04N23/76
- G06T5/00
- G06T7/11
- G06T7/246
- G06T7/73
- H04N23/68
- H04N23/745
- CPC H04N23/76
- H04W16/28
- H04B7/06
- H04W72/231
- CPC H04W16/28
- H04W24/10
- H04W72/232
- H04W52/02
- CPC H04W52/0216
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