Samsung electronics co., ltd. (20250014957). SEMICONDUCTOR PACKAGE HAVING INCREASED RELIABILITY
SEMICONDUCTOR PACKAGE HAVING INCREASED RELIABILITY
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SEMICONDUCTOR PACKAGE HAVING INCREASED RELIABILITY
This abstract first appeared for US patent application 20250014957 titled 'SEMICONDUCTOR PACKAGE HAVING INCREASED RELIABILITY
Original Abstract Submitted
a semiconductor package includes: a first redistribution structure including a first redistribution pattern and a first redistribution insulating layer at least partially surrounding the first redistribution pattern; a first semiconductor chip disposed on the first redistribution structure; a first molding member at least partially surrounding the first semiconductor chip and the first redistribution structure; a conductive pillar passing through the first molding member; a second redistribution structure disposed on the first molding member and including a second redistribution pattern and a second redistribution insulating layer at least partially surrounding the second redistribution pattern; a second semiconductor chip disposed on the second redistribution structure; and a second molding member at least partially surrounding the second semiconductor chip and the second redistribution structure.
